CN208293098U - The high speed electrodeposition device of selective meter's surface treatment - Google Patents
The high speed electrodeposition device of selective meter's surface treatment Download PDFInfo
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- CN208293098U CN208293098U CN201820724024.5U CN201820724024U CN208293098U CN 208293098 U CN208293098 U CN 208293098U CN 201820724024 U CN201820724024 U CN 201820724024U CN 208293098 U CN208293098 U CN 208293098U
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- high speed
- electroplated
- pilot trench
- surface treatment
- speed electrodeposition
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Abstract
The utility model provides a kind of high speed electrodeposition device of selective meter's surface treatment, including pilot trench and female groove, electrode unit, baffle device for water and positioning device are equipped in the pilot trench, the baffle device for water is fixed by the pilot trench, the baffle device for water is equipped at least one opening, the positioning device is set to the position of the top of the baffle device for water and fixed part to be electroplated, and in plating, the electroplate liquid of the female groove is defeated incessantly.The utility model can treat electroplated product and carry out selective meter's surface treatment, high treating effect, and save processing cost.
Description
Technical field
The utility model relates to a kind of a kind of high speed electrodeposition of electroplating technology more particularly to selective meter's surface treatment dresses
It sets.
Background technique
This part intends to provides for the utility model embodiment stated in claim and its in specific embodiment
Background or context, the content of description herein recognize it is the prior art not because not being included in this part.
Plating is exactly to plate the process of the other metal or alloy of a thin layer on certain metal surfaces using electrolysis principle, is
The technique of the surface of metal or other materials product attachment layer of metal film is set to prevent metal oxygen to play using electrolysis
The effects of changing (as corroded), improving wearability, electric conductivity, reflective, corrosion resistance (copper sulphate etc.) and having improved aesthetic appearance.
When plating, coating or other insoluble materials do anode, and workpiece to be plated does cathode, and the cation of coated metal exists
Workpiece surface to be plated is reduced to form coating.To exclude the interference of other cations, and make coating uniformly, securely, it need to be with containing plating
The electroplate liquid of layer metal cation is cooked electroplate liquid, to keep the concentration of coated metal cation constant.The purpose of plating is in base
The coat of metal is plated on material, changes substrate surface property or size.
Traditional electroplating device is when treating electroplated product plating, functional areas and the non-NOT function that need to be electroplated that product need to be electroplated
Energy area is all handled, and electroplating time is long, and big, the electric usage amount of electroplate liquid usage amount is also big, at high cost, waste of resource, is consumed energy high, is given up
Water is more, not environmentally.
Utility model content
In consideration of it, it is necessary to provide a kind of high speed electrodeposition device of selective meter's surface treatment, can treat electroplated product into
Row selective meter's surface treatment, high treating effect, and save processing cost.
The utility model provides a kind of high speed electrodeposition device of selective meter's surface treatment, including pilot trench and female groove, described
Electrode unit, baffle device for water and positioning device are equipped in pilot trench, the baffle device for water is fixed by the pilot trench, the water blocking
For device equipped at least one opening, the positioning device is set to the position of the top of the baffle device for water and fixed part to be electroplated,
When plating, the electroplate liquid of the female groove, which is delivered in the pilot trench incessantly and controls liquid level, to be reached needed for the part to be electroplated
Preset height.
Further, the positioning device includes support jig and pressing jig, and the support jig is supported and kept
The bottom level of the part to be electroplated, the pressing jig compress and keep the top horizontal of the part to be electroplated.
Further, the high speed electrodeposition device includes adjustment mechanism, can adjust the branch by the adjustment mechanism
Support the height of jig and/or the pressing jig.
Further, the anode of the electrode unit is set to the lower section of the support jig, the cathode of the electrode unit
Compress the top of the part to be electroplated.
Further, the high speed electrodeposition device further includes liquid level control device, the liquid level control device
It at least can be used in for the electroplate liquid of the female groove being delivered in the pilot trench from the bottom of the pilot trench incessantly.
Further, the liquid level control device is also used to the electroplate liquid in the pilot trench being delivered to the female groove
In.
