CN113832528A - Can wash gold lug electroplating system of plating solution fast - Google Patents
Can wash gold lug electroplating system of plating solution fast Download PDFInfo
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- CN113832528A CN113832528A CN202111229796.4A CN202111229796A CN113832528A CN 113832528 A CN113832528 A CN 113832528A CN 202111229796 A CN202111229796 A CN 202111229796A CN 113832528 A CN113832528 A CN 113832528A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/08—Rinsing
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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Abstract
The invention provides a gold bump electroplating system capable of quickly cleaning electroplating solution. The gold bump electroplating system capable of rapidly cleaning electroplating solution comprises: the device comprises a plating bath, a PP filter element, an activated carbon filter element, ventilation equipment and a suction pump; the air breather is communicated with the activated carbon filter element through an air inlet pipe, a first valve is arranged on the air inlet pipe, and a discharge pipe is arranged on one side of the activated carbon filter element. The invention provides a gold bump electroplating system capable of quickly cleaning electroplating solution, which is provided with an electroplating system, and has the functions of automatic circulation filtration, automatic cleaning filtration and automatic backflow of the electroplating solution besides the basic electroplating function.
Description
Technical Field
The invention relates to the field of gold bump electroplating, in particular to a gold bump electroplating system capable of quickly cleaning electroplating solution.
Background
Chips are a general term for semiconductor device products, and are a way of miniaturizing circuits in electronics, and are often manufactured on the surface of a semiconductor wafer, and integrated circuits in which circuits are manufactured on the surface of a semiconductor chip are also called thin film integrated circuits, and thick film integrated circuits are miniaturized circuits formed by integrating a separate semiconductor device and a passive component into a substrate or a wiring board.
In the semiconductor package manufacturing industry, the gold bump manufacturing process is widely used for packaging of a liquid crystal panel driving chip, and in the conventional process, gold electroplating operation is required for preparing the gold bump, and in an electroplating bath, a platinum titanium mesh is usually used as an anode, a wafer is used as a cathode, and after electrification, a gold plating layer is formed on the outer portion of the wafer.
In the correlation technique, when electroplating, partial photoresistance dissolves in the plating solution, if the organic matter content in the plating solution is too high then probably arouse scorching or the cave is unusual, so need regularly carry out active carbon filtration washing to the plating solution, however, filter the completion back with the plating solution at the active carbon filter core, need artifical manual derivation pipe valve on it that will open, and use the container to collect the plating solution that inside filtration was accomplished, then pour into the plating bath once more, make plating solution recycle process need too much manual operation, and probably lead to the plating solution to be extravagant in operation process, the while spends time longer, it is inconvenient inadequately to operate, whole plating solution filters cleaning process efficiency is lower.
Therefore, it is desirable to provide a gold bump electroplating system capable of rapidly cleaning the electroplating solution to solve the above problems.
Disclosure of Invention
The invention provides a gold bump electroplating system capable of quickly cleaning electroplating solution, which solves the problems that the gold bump electroplating system spends longer time and is inconvenient to operate when the electroplating solution is filtered.
In order to solve the above technical problems, the present invention provides a gold bump plating system capable of rapidly cleaning plating solution, comprising:
the device comprises a plating bath, a PP filter element, an activated carbon filter element, ventilation equipment and a suction pump;
the aeration equipment is communicated with the activated carbon filter element through an air inlet pipe, a first valve is arranged on the air inlet pipe, a discharge pipe is arranged on one side of the activated carbon filter element, and a second valve is arranged on the discharge pipe;
the plating bath outer tank with the active carbon filter core passes through the drain pipe intercommunication, be provided with the third valve on the drain pipe, just the aspiration pump with the drain pipe is connected, the plating bath inside groove with the PP filter core passes through feed liquor pipe intercommunication, the outside of drain pipe with the PP filter core passes through the connecting pipe and connects, be provided with the fourth valve on the connecting pipe, the connecting pipe outside with the active carbon filter core passes through the delivery tube and connects, be provided with the fifth valve on the delivery tube.
Preferably, the anode in the electroplating bath is a wafer, the cathode is a platinum titanium mesh, and the electroplating bath is filled with electroplating solution.
Preferably, the air inlet pipe is used for conveying external air into the air inlet pipe, and the air enters the activated carbon filter element through the air inlet pipe.
