CN102938286A - Electroplating solution magnetization method and device - Google Patents

Electroplating solution magnetization method and device Download PDF

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Publication number
CN102938286A
CN102938286A CN2012104857096A CN201210485709A CN102938286A CN 102938286 A CN102938286 A CN 102938286A CN 2012104857096 A CN2012104857096 A CN 2012104857096A CN 201210485709 A CN201210485709 A CN 201210485709A CN 102938286 A CN102938286 A CN 102938286A
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China
Prior art keywords
magnetic pole
electroplating solution
guide tube
conduit
pole fixed
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CN2012104857096A
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CN102938286B (en
Inventor
王淯
温禹
胡春新
肖凯业
杨洋
李昂
赵凯
韩秋良
寇益强
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China Atomic Energy Industry Co., Ltd
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Research Institute of Physical and Chemical Engineering of Nuclear Industry
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Priority to CN201210485709.6A priority Critical patent/CN102938286B/en
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Abstract

The invention provides an electroplating solution magnetization method. According to the method, a plating solution is led out of a plating tank via a guide tube by a metering make-up pump, the guide tube passes through a magnetization device, and the plating solution is magnetized and then the magnetized plating solution flows into the plating tank via the guide tube. The magnetization device comprises a base and a magnetic pole fixing bracket and a guide tube fixing bracket which are arranged on the base, wherein a magnetic pole is arranged on the magnetic pole fixing bracket; and a guide tube through hole for holding the guide tube is formed in the guide tube fixing bracket. The method provided by the invention is a practical and effective physicochemical method which consumes no agent, causes no environment pollution, has low energy consumption and improves the performance of the electroplating solution. The device provided by the invention is simple in structure and convenient to operate, thereby being especially suitable for the magnetization treatment of the plating solution in middle and small plating tanks.