Further, support plate is equipped in the female groove, the pilot trench is supported by the support plate and is housed in described
In female groove.
Further, the high speed electrodeposition device further includes the shield mould to match with the part to be electroplated, the masking
Mold shields the electroless coating area of the part to be electroplated.
Compared to the prior art, the utility model has the beneficial effects that the utility model is in plating, the electroplate liquid of female groove is
It is dynamically transported in pilot trench, according to the required electroplating site of product to be electroplated, controls liquid level and reach preset height, therefore
Can it is below for liquid level, need the functional areas that are electroplated to be electroplated, moreover, being equipped with baffle device for water in pilot trench, pass through water blocking
Device can control the flow rate of electroplate liquid, when guaranteeing that electroplate liquid reaches preset height, keep the steady of liquid level, plating is more
To be accurate, high treating effect.
Detailed description of the invention
In order to illustrate more clearly of the utility model embodiment technical solution, will make below to required in embodiment description
Attached drawing is briefly described, it should be appreciated that the accompanying drawings in the following description is some embodiments of the utility model, right
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings
His attached drawing.
Fig. 1 is the structural schematic diagram of the high speed electrodeposition device of selective meter's surface treatment of an embodiment of the utility model.
The following detailed description will be further explained with reference to the above drawings the utility model.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment is obtained, the protection scope of the utility model is belonged to.It is understood that attached drawing is provided solely for referring to
With illustrate to use, not be used to the utility model is limited.The connection relationship shown in attached drawing is intended merely to facilitate clearly
Description, does not limit connection type.
It should be noted that it can be directly to when a component is considered as " connection " another component
Another component, or may be simultaneously present component placed in the middle.Unless otherwise defined, all technology and science used herein
Term has the same meaning as commonly understood by one of ordinary skill in the art to which the utility model belongs.It should also be noted that, removing
Non- separately to have specific regulation and limit, term " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be fixed connect
It connects, may be a detachable connection, or be integrally connected；It can be mechanical connection, be also possible to be electrically connected, can be two members
Connection inside part.For the ordinary skill in the art, it can understand that above-mentioned term is practical new at this with concrete condition
Concrete meaning in type.Terminology used in the description of the utility model herein is intended merely to describe specifically to implement
The purpose of example, it is not intended that in limitation the utility model.
It should also be noted that, the utility model description in, it should be noted that term " center ", "upper", "lower",
The orientation or positional relationship of the instructions such as "left", "right", "vertical", "horizontal", "inner", "outside" be orientation based on the figure or
Positional relationship is merely for convenience of describing the present invention and simplifying the description, rather than the device or member of indication or suggestion meaning
Part must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.
In addition, term " first ", " second ", " third " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
Referring to Fig. 1, Fig. 1 is the high speed electrodeposition device of selective meter's surface treatment of an embodiment of the utility model
Structural schematic diagram.The electroplanting device 100 can be applied in the different processes of workpiece surface processing, can be used for for filter
The filter plating of plating, especially strip.
The electroplanting device 100 includes pilot trench 10 and female groove 20, and the female groove 20 is for storing electroplate liquid 30, the female groove
Electroplate liquid in 20 is delivered to incessantly in the pilot trench 10, for being electroplated for the part to be electroplated in pilot trench 10, in son
Electrode member 40 is set in slot 10, and electrode member 40 may include anode 41 and cathode 42.Electroplate liquid 30 can be according to processing
Electroplate liquid 30 needed for process selection, such as in copper plating treatment, can be used using copper plating bath in Nickel Plating Treatment
Nickel-plating liquid.
In the present embodiment, support plate 21 is set in female groove 20, and the quantity of support plate 21 can be one or one
It is two support plates 21 in present embodiment, the supporting surface of two support plates 21 is located in same level more than a；It is described
Pilot trench 10 can be supported by support plate 21 and is housed in female groove 20, and the height of the upper surface of the pilot trench 10 is lower than described
The height of the upper surface of female groove 20, the electroplanting device 100 are capable of forming integrated apparatus.