Preferably, the activated carbon filter element is used for adsorbing and filtering organic impurities in the electroplating solution, and the delivery pipe is used for guiding out the electroplating solution after filtering treatment in the activated carbon filter element.
Preferably, the PP filter element is used for filtering granular impurities in the electroplating solution, and the liquid inlet pipe is used for conveying the electroplating solution filtered by the PP filter element to the inner groove of the electroplating bath.
Preferably, the liquid outlet pipe is used for guiding out the electroplating solution in the tank outside the electroplating tank, and the electroplating solution in the liquid outlet pipe is conveyed to the connecting pipe through the suction pump.
Preferably, the third valve, the fourth valve and the fifth valve are all provided with electronic valves, and the first valve and the second valve are both provided with manual valves.
Preferably, the bottom of the activated carbon filter element is provided with a supporting seat, a fixing structure is arranged in the supporting seat, the fixing structure comprises a threaded rotating piece, a moving block and a fixing clamping shaft, the moving block is in threaded connection with the outside of the threaded rotating piece, and the fixing clamping shaft is fixed on one side of the moving block.
Preferably, the number of the moving blocks and the number of the fixing clamp shafts are two, the two moving blocks are respectively located on the left side and the right side of the outer portion of the thread rotating piece, movable grooves are formed in two sides of the inner portion of the supporting seat, the moving blocks are located in the movable grooves, and the thread rotating piece rotates in the supporting seat.
Preferably, the bottom of supporting seat is provided with bearing structure, bearing structure includes chassis, spliced pole and supporting spring, the spliced pole is fixed in the top on chassis, supporting spring cup joint in the outside of spliced pole, the spliced pole slide in the supporting seat, the mounting groove has been seted up at the top of supporting seat, the fixed orifices has all been seted up to the both sides of active carbon filter core, the bottom joint of active carbon filter core in the mounting groove.
Compared with the related art, the gold bump electroplating system capable of rapidly cleaning electroplating solution provided by the invention has the following beneficial effects:
the invention provides a gold bump electroplating system capable of quickly cleaning electroplating solution, which has the functions of automatic circulation filtration, automatic cleaning filtration and automatic backflow of the electroplating solution besides the basic electroplating function by arranging the electroplating system, when the electroplating solution is cleaned, the suction pump and all the valves are controlled to be opened and closed without excessive manual operation of workers, after the electroplating solution is cleaned and filtered, air is introduced into the activated carbon filter element through the ventilation equipment, the residual electroplating solution in the activated carbon filter element is quickly pushed into the electroplating bath by utilizing the internal pressure, thereby realizing the rapid backflow of the electroplating solution, changing the traditional manual electroplating solution recovery mode, effectively reducing the waste of the electroplating solution, meanwhile, the cleaning operation of the electroplating solution is greatly accelerated, the working time is effectively shortened, the workload is reduced, and the use requirements of people are better met.
Drawings
FIG. 1 is a schematic diagram of a gold bump plating system capable of rapidly cleaning plating solution according to the present invention;
FIG. 2 is a schematic diagram illustrating a second embodiment of a gold bump plating system capable of rapidly cleaning a plating solution according to the present invention;
fig. 3 is a schematic structural view of the inside of the support seat shown in fig. 2.
Reference numerals in the figures
1. The method comprises the following steps of (1) electroplating bath, 2, PP filter element, 3, activated carbon filter element, 4, ventilation equipment, 5 and suction pump;
6. an air inlet pipe 7 and a first valve;
8. a discharge pipe 9, a second valve;
10. a liquid outlet pipe 11 and a third valve;
12. a liquid inlet pipe 13, a connecting pipe 14 and a fourth valve;
15. a delivery pipe 16 and a fifth valve;
17. a supporting seat;
18. a fixed structure;
181. a thread rotating piece 182, a moving block 183 and a fixed clamping shaft;
19. a movable groove;
20. a support structure;
201. a chassis 202, a connecting column 203 and a supporting spring;
21. mounting groove, 22, fixed orifices.
Detailed Description
The invention is further described with reference to the following figures and embodiments.
