CN104862769A - Electroplate liquid circulating filtration system - Google Patents

Electroplate liquid circulating filtration system Download PDF

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Publication number
CN104862769A
CN104862769A CN201510248943.0A CN201510248943A CN104862769A CN 104862769 A CN104862769 A CN 104862769A CN 201510248943 A CN201510248943 A CN 201510248943A CN 104862769 A CN104862769 A CN 104862769A
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China
Prior art keywords
plating
electroplate
inside groove
tank
control system
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Pending
Application number
CN201510248943.0A
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Chinese (zh)
Inventor
张斌珍
段俊萍
王雄师
徐苏坪
杨昕
张勇
王亮
葛少雷
寇海荣
孙玉洁
杨婧文
段亚敏
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North University of China
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North University of China
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Application filed by North University of China filed Critical North University of China
Priority to CN201510248943.0A priority Critical patent/CN104862769A/en
Publication of CN104862769A publication Critical patent/CN104862769A/en
Pending legal-status Critical Current

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Abstract

The invention provides an electroplate liquid circulating filtration system which comprises an inner electroplate tank, an outer electroplate tank, a PH value test pen, a temperature control system, an ultrasonic control system, a magnetic pump, a 100-micron-sized filter and a 10-micron-sized filter. The PH value test pen is inserted in the inner electroplate tank or the outer electroplate tank. The temperature control system and the ultrasonic control system are fixedly arranged on the outer portion of a bottom plate of the inner electroplate tank. The magnetic pump is communicated with the bottom of the outer electroplate tank, the 100-micron-sized filter is communicated with the magnetic pump, the 10-micron-sized filter is communicated with the 100-micron-sized filter, and the 10-micron-sized filter is communicated with the bottom of the inner electroplate tank. The system maintains the freshness of electroplate liquid in micro-electroplating and uniformity and stability of the performance of the electroplate liquid, a solid foundation is laid for further electroplating work, the development of the domestic UV-Liga technology based on electroplating is also promoted, and the whole industry is driven to develop better.