The pilot trench 10 is equipped with liquid level control device 11, and liquid level control device 11 can be set in the son
The bottom end of slot 10, the liquid level control device 11 can be the pump housing, the liquid level control device 11 can be used in by
The electroplate liquid 30 of the female groove 20 is delivered in the pilot trench 10 from the bottom of the pilot trench 10 incessantly；/ and be used for institute
It states the electroplate liquid in pilot trench 10 to be delivered in the female groove 20, can so guarantee the even concentration of the electroplate liquid in pilot trench 10,
Electroplate liquid 30 is delivered in the pilot trench 10 from the bottom of pilot trench 10, can guarantee the stability of electroplate liquid flowing, reduces plating
The fluctuation of liquid.Alternatively, notch 12 can be arranged on the side wall of pilot trench 10, notch 12 can be used as the discharge of electroplate liquid in pilot trench 10
Mouthful, it can be directly discharged into female groove 20 from pilot trench 10 by the notch 12, it is more convenient, direct, quick.
Baffle device for water 13 is equipped in the pilot trench 10, the baffle device for water 13 can enter with the electroplate liquid for being discharged into pilot trench 10
Mouth is corresponding, and the baffle device for water 13 is fixed by the pilot trench 10, and the baffle device for water 13 is equipped at least one opening 131, electricity
Plating solution can control the flow rate of electroplate liquid by the baffle device for water 13 by 131 filling pilot trench 10 of opening, protect
When card electroplate liquid reaches preset height, the steady of liquid level is kept, more accurate, high treating effect is electroplated；Pass through baffle device for water
13 can also to a certain extent, and by the electroplate liquid in pilot trench 10 and newly the electroplate liquid that is discharged into pilot trench 10 is uniformly mixed, and is guaranteed
Bath concentration in pilot trench 10 is uniform, further promotes treatment effect.
Positioning device 14 is equipped in the pilot trench 10, the upper of the baffle device for water 13 is arranged in the positioning device 14
Side, for fixing the position of part to be electroplated, in the present embodiment, the positioning device 14 may include support jig 141 with
And pressing jig 142；The support jig 141 supports the bottom end of the part to be electroplated, and keeps the bottom of the part to be electroplated
It is horizontal；The pressing jig 142 compresses the top of the part to be electroplated, and keeps the top horizontal of the part to be electroplated, can protect
The reliability of plating is demonstrate,proved, plating accuracy is improved.In the present embodiment, the cathode 42 can connect in pressing jig 142
On, allow pressing jig 142 as the mold of cathode conduction, anode 41 can be set to the lower section of the support jig.
After the position of part to be electroplated is fixed, electroplate liquid is controlled in pilot trench 10 by the liquid level control device 11
Liquid level reach preset height (wherein, electroplate liquid can not cover part to be electroplated, and the covering part that arrives), so can be to be electroplated
Part carries out selective meter's surface treatment, and the functional areas of the need plating of part to be electroplated are electroplated, and nonfunctional area can not then be electroplated, phase
It is more environmentally friendly than greatly reducing processing cost, water consumption, electricity etc. can be reduced, economized on resources for full plating.
The high speed electrodeposition device 100 can also include adjustment mechanism (not shown), and the adjustment mechanism is for adjusting institute
The position of positioning device 14 is stated, to be applicable in the positioning of the part to be electroplated of different model or type.In the present embodiment, described
Adjustment mechanism may include the first adjustment structure and second adjustment mechanism, and the first adjustment mechanism can be used for adjusting support
The height of jig 141, the second adjustment structure can be used for adjusting the height of pressing jig 142；The first adjustment mechanism
It can be screw mechanism with the second adjustment mechanism, can also be the mechanism of other adjustment heights certainly, do not limit herein
System.By the first adjustment mechanism and/or second adjustment mechanism, it is convenient to position different parts to be electroplated.