First embodiment
Referring to fig. 1, fig. 1 is a schematic structural diagram of a gold bump electroplating system capable of rapidly cleaning an electroplating solution according to the present invention. The gold bump electroplating system capable of rapidly cleaning electroplating solution comprises:
the device comprises an electroplating bath 1, a PP filter element 2, an activated carbon filter element 3, a ventilation device 4 and a suction pump 5;
the aeration device 4 is communicated with the activated carbon filter element 3 through an air inlet pipe 6, a first valve 7 is arranged on the air inlet pipe 6, a discharge pipe 8 is arranged on one side of the activated carbon filter element 3, and a second valve 9 is arranged on the discharge pipe 8;
1 water jacket of plating bath with active carbon filter core 3 passes through drain pipe 10 intercommunication, be provided with third valve 11 on the drain pipe 10, just the aspiration pump 5 with the drain pipe 10 is connected, 1 inside groove of plating bath with PP filter core 2 passes through feed liquor pipe 12 intercommunication, the outside of drain pipe 10 with PP filter core 2 passes through connecting pipe 13 and connects, be provided with fourth valve 14 on the connecting pipe 13, the connecting pipe 13 outside with active carbon filter core 3 passes through delivery tube 15 and connects, be provided with fifth valve 16 on the delivery tube 15.
The electroplating bath 1, a PP filter element 2, an activated carbon filter element 3, a ventilation device 4 and an absorption pump 5 are taken as main components of an electroplating system, wherein the electroplating bath 1 is divided into an inner bath and an outer bath which are taken as positions where chemical reaction occurs during electroplating, a platinum titanium mesh is taken as an anode during electroplating, a wafer, namely a chip, is taken as a cathode, the chip is hung on a hanging frame, the outer part of the chip is immersed in electroplating solution, the PP filter element 2 is used for filtering granular impurities in the electroplating solution, the electroplating solution in the outer bath of the electroplating bath 1 is led out through a liquid outlet pipe 10 during electroplating, then the electroplating solution is conveyed into a connecting pipe 13 through the absorption pump 5, finally the electroplating solution enters the PP filter element 2 through the connecting pipe 13, and after filtering is completed, the electroplating solution is conveyed into the inner bath through a liquid inlet pipe 12, so that the inner circulation flow of the electroplating solution is realized, and the electroplating solution is continuously filtered while being electroplated, the granular impurities generated in the electroplating solution are filtered completely, the electroplating solution is purified, the electroplating solution is always kept in a relatively pure state, the electroplating solution cannot be influenced during electroplating, the electroplating operation can be finished for a long time, manual timing filtering treatment is omitted, certain time is saved, the working efficiency is further improved, the ventilating device 4 can be a blower, a fan and other mechanical devices which can quickly drive external air to flow, the external air can be quickly led into the air inlet pipe 6, when the electroplating solution filtered inside the activated carbon filter core needs to be detected, the internal electroplating solution can be led out by opening a valve on the discharge pipe 8, then the electroplating solution is collected by using a container, the electroplating solution is detected again, whether the electroplating solution is cleaned or not is judged, people can conveniently know the cleaning condition of the electroplating solution actually, and when the electroplating is normally carried out, the first valve 7, the second valve 9 and the third valve 11 are closed, the fourth valve 14 is opened, the activated carbon filter element 3 does not participate in the circulation of the electroplating solution, the organic impurities in the electroplating solution of the activated carbon filter element 3 are adsorbed and filtered, the operation of cleaning the electroplating solution is completed, when the electroplating solution needs to be cleaned and filtered, the third valve 11 and the fifth valve 16 are opened, the fourth valve 14 is closed, the electroplating solution in the outer tank of the electroplating tank 1 is conveyed into the activated carbon filter element 3 through the liquid outlet pipe 10 under the action of the suction pump 5, the electroplating solution is filtered through the activated carbon filter element 3, the organic impurities such as photoresistance dissolved in the electroplating solution are filtered, the filtered electroplating solution enters the PP filter element 2 through the liquid outlet pipe 15, the particle impurities in the PP filter element are filtered, the electroplating solution is further filtered, the filtered electroplating solution passes through the liquid inlet pipe 12, finally flows into the inner groove of the electroplating bath 1 to complete the cleaning and circulating flow of the electroplating solution until the electroplating solution is completely cleaned, at the moment, the suction pump 5 and the third valve 11 are closed, the first valve 7 and the ventilation equipment 4 are opened, so that the external air quickly enters the air inlet pipe 6, the air pressure inside the activated carbon filter element 3 is increased, and then the residual electroplating solution inside the activated carbon filter element 3 is extruded, so that the electroplating solution quickly flows back into the electroplating bath 1 through the inlet pipe 15 and the PP filter element 2, after 3-5 minutes, the ventilation equipment 4 and the first valve 7 are closed, and at the moment, the residual electroplating solution inside the activated carbon filter element 3 and the outlet pipe 15 flows back into the electroplating bath 1, so that the electroplating solution 1 quickly flows back Automatic backward flow function, when wasing the plating solution, only need control the aspiration pump 5, and each valve open close can, need not the staff and carry out too much manual operation, after wasing the filtering to the plating solution, let in the air to 3 inside active carbon filter cores through aeration equipment 4, utilize inside pressure to remain the plating solution with inside and promote to plating bath 1 fast, and then realize the quick backward flow of plating solution, traditional artifical manual recovery plating solution mode has been changed, and the waste of effectual reduction plating solution, the washing operation to the plating solution has been accelerated greatly simultaneously, the effectual operating time that shortens, reduce work load, better satisfy people's user demand.
