CN108754558A - The high speed electrodeposition device of selective meter's surface treatment - Google Patents
The high speed electrodeposition device of selective meter's surface treatment Download PDFInfo
- Publication number
- CN108754558A CN108754558A CN201810462452.XA CN201810462452A CN108754558A CN 108754558 A CN108754558 A CN 108754558A CN 201810462452 A CN201810462452 A CN 201810462452A CN 108754558 A CN108754558 A CN 108754558A
- Authority
- CN
- China
- Prior art keywords
- high speed
- electroplated
- pilot trench
- surface treatment
- speed electrodeposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004070 electrodeposition Methods 0.000 title claims abstract description 24
- 238000004381 surface treatment Methods 0.000 title claims abstract description 20
- 239000007788 liquid Substances 0.000 claims abstract description 50
- 238000007747 plating Methods 0.000 claims abstract description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 230000000694 effects Effects 0.000 abstract description 6
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 150000001768 cations Chemical class 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 239000002198 insoluble material Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention provides a kind of high speed electrodeposition device of selective meter's surface treatment, including pilot trench and female groove, electrode unit and positioning device are equipped in the pilot trench, the baffle device for water is fixed by the pilot trench, the baffle device for water is equipped at least one opening, the positioning device is set to the top of the baffle device for water and the position of fixed part to be electroplated, and in plating, the electroplate liquid of the female groove is defeated incessantly.The present invention can treat electroplated product and carry out selective meter's surface treatment, high treating effect, and save processing cost.
Description
Technical field
The present invention relates to a kind of electroplating technology more particularly to a kind of high speed electrodeposition devices of selective meter's surface treatment.
Background technology
This part intends to provides background for the embodiment of the present invention stated in claim and its in specific implementation mode
Or context, the content of description herein recognize it is the prior art not because not being included in this part.
Plating is exactly to plate the process of the other metal or alloy of a thin layer on certain metal surfaces using electrolysis principle, is
The technique for making the surface of metal or other materials product adhere to layer of metal film using electrolysis prevents metal oxygen to play
The effects that changing (such as corrosion), improving wearability, electric conductivity, reflective, corrosion resistance (copper sulphate etc.) and having improved aesthetic appearance.
When plating, coating or other insoluble materials do anode, and workpiece to be plated does cathode, and the cation of coated metal exists
Workpiece surface to be plated is reduced to form coating.To exclude the interference of other cations, and make coating that need to uniformly, securely use containing plating
The electroplate liquid of layer metal cation is cooked electroplate liquid, to keep the concentration of coated metal cation constant.The purpose of plating is in base
The coat of metal is plated on material, changes substrate surface property or size.
Traditional electroplating device is when treating electroplated product plating, functional areas and the non-NOT function that need to be electroplated that product need to be electroplated
Energy area is all handled, and electroplating time is long, and big, the electric usage amount of electroplate liquid usage amount is also big, of high cost, waste of resource, is consumed energy high, is given up
Water is more, not environmentally.
Invention content
In consideration of it, it is necessary to provide a kind of high speed electrodeposition device of selective meter's surface treatment, can treat electroplated product into
Row selective meter's surface treatment, high treating effect, and save processing cost.
The present invention provides a kind of high speed electrodeposition device of selective meter's surface treatment, including pilot trench and female groove, in the pilot trench
Interior to be equipped with electrode unit, baffle device for water and positioning device, the baffle device for water is fixed by the pilot trench, the baffle device for water
Equipped at least one opening, the positioning device is set to the top of the baffle device for water and the position of fixed part to be electroplated, is being electroplated
When, the electroplate liquid of the female groove is delivered in the pilot trench and controls the liquid level incessantly to be reached needed for the part to be electroplated
Preset height.
Further, the positioning device includes support jig and pressing jig, and the support jig is supported and kept
The bottom level of the part to be electroplated, the pressing jig compress and keep the top horizontal of the part to be electroplated.
Further, the high speed electrodeposition device includes adjustment mechanism, and the branch can be adjusted by the adjustment mechanism
Support the height of jig and/or the pressing jig.
Further, the anode of the electrode unit is set to the lower section of the support jig, the cathode of the electrode unit
Compress the top of the part to be electroplated.
Further, the high speed electrodeposition device further includes liquid level control device, the liquid level control device
It at least can be used in the electroplate liquid of the female groove being delivered in the pilot trench from the bottom of the pilot trench incessantly.
Further, the height of liquid level control device is additionally operable to the electroplate liquid in the pilot trench being delivered to the female groove
In.