Description

A kind of Magnitizing method of electroplating solution and magnetizing assembly
Technical field
The invention belongs to Magnitizing method and the magnetizing assembly of electroplating solution, be specially a kind of Magnitizing method and magnetizing assembly that is applicable to middle-size and small-size coating bath plating solution.
Background technology
In electroplating process, because making power line, being in contact with one another between plating piece have point effect (this phenomenon is particularly evident in barrel plating), be embodied in the electric current shakiness, have to neglect to cash to resemble, make coating fragility inevitable, and then affect quality of coating.Therefore, it is very necessary electroplating solution being magnetized to eliminate point effect before plating, yet, the magnetization technology research range of prior art is limited, and with practicality, distance is still arranged, and once has patented technology that magnetic source is arranged on coating bath or plating tool, this method requires comparatively strict for plating solution, easily magnetic source is corroded, thereby pollute plating solution, the quality of production is electroplated in impact.
Summary of the invention
For solving the problems of the technologies described above, the invention provides a kind of Magnitizing method and magnetizing assembly of electroplating solution.
Technical scheme of the present invention is: a kind of Magnitizing method of electroplating solution, and comprise by metering fluid infusion pump plating solution is drawn from coating bath by conduit, conduit is by magnetizing assembly, and plating solution is magnetized, then flows into coating bath via conduit.
Flow velocity when electroplating solution is magnetized is 50ml/min~200ml/min.
The magnetizing time of electroplating solution is 30~90 minutes.
A kind of magnetizing assembly of electroplating solution, comprise base and be arranged on magnetic pole fixed mount, the catheter-fixing rack on base, on the magnetic pole fixed mount, is provided with magnetic pole, is provided with the conduit through hole of placing conduit on catheter-fixing rack.
Described magnetic pole fixed mount is two, and catheter-fixing rack is between two magnetic pole fixed mounts.
Distance between two magnetic pole fixed mounts is 36mm-100mm.
The magnetic pole material is a kind of in neodymium iron boron, ferrite, aluminium nickel cobalt or SmCo, and the material of magnetic pole fixed mount and base is aluminum alloy materials; The material of catheter-fixing rack is polytetrafluoroethylmaterial material.
The present invention does not consume medicament, free from environmental pollution, and low energy consumption is the physico-chemical process that improves a kind of practicability and effectiveness of electroplating solution performance.The apparatus structure of invention is simple, easy to operate, and the magnetization of the plating solution that is particularly suitable for middle-size and small-size coating bath is processed.
The accompanying drawing explanation
The schematic diagram of the Magnitizing method that Fig. 1 is electroplating solution of the present invention;
The front view of the magnetizing assembly that Fig. 2 is electroplating solution of the present invention;
The vertical view of the magnetizing assembly that Fig. 3 is electroplating solution of the present invention;
Wherein:
1 metering fluid infusion pump 2 plating solution 3 conduits
4 coating bath 5 magnetizing assembly 6 magnetic poles
7 magnetic pole fixed mount 8 catheter-fixing rack 9 bases
10 screw 11 conduit through hole 12 step troughs.
Embodiment
Below, by reference to the accompanying drawings Magnitizing method and the magnetizing assembly of a kind of electroplating solution of the present invention are described further:
As shown in Figure 1, a kind of Magnitizing method of electroplating solution comprises by metering fluid infusion pump 1 plating solution 2 is drawn from coating bath 4 by conduit 3 that conduit 3 is by magnetizing assembly 5, and plating solution 2 is magnetized, then flows into coating bath 4 via conduit 3, so iterative cycles.
Wherein, the operating voltage of metering fluid infusion pump 1 is 220 V, and operating current is 40 mA, power 8W; Conduit 3 is medical latex conduits of diameter of phi 8mm~Φ 12mm, and the relative permeability of its material is that 1(is identical with air); Flow velocity during magnetization of the plating solution is 50ml/min~200ml/min, and magnetizing time is 30~90 minutes.
As shown in Figure 2,3, a kind of magnetizing assembly of electroplating solution, comprise base 9 and be arranged on magnetic pole fixed mount 7, the catheter-fixing rack 8 on base 9, base 9 is cuboid, upper surface at base 9 is provided with elongated step trough 12, step trough 12 is extended down to lower surface from the upper surface of base 9, and screw 10 is fixed on magnetic pole fixed mount 7, catheter-fixing rack 8 by step trough 12 upper surface of base 9.
Described magnetic pole fixed mount 7 is two, and catheter-fixing rack 8, between two magnetic pole fixed mounts 7, has rectangle or arc-shaped slot on magnetic pole fixed mount 7, and magnetic pole 6 is arranged in groove, and magnetic pole 6 is circular; Catheter-fixing rack 8 is cylinder, is provided with the conduit through hole 11 of placing conduit 3 on catheter-fixing rack 8.
Can change two formed magnetic field intensitys of magnetic pole 6 by the distance of regulating between two magnetic pole fixed mounts 7, the distance between two magnetic pole fixed mounts 7 can be between 36mm-100mm.
The magnetic pole material is a kind of in the magnetic materials such as neodymium iron boron, ferrite, aluminium nickel cobalt or SmCo, and the material of magnetic pole fixed mount and base is aluminum alloy materials; The material of catheter-fixing rack is polytetrafluoroethylmaterial material; The material of screw is Cu alloy material, and the relative permeability of above material is 1.
The magnetization principle of plating solution is: plating solution passes through magnetic field, after being absorbed energy by magnetic force line cutting, the distortion of hydrone key generation angle and length, the hydrogen bond angle reduces to 103 ° of left and right from 105 °, the variation of this microstructure, make the physicochemical properties such as the degree of polymerization (clarifying speed) of surface tension, angle of wetting, osmotic pressure, conductivity, solubility and the plating solution of plating solution that a series of variation occur.Macro manifestations is: the plating solution after magnetization, and conductivity increases, in the process of barrel plating, because Lorentz force makes electric force lines distribution even, current stabilization, thus improve the crystallization process of electro-deposition, reduce coating hydrogen embrittlement, improve the covering power of plating solution.
The present invention does not consume medicament, free from environmental pollution, and low energy consumption is the physico-chemical process that improves a kind of practicability and effectiveness of electroplating solution performance.The apparatus structure of invention is simple, easy to operate, and the magnetization of the plating solution that is particularly suitable for middle-size and small-size coating bath is processed.