The anode of the electroplating bath 1 is a wafer, the cathode of the electroplating bath is a platinum titanium mesh, and electroplating solution is filled in the electroplating bath 1.
The air breather 4 is used for conveying external air into the air inlet pipe 6, and the air enters the activated carbon filter element 3 through the air inlet pipe 6.
The active carbon filter element 3 is used for adsorbing and filtering organic impurities in the electroplating solution, and the leading-out pipe 15 is used for leading out the electroplating solution after filtering treatment in the active carbon filter element 3.
The PP filter element 2 is used for filtering granular impurities in electroplating solution, and the liquid inlet pipe 12 is used for conveying the electroplating solution filtered by the PP filter element 2 to the inner groove of the electroplating bath 1.
The liquid outlet pipe 10 is used for guiding out the electroplating solution in the outer tank of the electroplating tank 1, and the electroplating solution in the liquid outlet pipe 10 is conveyed to the connecting pipe 13 through the suction pump 5.
The third valve 11, the fourth valve 14 and the fifth valve 16 are all provided with electronic valves, and the first valve 7 and the second valve 9 are all provided with manual valves.
The third valve 11, the fourth valve 14 and the fifth valve 16 are automatically opened or closed by an external control panel.
The working principle of the gold bump electroplating system capable of rapidly cleaning electroplating solution provided by the invention is as follows:
when the electroplating solution needs to be cleaned and filtered, the third valve 11 and the fifth valve 16 are opened, the fourth valve 14 is closed, at this time, the electroplating solution in the outer tank of the electroplating tank 1 is conveyed into the activated carbon filter element 3 through the liquid outlet pipe 10 under the action of the suction pump 5, at this time, the electroplating solution is filtered through the activated carbon filter element 3, organic impurities such as photoresistance and the like dissolved in the electroplating solution are filtered, then the filtered electroplating solution enters the PP filter element 2 through the discharge pipe 15, particle impurities in the electroplating solution are filtered, the electroplating solution is further filtered, the filtered electroplating solution finally flows into the inner tank of the electroplating tank 1 through the liquid inlet pipe 12, the cleaning and the circulating flow of the electroplating solution are completed until the electroplating solution is completely cleaned, at this time, the suction pump 5 and the third valve 11 are closed, and the first valve 7 and the ventilation equipment 4 are opened, so that the external air quickly enters the air inlet pipe 6, at this moment, the internal air pressure of the activated carbon filter element 3 is increased, and then the internal residual electroplating solution is extruded, so that the electroplating solution finally flows back to the electroplating bath 1 through the leading-in pipe 15 and the PP filter element 2, and after 3-5 minutes, the ventilation equipment 4 and the first valve 7 are closed, and at this moment, the residual electroplating solution in the activated carbon filter element 3 and the leading-out pipe 15 flows back to the electroplating bath 1, so that the electroplating solution 1 flows back quickly.
