CN2937161Y - Electroplating liquid circulation device for electroplating production - Google Patents
Electroplating liquid circulation device for electroplating production Download PDFInfo
- Publication number
- CN2937161Y CN2937161Y CN 200620134511 CN200620134511U CN2937161Y CN 2937161 Y CN2937161 Y CN 2937161Y CN 200620134511 CN200620134511 CN 200620134511 CN 200620134511 U CN200620134511 U CN 200620134511U CN 2937161 Y CN2937161 Y CN 2937161Y
- Authority
- CN
- China
- Prior art keywords
- electroplate liquid
- liquid
- plating
- electroplate
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 88
- 238000009713 electroplating Methods 0.000 title claims abstract description 20
- 230000004087 circulation Effects 0.000 title claims description 11
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000007747 plating Methods 0.000 claims abstract description 41
- 238000001914 filtration Methods 0.000 claims description 12
- 239000012530 fluid Substances 0.000 claims description 7
- 239000008151 electrolyte solution Substances 0.000 claims description 5
- 239000003792 electrolyte Substances 0.000 claims description 3
- 230000010287 polarization Effects 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract description 3
- 238000004064 recycling Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 230000002950 deficient Effects 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000001839 systemic circulation Effects 0.000 description 1
Images
Abstract
The utility model relates to a plating solution recycling device used in electroplating industry. The product produced by the device has the anti-corrosion, anti-grinding, and decorating characters. The utility model comprises a casing of plating bath, an overflow of plating solution, a spilling discharge of plating solution, a liquid feed inlet and outlet of plating solution, a liquid supply ripple pipe, and a filter of plating solution as well as a pressure increasing pump. The plating solution and the spilling liquid are filtrated continuously by using the utility model, then back to plating bath by using centrifugal pump, and discharged through bottom outlet pipe. The agitated recycling liquid around the product to avoid the solid particulate adhered to the plating product, and avoid the bubble either. By reducing the concentration polarization of the plating solution, the speed of plating is enhanced. The utility model is particularly suitable for the continuous plating process.
Description
Technical field
A kind of electroplate liquid circulation device that is used for Electroplating Production relates to a kind of corrosion stability, wear resistance that is used to improve product, decorates or makes product have the electroplate liquid circulation device of the Electroplating Production of certain function.
Background technology
Plating be mainly used to improve product corrosion stability, wear resistance, decorate or make product have certain function, it is widely used.In order to guarantee the quality of coating, except processing parameters such as strict controlled temperature, current density, pH, factors such as impurity in also necessary attention stirring and the electroplate liquid are to the influence of plating quality, in order to prevent the concentration polarization of bubble when coating surface is detained and electroplate, usually adopt the mode of mechanical stirring or pneumatic blending, or adopt of the circulation of systemic circulation flow mode with the enhancement electroplate liquid, but the decomposition that can bring prussiate, and bring into plating bath such as greasy dirt, dust, thereby influence electroplating quality.
Summary of the invention
Order of the present utility model and be exactly the deficiency that exists at above-mentioned prior art provides a kind of and can prevent effectively that solia particle from adhering to and form burr on the plating piece, avoid steam bubble to be trapped in the plating piece surface forming the pin hole class and electroplate defective, reduce the concentration polarization of electroplate liquid, the cathode current density upper limit that improves permission and the electroplate liquid circulation device that is used for Electroplating Production of electroplating velocity.
The purpose of this utility model is achieved through the following technical solutions.
A kind of electroplate liquid circulation device that is used for Electroplating Production, its feature are formed in its structure and are comprised:
The electroplate liquid inside groove that is divided into the axially vertical interior frid of plating piece is arranged in plating tank casing-this plating tank wall box; Frid is having the electroplate liquid overflow weir in it by the upper end; The coaxial plated item that runs through out of the sidewall of plating tank and electroplate liquid inside groove passes through the hole; On the base plate between the sidewall of plating tank sidewall and electroplate liquid inside groove, have overflow electroplate liquid relief outlet; In electroplate liquid, have liquid discharge outlet at the bottom of electroplate liquid supply opening and the electrolytic solution on the trough floor;
Comb shape feed pipe-this feed pipe is the uniform pipe manifold of electroplating ejiction opening that has in upper end, and its pipe bottom is linked with the electroplate liquid feed pipe between two parties, and this feed pipe passes and is fixed on the electroplate liquid supply opening that has on the trough floor in the electroplate liquid;
Level is provided with that the vertical dividing plate that is provided with is divided into fluid reservoir behind electroplate liquid fluid reservoir and the electrolyte filtering with filter vat in a filter septum and the groove in electroplate liquid liquid storage filter vat-this groove; Have electroplate liquid outlet on the filtration separate slot sidewall of filter septum lower end being positioned at; Filtering the mouth that enters that separate slot sidewall upper portion has an electroplate liquid overflow and underflow liquid;
Force (forcing) pump-this pump is a liquid stream force (forcing) pump, and input terminus links by connection pipe and the outlet of electroplate liquid liquid storage filter vat electroplate liquid, and output terminal links by the supply opening of connection pipe with the comb shape feed pipe.