Further, support plate is equipped in the female groove, the pilot trench is supported by the support plate and is housed in described
In female groove.
Further, the high speed electrodeposition device further includes the shield mould to match with the part to be electroplated, the masking
Mold shields the electroless coating area of the part to be electroplated.
Compared to the prior art, beneficial effects of the present invention：For the present invention in plating, the electroplate liquid of female groove is dynamically defeated
It is sent in pilot trench, according to the required electroplating site of product to be electroplated, control liquid level reaches preset height, therefore can be directed to
Liquid level is below, the functional areas being electroplated is needed to be electroplated, moreover, baffle device for water is equipped in pilot trench, it can by baffle device for water
The flow rate for controlling electroplate liquid when ensureing that electroplate liquid reaches preset height, keeps the steady of liquid level, and plating is more accurate,
High treating effect.
Description of the drawings
Technical solution in order to illustrate the embodiments of the present invention more clearly, below will be to needed in embodiment description
Attached drawing is briefly described, it should be appreciated that drawings in the following description are some embodiments of the invention, for this field
For those of ordinary skill, without creative efforts, other drawings may also be obtained based on these drawings.
Fig. 1 is the structural schematic diagram of the high speed electrodeposition device of selective meter's surface treatment of one embodiment of the invention.
Following specific implementation mode will be further illustrated the present invention in conjunction with above-mentioned attached drawing.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
The embodiment of the present invention, those of ordinary skill in the art's obtained every other reality without making creative work
Example is applied, protection scope of the present invention is belonged to.It is understood that attached drawing be provided solely for reference and description use, not be used for pair
The present invention limits.The connection relation shown in attached drawing is intended merely to facilitate clear description, does not limit connection type.
It should be noted that when a component is considered as " connection " another component, it can be directly to
Another component, or may be simultaneously present component placed in the middle.Unless otherwise defined, all technology and science used herein
Term has the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.It should also be noted that, unless another
There is specific regulation and limits, term " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be fixedly connected,
It may be a detachable connection, or be integrally connected；It can be mechanical connection, can also be electrical connection, can be two elements
Internal connection.For the ordinary skill in the art, it can understand above-mentioned term in the present invention with concrete condition
Concrete meaning.Used term is only for the purpose of describing specific embodiments in the description of the invention herein
It is not intended to limit the present invention.
It should also be noted that, description of the invention in, it should be noted that term "center", "upper", "lower", " left side ",
The orientation or positional relationship of the instructions such as " right side ", "vertical", "horizontal", "inner", "outside" is orientation based on ... shown in the drawings or position
Relationship is merely for convenience of description of the present invention and simplification of the description, and not indicating or implying the indicated device or element must have
There is specific orientation, with specific azimuth configuration and operation, therefore is not considered as limiting the invention.In addition, term " the
One ", " second ", " third " are used for description purposes only, and are not understood to indicate or imply relative importance.
Referring to Fig. 1, Fig. 1 is the structure of the high speed electrodeposition device of selective meter's surface treatment of one embodiment of the present invention
Schematic diagram.The electroplanting device 100 can be applied in the different processes of workpiece surface processing, can be used for for filter electricity
The filter plating of plating, especially strip.
The electroplanting device 100 includes pilot trench 10 and female groove 20, and the female groove 20 is for storing electroplate liquid 30, the female groove
Electroplate liquid in 20 is delivered to incessantly in the pilot trench 10, for being electroplated for the part to be electroplated in pilot trench 10, in son
Electrode member 40 is set in slot 10, and electrode member 40 may include anode 41 and cathode 42.Electroplate liquid 30 can be according to processing
Electroplate liquid 30 needed for process selection, such as in copper plating treatment, copper plating bath may be used, in Nickel Plating Treatment, may be used
Nickel-plating liquid.
In the present embodiment, support plate 21 is set in female groove 20, and the quantity of support plate 21 can be one or one
It is two support plates 21 in present embodiment, the supporting surface of two support plates 21 is located in same level more than a；It is described
Pilot trench 10 can be supported by support plate 21 and is housed in female groove 20, and the height of the upper surface of the pilot trench 10 is less than described
The height of the upper surface of female groove 20, the electroplanting device 100 can form integrated apparatus.