Compared with the related art, the gold bump electroplating system capable of rapidly cleaning electroplating solution provided by the invention has the following beneficial effects:
through setting up this electroplating system, except possessing basic electroplating function, still possess and filter plating solution automatic cycle and self-cleaning, automatic backward flow function, when wasing the plating solution, only need control sucking pump 5, and each valve open and close can, need not the staff and carry out too much manual operation, after wasing the filtration to the plating solution, through aeration equipment 4 to 3 inside let in air of active carbon filter core, utilize inside pressure to remain the inside plating solution and promote to plating bath 1 fast, and then realize the quick backward flow of plating solution, traditional artifical manual recovery plating solution mode has been changed, and the waste of effectual reduction plating solution, the cleaning operation to the plating solution has been accelerated greatly simultaneously, the effectual operating time that shortens, reduce work load, better satisfy people's user demand.
Second embodiment
Referring to fig. 2 and 3, a gold bump plating system capable of rapidly cleaning plating solution according to a first embodiment of the present invention, and a second embodiment of the present invention provides another gold bump plating system capable of rapidly cleaning plating solution, wherein the second embodiment does not hinder independent implementation of the first embodiment.
Specifically, the difference between the gold bump electroplating systems provided by the invention and capable of rapidly cleaning electroplating solution is as follows:
the bottom of the activated carbon filter element 3 is provided with a support seat 17, a fixing structure 18 is arranged in the support seat 17, the fixing structure 18 comprises a thread rotating part 181, a moving block 182 and a fixing clamp shaft 183, the moving block 182 is connected to the outside of the thread rotating part 181 in a threaded manner, and the fixing clamp shaft 183 is fixed on one side of the moving block 182.
The number of the moving blocks 182 and the number of the fixing clip shafts 183 are two, the two moving blocks 182 are respectively located on the left side and the right side of the outer portion of the thread rotating member 181, the two sides of the inner portion of the supporting seat 17 are both provided with a movable groove 19, the moving blocks 182 are located in the movable grooves 19, and the thread rotating member 181 rotates in the supporting seat 17.
The supporting seat 17 mainly provides support for the activated carbon filter element 3, the fixed structure 18 enables the activated carbon filter element 3 and the supporting seat 17 to be stably connected, the thread rotating member 181 can rotate in the supporting seat 17, the right end of the thread rotating member 181 is rotatably connected with the inner surface of the movable groove 19 on the right side, the left end of the thread rotating member extends from the inside of the supporting seat 17 to the left side of the supporting seat 17 and consists of a threaded rod and a knob, the inside of the moving block 182 is provided with a threaded groove matched with the thread rotating member 181, the directions of the threads arranged on the two sides of the outer surface of the thread rotating member 181 are opposite, when the thread rotating member 181 rotates, the two moving blocks 182 simultaneously move in opposite directions under the limiting action of the movable groove 19, namely, the two moving blocks are simultaneously close to or far away from each other, the fixed clamping shaft 183 extends from the inside of the movable groove 19 to the mounting groove 21 and is clamped with the inside of the fixed hole 22, and the bottoms of the left side and the right side of the activated carbon filter element 3 can be stably mounted in the mounting groove 21 through the matched and clamped connection of the two clamping shafts, and then make active carbon filter core 3 can with supporting seat 17 remain stable connection, this fixed knot constructs 18 mainly used and fixes active carbon filter core 3, make it can stable mounting on supporting seat 17, can realize quick installation and the dismantlement between active carbon filter core 3 and the supporting seat 17 simultaneously, need maintain or when changing active carbon filter core 3, change the piece 181 through rotating the screw thread, can make movable block 182 drive fixing clamp axle 183 and fixed orifices 22 separation, active carbon filter core 3 no longer receives limiting displacement this moment, alright dismantle it from supporting seat 17, it is very convenient when using, in a flexible way, make supporting seat 17 not only can provide stable support for it, can also realize both freedom dismantlements.
The bottom of supporting seat 17 is provided with bearing structure 20, bearing structure 20 includes chassis 201, spliced pole 202 and supporting spring 203, spliced pole 202 is fixed in the top of chassis 201, supporting spring 203 cup joint in the outside of spliced pole 202, spliced pole 202 slide in supporting seat 17, mounting groove 21 has been seted up at the top of supporting seat 17, fixed orifices 22 have all been seted up to the both sides of active carbon filter core 3, the bottom joint of active carbon filter core 3 in the mounting groove 21.