Description

Electroplating solution of cyclic filtering system
Technical field
The present invention relates to electroplating technology field, be specially a kind of electroplating solution of cyclic filtering system.
Background technology
UV-Liga technique is divided into photoetching, micro-electroforming, micro-ly copies three steps.Wherein micro-electroforming failure, coating may occur: grow dim or send out mist, do not work, coarse, have pit, have striped, loose, jagged, long knurl, minute hand hole, decortication, orange peel, the phenomenon such as tear stains and pinniform.Therefore, the success or not of electroforming directly determines and micro-ly copies success, and the key of the quality of electroforming solution performance electroplating technology just.Proverb is said right " three points of plating seven points are clean ", namely the cleanliness factor of electroplate liquid can talk about very tremendous influence to final electroplating effect, and traditional electroplating industry is not all considered this part of circulating filtration, or take into account and do not propose realistic plan and solve this problem.Have the electroplate liquid prepared has been electroplated onto always does not all have once filtered, and what have is then continue to use with after filter paper simple filtration one time after plating for some time.Obviously these are far from being enough for the quite high electroplating technology of purity requirements.
Summary of the invention
The object of the invention is to solve above-mentioned problems of the prior art, and a kind of electroplating solution of cyclic filtering system is provided.
The present invention is achieved through the following technical solutions:
A kind of electroplating solution of cyclic filtering system, comprises plating tank, pH value test pen, temperature controlling system, ultrasonic control system, magnetic drive pump, 100 micron filter and 10 micron filter; Wherein, plating tank is divided into plating inside groove and plating water jacket, and plating water jacket is around the outer side wall middle and upper part being fixed on plating inside groove; PH value test pen is inserted in plating inside groove or plating water jacket; Temperature controlling system and ultrasonic control system are fixed on the base plate external of plating inside groove; Magnetic drive pump is connected communicates with the bottom of plating water jacket, and 100 micron filter are connected with magnetic drive pump and communicate, and 10 micron filter are connected with 100 micron filter and communicate, and 10 micron filter are connected with the bottom of electroplating inside groove and communicate.
Further, the notch of notch higher than plating inside groove of water jacket is electroplated.Plating inside groove and plating water jacket adopt spray fluorine stainless material to be made.The integral outer of temperature controlling system and ultrasonic control system is set with Vibration Box, and Vibration Box adopts spray fluorine stainless material to be made.
After technique starts, temperature controlling system, ultrasonic control system, magnetic drive pump start simultaneously, electroplate liquid in plating water jacket is pressed into 100 micron filter by magnetic drive pump, then through 10 micron filter, filtered clean electroplate liquid enters plating inside groove again bottom plating inside groove, plating water jacket is entered after plating inside groove electroplate liquid overflows, so, move in circles, until technique terminates, as shown in Figure 1, arrow wherein represents solution circulated path.For messy electroplate liquid, please change filter element in time.
Plating tank cell body adopts spray fluorine stainless material, ensure that stability and the erosion resistance of the structure of plating tank; PH value test pen is tested at any time to facilitate and controls the pH value of electroplate liquid; Temperature controlling system, for monitoring and controlling the temperature of electroplate liquid in plating tank, can be heated and can freeze; The ultrasonic frequency of ultrasonic control system is 80KHZ, and power is 450W to the maximum, the stable homogeneous of electroplate liquid composition and the ability that strengthens the plating of micro-structure especially micron scale construction when being ensured to electroplate; 10 micron filter and 100 micron filter form two-layer filter system, one is prevent large granular impurity from directly blocking 10 micron filter, be to make electroplate liquid cleaner again, be then the reduction of the replacing number of times of 10 micron filter in addition, thus saved cost; The piping material connected between each device adopts corrosion-resistant PP tubing, and strainer and magnetic drive pump also adopt corrosion resistant material.Last outfit on this plating tank sprays fluorine copper electrode, or with the corrosion phenomenon avoiding electrode to be placed in electroplate liquid malaria.
Present system design science, Stability Analysis of Structures, corrosion-resistant good, the basis that ensure that electroplate liquid cleaning also makes the character stable homogeneous more of electroplate liquid, the temperature of setting up in this system, ultrasonic control system not only make its performance in microplating be better than other electroplating systems, especially for the microstructure of high aspect ratio.Present system maintains the fresh and maintenance electroplate liquid performance stable homogeneous of electroplate liquid in microplating, solid basis has been descended for further electroplating work pads, also accelerate this development based on electroplating technology of domestic picture UV-Liga simultaneously, and then drive whole industry better to develop.
Accompanying drawing explanation
Fig. 1 is the structural representation of present system.
In figure: 1-PH value test pen, 2-temperature controlling system, 3-ultrasonic control system, 4-magnetic drive pump, 5-100 micron filter, 6-10 micron filter, 7-electroplate inside groove, 8-electroplates water jacket, 9-Vibration Box.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described:
As shown in Figure 1, a kind of electroplating solution of cyclic filtering system, comprises plating tank, pH value test pen 1, temperature controlling system 2, ultrasonic control system 3, magnetic drive pump 4,100 micron filter 5 and 10 micron filter 6; Wherein, plating tank is divided into plating inside groove 7 and plating water jacket 8, and plating water jacket 8 is around the outer side wall middle and upper part being fixed on plating inside groove 7; PH value test pen 1 is inserted in plating inside groove 7 or plating water jacket 8; Temperature controlling system 2 and ultrasonic control system 3 are fixed on the base plate external of plating inside groove 7; Magnetic drive pump 4 is connected communicates with the bottom of plating water jacket 8, and 100 micron filter 5 are connected with magnetic drive pump 4 and communicate, and 10 micron filter 6 are connected with 100 micron filter 5 and communicate, and 10 micron filter 6 are connected with the bottom of electroplating inside groove 7 and communicate.
During concrete enforcement, the notch of plating water jacket 8 is higher than the notch electroplating inside groove 7; Plating inside groove 7 and plating water jacket 8 adopt spray fluorine stainless material to be made; The integral outer of temperature controlling system 2 and ultrasonic control system 3 is set with Vibration Box 9, and Vibration Box 9 adopts spray fluorine stainless material to be made.

Claims (5)

1. an electroplating solution of cyclic filtering system, comprise plating tank, it is characterized in that: also comprise pH value test pen (1), temperature controlling system (2), ultrasonic control system (3), magnetic drive pump (4), 100 micron filter (5) and 10 micron filter (6); Wherein, plating tank is divided into plating inside groove (7) and plating water jacket (8), and plating water jacket (8) is around the outer side wall middle and upper part being fixed on plating inside groove (7); PH value test pen (1) is inserted in plating inside groove (7) or plating water jacket (8); Temperature controlling system (2) and ultrasonic control system (3) are fixed on the base plate external of plating inside groove (7); Magnetic drive pump (4) is connected communicates with the bottom of plating water jacket (8), 100 micron filter (5) are connected with magnetic drive pump (4) and communicate, 10 micron filter (6) are connected with 100 micron filter (5) and communicate, and 10 micron filter (6) are connected with the bottom of plating inside groove (7) and communicate.
2. electroplating solution of cyclic filtering system according to claim 1, is characterized in that: the notch of plating water jacket (8) is higher than the notch electroplating inside groove (7).
3. electroplating solution of cyclic filtering system according to claim 1 and 2, is characterized in that: plating inside groove (7) and plating water jacket (8) adopt spray fluorine stainless material to be made.
4. electroplating solution of cyclic filtering system according to claim 1 and 2, is characterized in that: the integral outer of temperature controlling system (2) and ultrasonic control system (3) is set with Vibration Box (9), and Vibration Box (9) adopts spray fluorine stainless material to be made.
5. electroplating solution of cyclic filtering system according to claim 3, is characterized in that: the integral outer of temperature controlling system (2) and ultrasonic control system (3) is set with Vibration Box (9), and Vibration Box (9) adopts spray fluorine stainless material to be made.
CN201510248943.0A 2015-05-16 2015-05-16 Electroplate liquid circulating filtration system Pending CN104862769A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510248943.0A CN104862769A (en) 2015-05-16 2015-05-16 Electroplate liquid circulating filtration system