The pilot trench 10 is equipped with liquid level control device 11, and liquid level control device 11 can be arranged in the son
The bottom end of slot 10, the liquid level control device 11 can be the pump housings, the liquid level control device 11 can be used in by
The electroplate liquid 30 of the female groove 20 is delivered to from the bottom of the pilot trench 10 in the pilot trench 10 incessantly；/ and be used for institute
It states the electroplate liquid in pilot trench 10 to be delivered in the female groove 20, can so ensure the even concentration of the electroplate liquid in pilot trench 10,
Electroplate liquid 30 is delivered to from the bottom of pilot trench 10 in the pilot trench 10, can ensure the stability of electroplate liquid flowing, reduces plating
The fluctuation of liquid.Alternatively, notch 12 can be arranged on the side wall of pilot trench 10, notch 12 can be used as the discharge of electroplate liquid in pilot trench 10
Mouthful, it can be directly discharged into female groove 20 from pilot trench 10 by the notch 12, it is more convenient, direct, quick.
Baffle device for water 13 is equipped in the pilot trench 10, the baffle device for water 13 can enter with the electroplate liquid for being discharged into pilot trench 10
Mouth is corresponding, and the baffle device for water 13 is fixed by the pilot trench 10, and the baffle device for water 13 is equipped at least one opening 131, electricity
Plating solution can control the flow rate of electroplate liquid by 131 filling pilot trench 10 of opening by the baffle device for water 13, protect
When card electroplate liquid reaches preset height, the steady of liquid level is kept, more accurate, high treating effect is electroplated；Pass through baffle device for water
13 can also to a certain extent, by pilot trench 10 electroplate liquid and the new electroplate liquid being discharged into pilot trench 10 be uniformly mixed, ensure
Bath concentration in pilot trench 10 is uniform, further promotes treatment effect.
Positioning device 14 is equipped in the pilot trench 10, the positioning device 14 is arranged in the upper of the baffle device for water 13
Side, the position for fixing part to be electroplated, in the present embodiment, the positioning device 14 may include support jig 141 with
And pressing jig 142；The support jig 141 supports the bottom end of the part to be electroplated, and keeps the bottom of the part to be electroplated
It is horizontal；The pressing jig 142 compresses the top of the part to be electroplated, and keeps the top horizontal of the part to be electroplated, can protect
The reliability of plating is demonstrate,proved, plating accuracy is improved.In the present embodiment, the cathode 42 can be connected to pressing jig 142
On, allow pressing jig 142 as the mold of cathode conduction, anode 41 can be set to the lower section of the support jig.
After the position of part to be electroplated is fixed, electroplate liquid is controlled in pilot trench 10 by the liquid level control device 11
Liquid level reaches preset height (wherein, electroplate liquid can not cover part to be electroplated, and the covering part that arrives), so can be part to be electroplated
Selective meter's surface treatment is carried out, the functional areas of the need plating of part to be electroplated are electroplated, and nonfunctional area can not then be electroplated, and compare
For full plating, processing cost is greatly reduced, water consumption, electricity etc. can be reduced, economized on resources, it is more environmentally friendly.
The high speed electrodeposition device 100 can also include adjustment mechanism (not shown), and the adjustment mechanism is for adjusting institute
The position for stating positioning device 14, to be applicable in the positioning of the part to be electroplated of different model or type.In the present embodiment, described
Adjustment mechanism may include the first adjustment structure and second adjustment mechanism, and the first adjustment mechanism can be used for adjusting support
The height of jig 141, the second adjustment structure can be used for adjusting the height of pressing jig 142；The first adjustment mechanism
It can be screw mechanism with the second adjustment mechanism, can also be the mechanism of other adjustment heights certainly, do not limit herein
System.By the first adjustment mechanism and/or second adjustment mechanism, it is convenient to position different parts to be electroplated.
The high speed electrodeposition device 100 further includes being equipped with the shield mould (not shown) to match with the part to be electroplated, this
Invention can be that different types of part to be electroplated designs different shield moulds, and shield mould can be according to the functional areas of part to be electroplated
It is correspondingly designed with nonfunctional area (i.e. electroless coating area), the shield mould is matched with electroless coating area, maskable described
The electroless coating area of part to be electroplated can further realize the selective meter's surface treatment for treating plated item.
In the description and claims of this application, word "comprises/comprising" and word " have/including " and its become
Shape, the presence for specifying stated feature, numerical value, step or component, but do not preclude the presence or addition of it is one or more its
His feature, numerical value, step, component or combination thereof.
Some features of the present invention, it is clear to illustrate, it describes in various embodiments respectively, however, these features
It can be incorporated into described in single embodiment.On the contrary, some features of the present invention, for simplicity, only in single embodiment
Description, however, these features can also be individually or in any suitable combination described in different embodiments.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement etc. made by within refreshing and principle should all include within protection scope of the present invention.