A kind of electroplate liquid circulation device that is used for Electroplating Production of the present utility model returns electroplate liquid and plating overflowing liquid to plating tank by continuous filtration after magnetic centrifugal pump pressurizes, and the pipe manifold ejection by bottom land forms the stirring that circulates around plating piece.Prevented that effectively solia particle from adhering on the plating piece, causes burr; Avoid simultaneously being trapped in the plating piece surface, form the pin hole class and electroplate defective in steam bubble; Reduce the concentration polarization of electroplate liquid, improve the cathode current density upper limit that allows, thereby improved electroplating velocity, be particularly useful for continuous electroplating.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Fig. 2 is that the A-A of Fig. 1 is to sectional view.
Embodiment
A kind of electroplate liquid circulation device that is used for Electroplating Production, its structure is formed and is comprised: the electroplate liquid inside groove that is divided into the axially vertical interior frid 2 of plating piece is arranged in this plating tank wall box of plating tank casing 1-; Frid is having electroplate liquid overflow weir 3 in it by the upper end; The coaxial plated item that runs through out of the sidewall of plating tank casing and electroplate liquid inside groove is by hole 4; On the base plate between the sidewall of plating tank sidewall and electroplate liquid inside groove, have overflow electroplate liquid relief outlet 5; In electroplate liquid, have liquid discharge outlet 7 at the bottom of electroplate liquid supply opening 6 and the electrolytic solution on the trough floor; This feed pipe of comb shape feed pipe 8-is the uniform pipe manifold of electroplating ejiction opening that has in upper end, and its pipe bottom is linked with electroplate liquid feed pipe 9 between two parties, and this feed pipe passes and is fixed on the electroplate liquid supply opening that has on the trough floor in the electroplate liquid; Level is provided with that the vertical dividing plate 17 that is provided with is divided into fluid reservoir behind electroplate liquid fluid reservoir and the electrolyte filtering with filter vat in a filter septum 11 and the groove in this groove of electroplate liquid liquid storage filter vat 10-; Have electroplate liquid outlet 12 on the filtration separate slot sidewall of filter septum lower end being positioned at; Enter mouthfuls 13 what filter that separate slot sidewall upper portion has an electroplate liquid overflow and underflow liquid; Force (forcing) pump-this pump is a liquid stream force (forcing) pump 14, and input terminus links by connection pipe and the outlet of electroplate liquid liquid storage filter vat electroplate liquid, and output terminal links by the supply opening of connection pipe with the comb shape feed pipe.15 is flow valve among the figure
Electroplate liquid underflow and plating overflowing liquid enter the electroplate liquid fluid reservoir during operation, electrolytic solution dividing plate after filtration becomes filtration back liquid storage, and the electrolytic solution after the filtration returns the pipe manifold in the plating tank by force (forcing) pump after the pressurization, electroplate liquid sprays from the mouth of pipe, forms circulation and stir around plating piece 16.The electroplate liquid recycle system of the present invention is particularly useful for continuous electroplating, can significantly improve electroplating velocity, and the plating piece surface quality is good, does not have defectives such as pin hole.
Claims (1)
1. electroplate liquid circulation device that is used for Electroplating Production, its feature are formed in its structure and are comprised:
The electroplate liquid inside groove that is divided into the axially vertical interior frid of plating piece is arranged in plating tank casing-this plating tank wall box; Frid is having the electroplate liquid overflow weir in it by the upper end; The coaxial plated item that runs through out of the sidewall of plating tank and electroplate liquid inside groove passes through the hole; On the base plate between the sidewall of plating tank sidewall and electroplate liquid inside groove, have overflow electroplate liquid relief outlet; In electroplate liquid, have liquid discharge outlet at the bottom of electroplate liquid supply opening and the electrolytic solution on the trough floor;
Comb shape feed pipe-this feed pipe is the uniform pipe manifold of electroplating ejiction opening that has in upper end, and its pipe bottom is linked with the electroplate liquid feed pipe between two parties, and this feed pipe passes and is fixed on the electroplate liquid supply opening that has on the trough floor in the electroplate liquid;
Level is provided with that the vertical dividing plate that is provided with is divided into fluid reservoir behind electroplate liquid fluid reservoir and the electrolyte filtering with filter vat in a filter septum and the groove in electroplate liquid liquid storage filter vat-this groove; Have electroplate liquid outlet on the filtration separate slot sidewall of filter septum lower end being positioned at; Filtering the mouth that enters that separate slot sidewall upper portion has an electroplate liquid overflow and underflow liquid;