Supporting structure 20 is provided with four altogether, be located the left and right sides of supporting seat 17 bottom respectively, through with place the position contact, support for supporting seat 17 provides, be provided with the groove with spliced pole 202 adaptation in supporting seat 17's bottom simultaneously, make spliced pole 202 can remove at its inside vertical direction, supporting spring 203 is located between chassis 201 and supporting seat 17 bottom, support for supporting seat 17's bottom provides, play certain buffering cushioning effect to it, through setting up this supporting structure 20, mainly provide the support for supporting seat 17 bottom, possess certain buffering shock attenuation effect simultaneously, when using, can make supporting seat 17 keep the relatively stable state, and then make active carbon filter element 3 above that remain stable simultaneously, avoid receiving the external environment influence, safe and reliable more when using.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A gold bump plating system capable of rapidly cleaning plating solution, comprising:
the device comprises a plating bath, a PP filter element, an activated carbon filter element, ventilation equipment and a suction pump;
the aeration equipment is communicated with the activated carbon filter element through an air inlet pipe, a first valve is arranged on the air inlet pipe, a discharge pipe is arranged on one side of the activated carbon filter element, and a second valve is arranged on the discharge pipe;
the plating bath outer tank with the active carbon filter core passes through the drain pipe intercommunication, be provided with the third valve on the drain pipe, just the aspiration pump with the drain pipe is connected, the plating bath inside groove with the PP filter core passes through feed liquor pipe intercommunication, the outside of drain pipe with the PP filter core passes through the connecting pipe and connects, be provided with the fourth valve on the connecting pipe, the connecting pipe outside with the active carbon filter core passes through the delivery tube and connects, be provided with the fifth valve on the delivery tube.
2. The system of claim 1, wherein the anode of the plating tank is a wafer, the cathode of the plating tank is a platinum-titanium mesh, and the plating tank contains the plating solution.
3. The system of claim 1, wherein the air vent is configured to deliver external air into the air inlet tube, and wherein air enters the activated carbon filter element through the air inlet tube.
4. The gold bump electroplating system capable of rapidly cleaning electroplating solution as claimed in claim 1, wherein the activated carbon filter element is used for adsorbing and filtering organic impurities in the electroplating solution, and the lead-out pipe is used for leading out the electroplating solution filtered in the activated carbon filter element.
5. The system of claim 1, wherein the PP filter is used for filtering particulate impurities in the electroplating solution, and the liquid inlet pipe is used for conveying the electroplating solution filtered by the PP filter to the inner tank of the electroplating bath.
6. The system for gold bump plating capable of rapidly cleaning plating solution as recited in claim 1, wherein the drain tube is used for guiding out the plating solution from the tank outside the plating tank, and the plating solution in the drain tube is transported to the connecting tube by the suction pump.
7. The system as claimed in claim 1, wherein the third, fourth and fifth valves are provided with electronic valves, and the first and second valves are provided with manual valves.
8. The gold bump electroplating system capable of rapidly cleaning electroplating solution as claimed in claim 1, wherein a support seat is disposed at the bottom of the activated carbon filter element, a fixing structure is disposed inside the support seat, the fixing structure comprises a threaded rotating member, a moving block and a fixing clamp shaft, the moving block is connected to the outside of the threaded rotating member in a threaded manner, and the fixing clamp shaft is fixed to one side of the moving block.
9. The system as claimed in claim 8, wherein there are two moving blocks and two fixing shafts, the two moving blocks are respectively located on the left and right sides of the exterior of the screw rotation member, two movable grooves are respectively formed on both sides of the interior of the supporting seat, the moving blocks are located in the movable grooves, and the screw rotation member rotates in the supporting seat.
10. The gold bump electroplating system capable of rapidly cleaning electroplating solution according to claim 9, wherein a support structure is arranged at the bottom of the support seat, the support structure comprises a base plate, a connecting column and a support spring, the connecting column is fixed at the top of the base plate, the support spring is sleeved outside the connecting column, the connecting column slides in the support seat, an installation groove is formed at the top of the support seat, fixing holes are formed in both sides of the activated carbon filter element, and the bottom of the activated carbon filter element is clamped in the installation groove.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111229796.4A CN113832528A (en) | 2021-10-22 | 2021-10-22 | Can wash gold lug electroplating system of plating solution fast |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111229796.4A CN113832528A (en) | 2021-10-22 | 2021-10-22 | Can wash gold lug electroplating system of plating solution fast |
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