Publications (1)

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CN104862769A true CN104862769A (en) 2015-08-26

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107119303A (en) * 2017-05-15 2017-09-01 西华大学 Device for removing micro-arc oxidation tank liquid sediment in real time
CN108914158A (en) * 2018-07-27 2018-11-30 珠海市万顺睿通科技有限公司 A kind of method and device thereof recycling lead from battery waste
CN113832528A (en) * 2021-10-22 2021-12-24 合肥新汇成微电子股份有限公司 Can wash gold lug electroplating system of plating solution fast

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CN101397690A (en) * 2007-09-24 2009-04-01 长江润发集团有限公司 Double cathode electrolytic tank on roll bending galvanizing continuous automatic production line
CN101550574A (en) * 2009-05-22 2009-10-07 上海新阳半导体材料有限公司 Selective plating device
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CN102162117A (en) * 2011-03-24 2011-08-24 苏州市职业大学 Deposition process for improving compound quantity of nanoparticles in electric deposition
CN102424992A (en) * 2011-12-07 2012-04-25 南京航空航天大学 Rotor crack-proof chromium electroforming equipment and method
CN202786471U (en) * 2012-08-01 2013-03-13 无锡尤斯威科石油钻具有限公司 Child-mother plating tank for plating push-type slender shaft
CN202925129U (en) * 2012-11-07 2013-05-08 北京有色金属研究总院 Anodizing device used for small workpiece
CN103789806A (en) * 2013-12-12 2014-05-14 深圳首创光伏有限公司 Electroplating bath
CN103952737A (en) * 2014-05-11 2014-07-30 山东建筑大学 Steel band continuous copper plating VI
CN104152977A (en) * 2014-07-31 2014-11-19 河北昊昱机电设备研究所有限公司 Full automatic electroplating production line
CN203999886U (en) * 2014-07-22 2014-12-10 湖南特力液压有限公司 Vertical electroplating bath

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1793434A (en) * 2005-12-06 2006-06-28 钢铁研究总院 Apparatus for continuous electrodepositing of metallic film and process thereof
CN101037790A (en) * 2006-03-13 2007-09-19 王红 Assembled electric plating production facility
CN101397690A (en) * 2007-09-24 2009-04-01 长江润发集团有限公司 Double cathode electrolytic tank on roll bending galvanizing continuous automatic production line
CN201165559Y (en) * 2007-12-26 2008-12-17 及成企业股份有限公司 Side overflow electroplating system
CN101550574A (en) * 2009-05-22 2009-10-07 上海新阳半导体材料有限公司 Selective plating device
CN201785544U (en) * 2010-09-01 2011-04-06 深圳市深联电路有限公司 Carbon electroplating treatment system
CN102162117A (en) * 2011-03-24 2011-08-24 苏州市职业大学 Deposition process for improving compound quantity of nanoparticles in electric deposition
CN102424992A (en) * 2011-12-07 2012-04-25 南京航空航天大学 Rotor crack-proof chromium electroforming equipment and method
CN202786471U (en) * 2012-08-01 2013-03-13 无锡尤斯威科石油钻具有限公司 Child-mother plating tank for plating push-type slender shaft
CN202925129U (en) * 2012-11-07 2013-05-08 北京有色金属研究总院 Anodizing device used for small workpiece
CN103789806A (en) * 2013-12-12 2014-05-14 深圳首创光伏有限公司 Electroplating bath
CN103952737A (en) * 2014-05-11 2014-07-30 山东建筑大学 Steel band continuous copper plating VI
CN203999886U (en) * 2014-07-22 2014-12-10 湖南特力液压有限公司 Vertical electroplating bath
CN104152977A (en) * 2014-07-31 2014-11-19 河北昊昱机电设备研究所有限公司 Full automatic electroplating production line

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107119303A (en) * 2017-05-15 2017-09-01 西华大学 Device for removing micro-arc oxidation tank liquid sediment in real time
CN107119303B (en) * 2017-05-15 2019-07-09 西华大学 Device for removing micro-arc oxidation tank liquid sediment in real time
CN108914158A (en) * 2018-07-27 2018-11-30 珠海市万顺睿通科技有限公司 A kind of method and device thereof recycling lead from battery waste
CN108914158B (en) * 2018-07-27 2019-09-24 湖南省金翼有色金属综合回收有限公司 A kind of method and device thereof recycling lead from battery waste
CN113832528A (en) * 2021-10-22 2021-12-24 合肥新汇成微电子股份有限公司 Can wash gold lug electroplating system of plating solution fast

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Application publication date: 20150826

RJ01 Rejection of invention patent application after publication