Force (forcing) pump-this pump is a liquid stream force (forcing) pump, and input terminus links by connection pipe and the outlet of electroplate liquid liquid storage filter vat electroplate liquid, and output terminal links by the supply opening of connection pipe with the comb shape feed pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620134511 CN2937161Y (en) | 2006-08-14 | 2006-08-14 | Electroplating liquid circulation device for electroplating production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620134511 CN2937161Y (en) | 2006-08-14 | 2006-08-14 | Electroplating liquid circulation device for electroplating production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2937161Y true CN2937161Y (en) | 2007-08-22 |
Family
ID=38361184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620134511 Expired - Fee Related CN2937161Y (en) | 2006-08-14 | 2006-08-14 | Electroplating liquid circulation device for electroplating production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2937161Y (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101302645B (en) * | 2008-06-09 | 2012-12-05 | 匡优新 | Plating bath circulating device of electroplating production facility |
| CN102851728A (en) * | 2012-08-10 | 2013-01-02 | 梅州市志浩电子科技有限公司 | System and method for plating solution circulating filtration |
| CN102938286A (en) * | 2012-11-26 | 2013-02-20 | 核工业理化工程研究院 | Electroplating solution magnetization method and device |
| CN103469288A (en) * | 2013-09-02 | 2013-12-25 | 陈文智 | Electroplating bath provided with circulating filtration device |
| CN103924282A (en) * | 2013-01-15 | 2014-07-16 | 深南电路有限公司 | Electroplating cylinder |
| CN105803497A (en) * | 2016-05-24 | 2016-07-27 | 广州杰赛科技股份有限公司 | Novel electroplating device |
| CN107604426A (en) * | 2007-12-04 | 2018-01-19 | 株式会社荏原制作所 | Electroplanting device and electro-plating method |
| CN108103563A (en) * | 2018-02-08 | 2018-06-01 | 遵义市汇川区吉美电镀有限责任公司 | A kind of plating deslagging device |
-
2006
- 2006-08-14 CN CN 200620134511 patent/CN2937161Y/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107604426A (en) * | 2007-12-04 | 2018-01-19 | 株式会社荏原制作所 | Electroplanting device and electro-plating method |
| CN107604426B (en) * | 2007-12-04 | 2019-08-30 | 株式会社荏原制作所 | Electroplanting device and electro-plating method |
| CN101302645B (en) * | 2008-06-09 | 2012-12-05 | 匡优新 | Plating bath circulating device of electroplating production facility |
| CN102851728A (en) * | 2012-08-10 | 2013-01-02 | 梅州市志浩电子科技有限公司 | System and method for plating solution circulating filtration |
| CN102938286A (en) * | 2012-11-26 | 2013-02-20 | 核工业理化工程研究院 | Electroplating solution magnetization method and device |
| CN102938286B (en) * | 2012-11-26 | 2016-09-28 | 核工业理化工程研究院 | The Magnitizing method of a kind of electroplating solution and magnetizing assembly |
| CN103924282A (en) * | 2013-01-15 | 2014-07-16 | 深南电路有限公司 | Electroplating cylinder |
| CN103469288A (en) * | 2013-09-02 | 2013-12-25 | 陈文智 | Electroplating bath provided with circulating filtration device |
| CN105803497A (en) * | 2016-05-24 | 2016-07-27 | 广州杰赛科技股份有限公司 | Novel electroplating device |
| CN105803497B (en) * | 2016-05-24 | 2018-05-18 | 广州杰赛科技股份有限公司 | Novel electroplating device |
| CN108103563A (en) * | 2018-02-08 | 2018-06-01 | 遵义市汇川区吉美电镀有限责任公司 | A kind of plating deslagging device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN2937161Y (en) | Electroplating liquid circulation device for electroplating production | |
| CN105132956A (en) | Continuous purification and impurity removing system for electrolyte | |
| CN201735212U (en) | Gravity oil-water separator | |
| CN203668537U (en) | Cathode electrophoresis tank of ship-form automobile coating production line | |
| CN207159410U (en) | A kind of circulating filtration electroplating bath | |
| CN101973648B (en) | Gravity oil and water separator | |
| CN210596305U (en) | Electroplating device for printed circuit board | |
| CN102181898B (en) | On-line pretreatment device for copper-coated stainless steel wires | |
| CN210826427U (en) | Electroplating bath solution filters agitating unit | |
| CN212582031U (en) | Copper sulfate adding device | |
| CN209555395U (en) | A kind of electroplating bath | |
| CN212680241U (en) | Circuit board etching liquid filtering device | |
| CN205294995U (en) | Oil field waste liquid sand setting deoiling device | |
| CN204370034U (en) | Nickel impurity removing equipment | |
| CN207793434U (en) | Integration stews mould alkali liquor recovery device | |
| CN216156004U (en) | Novel electroplating bath scraping rod stirring device | |
| CN206404383U (en) | Solution agitating device in part blind hole Ni-Speed | |
| CN201367488Y (en) | Electroforming nickel bath | |
| CN106731027B (en) | Solution stirring device and method in part blind hole nickel plating process | |
| CN110528011A (en) | A kind of aluminium alloy extrusions degreasing bath and degreasing process | |
| CN212865035U (en) | Electrogalvanizing zinc dissolving application equipment | |
| CN205556143U (en) | Electroplate oil -water separator | |
| CN220265898U (en) | Diamond wire conductive device for preventing copper mud from adhering | |
| CN205653197U (en) | Electroplate oil -water separator's slag scraping device | |
| CN105399246B (en) | A kind of electroplating cleaning waste water direct reuse system and method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070822 Termination date: 20150814 |
|
| EXPY | Termination of patent right or utility model |