Claims (8)
1. a kind of high speed electrodeposition device of selective meter's surface treatment, including pilot trench and female groove, which is characterized in that in the pilot trench
Equipped with electrode unit and positioning device, the baffle device for water is fixed by the pilot trench, and the baffle device for water is equipped at least one
Opening, the positioning device are set to the top of the baffle device for water and the position of fixed part to be electroplated, in plating, the female groove
Electroplate liquid be delivered to incessantly in the pilot trench and control the liquid level and reach preset height needed for the part to be electroplated.
2. the high speed electrodeposition device of selective meter's surface treatment according to claim 1, which is characterized in that the positioning device
Including support jig and pressing jig, the support jig supports and keeps the bottom level of the part to be electroplated, the pressure
Tight jig compresses and keeps the top horizontal of the part to be electroplated.
3. the high speed electrodeposition device of selective meter's surface treatment according to claim 2, which is characterized in that the high speed electrodeposition
Device includes adjustment mechanism, and the height of the support jig and/or the pressing jig can be adjusted by the adjustment mechanism.
4. the high speed electrodeposition device of selective meter's surface treatment according to claim 2, which is characterized in that the electrode unit
Anode be set to the lower section of the support jig, the cathode of the electrode unit compresses the top of the part to be electroplated.
5. the high speed electrodeposition device of selective meter's surface treatment according to claim 1, which is characterized in that the high speed electrodeposition
Device further includes liquid level control device, and the liquid level control device at least can be used in the electroplate liquid of the female groove
It is delivered in the pilot trench from the bottom of the pilot trench incessantly.
6. the high speed electrodeposition device of selective meter's surface treatment according to claim 4, which is characterized in that the height of liquid level
Control device is additionally operable to the electroplate liquid in the pilot trench being delivered in the female groove.
7. the high speed electrodeposition device of selective meter's surface treatment according to claim 1, which is characterized in that set in the female groove
There are support plate, the pilot trench to support and be housed in the female groove by the support plate.
8. the high speed electrodeposition device of selective meter's surface treatment according to claim 1, which is characterized in that the high speed electrodeposition
Device further includes the shield mould to match with the part to be electroplated, and the shield mould shields the electroless coating of the part to be electroplated
Area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810462452.XA CN108754558A (en) | 2018-05-15 | 2018-05-15 | The high speed electrodeposition device of selective meter's surface treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810462452.XA CN108754558A (en) | 2018-05-15 | 2018-05-15 | The high speed electrodeposition device of selective meter's surface treatment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108754558A true CN108754558A (en) | 2018-11-06 |
Family
ID=64007709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810462452.XA Pending CN108754558A (en) | 2018-05-15 | 2018-05-15 | The high speed electrodeposition device of selective meter's surface treatment |
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| Country | Link |
|---|---|
| CN (1) | CN108754558A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114182315A (en) * | 2022-02-14 | 2022-03-15 | 深圳市顺信精细化工有限公司 | Corrosion-resistant combined electroplated layer and electroplating method |
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|---|---|---|---|---|
| CN101550574A (en) * | 2009-05-22 | 2009-10-07 | 上海新阳半导体材料有限公司 | Selective plating device |
| US20120261254A1 (en) * | 2011-04-15 | 2012-10-18 | Reid Jonathan D | Method and apparatus for filling interconnect structures |
| CN102912410A (en) * | 2012-11-12 | 2013-02-06 | 江苏矽研半导体科技有限公司 | Liquid stopping device applied to electroplating equipment |
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| KR20160057734A (en) * | 2014-11-14 | 2016-05-24 | 최상진 | Selective plating device |
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-
2018
- 2018-05-15 CN CN201810462452.XA patent/CN108754558A/en active Pending
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| US20120261254A1 (en) * | 2011-04-15 | 2012-10-18 | Reid Jonathan D | Method and apparatus for filling interconnect structures |
| CN102912410A (en) * | 2012-11-12 | 2013-02-06 | 江苏矽研半导体科技有限公司 | Liquid stopping device applied to electroplating equipment |
| CN203578090U (en) * | 2013-10-14 | 2014-05-07 | 东莞龙冠真空科技有限公司 | Electroplating or spraying jig |
| KR20160057734A (en) * | 2014-11-14 | 2016-05-24 | 최상진 | Selective plating device |
| CN106086889A (en) * | 2016-06-28 | 2016-11-09 | 姑苏源电子（苏州）有限公司 | A kind of selection copper facing electroplating technology |
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| Title |
|---|
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114182315A (en) * | 2022-02-14 | 2022-03-15 | 深圳市顺信精细化工有限公司 | Corrosion-resistant combined electroplated layer and electroplating method |
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