The high speed electrodeposition device 100 further includes being equipped with the shield mould (not shown) to match with the part to be electroplated, this
Utility model can design different shield moulds for different types of part to be electroplated, and shield mould can be according to the function of part to be electroplated
Energy area and nonfunctional area (i.e. electroless coating area) are correspondingly designed, and the shield mould is matched with electroless coating area, maskable
The electroless coating area of the part to be electroplated can further realize the selective meter's surface treatment for treating plated item.
In the description and claims of this application, word "comprises/comprising" and word " have/including " and its become
Shape, for the presence of specified stated feature, numerical value, step or component, but do not preclude the presence or addition of it is one or more its
His feature, numerical value, step, component or their combination.
Some features of the utility model, it is clear to illustrate, it describes in various embodiments respectively, however, these are special
Sign, which can also be incorporated into single embodiment, to be described.On the contrary, some features of the utility model, for simplicity, only single
It is described in embodiment, however, these features can also be independent or be described in different embodiments in any suitable combination.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should all be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (8)
1. a kind of high speed electrodeposition device of selective meter's surface treatment, including pilot trench and female groove, which is characterized in that in the pilot trench
Equipped with electrode unit, baffle device for water and positioning device, the baffle device for water is fixed by the pilot trench, and the baffle device for water is set
There is at least one opening, the positioning device is set to the position of the top of the baffle device for water and fixed part to be electroplated, in plating,
The electroplate liquid of the female groove, which is delivered in the pilot trench incessantly and controls liquid level, reaches default needed for the part to be electroplated
Highly.
2. the high speed electrodeposition device of selective meter's surface treatment according to claim 1, which is characterized in that the positioning device
Including support jig and pressing jig, the support jig supports and keeps the bottom level of the part to be electroplated, the pressure
Tight jig compresses and keeps the top horizontal of the part to be electroplated.
3. the high speed electrodeposition device of selective meter's surface treatment according to claim 2, which is characterized in that the high speed electrodeposition
Device includes adjustment mechanism, and the height of the support jig and/or the pressing jig can be adjusted by the adjustment mechanism.
4. the high speed electrodeposition device of selective meter's surface treatment according to claim 2, which is characterized in that the electrode unit
Anode be set to the lower section of the support jig, the cathode of the electrode unit compresses the top of the part to be electroplated.
5. the high speed electrodeposition device of selective meter's surface treatment according to claim 1, which is characterized in that the high speed electrodeposition
Device further includes liquid level control device, and the liquid level control device at least can be used in the electroplate liquid of the female groove
It is delivered in the pilot trench from the bottom of the pilot trench incessantly.
6. the high speed electrodeposition device of selective meter's surface treatment according to claim 5, which is characterized in that the liquid level
Control device is also used to for the electroplate liquid in the pilot trench being delivered in the female groove.
7. the high speed electrodeposition device of selective meter's surface treatment according to claim 1, which is characterized in that set in the female groove
There is support plate, the pilot trench is supported by the support plate and is housed in the female groove.
8. the high speed electrodeposition device of selective meter's surface treatment according to claim 1, which is characterized in that the high speed electrodeposition
Device further includes the shield mould to match with the part to be electroplated, and the shield mould shields the electroless coating of the part to be electroplated
Area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820724024.5U CN208293098U (en) | 2018-05-15 | 2018-05-15 | The high speed electrodeposition device of selective meter's surface treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820724024.5U CN208293098U (en) | 2018-05-15 | 2018-05-15 | The high speed electrodeposition device of selective meter's surface treatment |
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| Publication Number | Publication Date |
|---|---|
| CN208293098U true CN208293098U (en) | 2018-12-28 |
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| CN201820724024.5U Active CN208293098U (en) | 2018-05-15 | 2018-05-15 | The high speed electrodeposition device of selective meter's surface treatment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108754558A (en) * | 2018-05-15 | 2018-11-06 | 深圳市顺信精细化工有限公司 | The high speed electrodeposition device of selective meter's surface treatment |
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2018
- 2018-05-15 CN CN201820724024.5U patent/CN208293098U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108754558A (en) * | 2018-05-15 | 2018-11-06 | 深圳市顺信精细化工有限公司 | The high speed electrodeposition device of selective meter's surface treatment |
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