Claims (7)

1. the Magnitizing method of an electroplating solution is characterized in that: comprise by metering fluid infusion pump plating solution is drawn from coating bath by conduit, conduit is by magnetizing assembly, and plating solution is magnetized, then flows into coating bath via conduit.
2. the Magnitizing method of electroplating solution according to claim 1, it is characterized in that: flow velocity when electroplating solution is magnetized is 50ml/min~200ml/min.
3. the Magnitizing method of electroplating solution according to claim 1, it is characterized in that: the magnetizing time of electroplating solution is 30~90 minutes.
4. the magnetizing assembly of an electroplating solution, is characterized in that: comprise base and be arranged on magnetic pole fixed mount, the catheter-fixing rack on base, on the magnetic pole fixed mount, being provided with magnetic pole, be provided with the conduit through hole of placing conduit on catheter-fixing rack.
5. the magnetizing assembly of electroplating solution according to claim 4, it is characterized in that: the magnetic pole fixed mount is two, and catheter-fixing rack is between two magnetic pole fixed mounts.
6. the magnetizing assembly of electroplating solution according to claim 5 is characterized in that: the distance between two magnetic pole fixed mounts is 36mm-100mm.
7. the magnetizing assembly of electroplating solution according to claim 4 is characterized in that: the magnetic pole material is a kind of in neodymium iron boron, ferrite, aluminium nickel cobalt or SmCo, and the material of magnetic pole fixed mount and base is aluminum alloy materials; The material of catheter-fixing rack is polytetrafluoroethylmaterial material.
CN201210485709.6A 2012-11-26 2012-11-26 The Magnitizing method of a kind of electroplating solution and magnetizing assembly Active CN102938286B (en)

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CN201210485709.6A CN102938286B (en) 2012-11-26 2012-11-26 The Magnitizing method of a kind of electroplating solution and magnetizing assembly

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Application Number Priority Date Filing Date Title
CN201210485709.6A CN102938286B (en) 2012-11-26 2012-11-26 The Magnitizing method of a kind of electroplating solution and magnetizing assembly

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CN102938286B CN102938286B (en) 2016-09-28

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2091486U (en) * 1991-06-07 1991-12-25 刘惠良 Multi-purpose magnetizing unit
CN2125590U (en) * 1992-06-10 1992-12-23 林忠华 High efficient magnetic electroplating drum
JP2001244113A (en) * 2000-02-29 2001-09-07 Yamato Kankyo Kenkyusho:Kk Magnetizer for liquid
CN1714049A (en) * 2002-12-17 2005-12-28 史蒂文·萨克斯 Magnetic conditioning of fluids and gases and apparatus therefor
CN2937161Y (en) * 2006-08-14 2007-08-22 中国铝业股份有限公司 Electroplating liquid circulation device for electroplating production

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2091486U (en) * 1991-06-07 1991-12-25 刘惠良 Multi-purpose magnetizing unit
CN2125590U (en) * 1992-06-10 1992-12-23 林忠华 High efficient magnetic electroplating drum
JP2001244113A (en) * 2000-02-29 2001-09-07 Yamato Kankyo Kenkyusho:Kk Magnetizer for liquid
CN1714049A (en) * 2002-12-17 2005-12-28 史蒂文·萨克斯 Magnetic conditioning of fluids and gases and apparatus therefor
CN2937161Y (en) * 2006-08-14 2007-08-22 中国铝业股份有限公司 Electroplating liquid circulation device for electroplating production

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Effective date of registration: 20200401

Address after: 100032 Building 9, Huayuan street, Xicheng District, Beijing

Patentee after: China Atomic Energy Industry Co., Ltd

Address before: 300180, No. 168 Jintang Road, Hedong District, Tianjin

Patentee before: RESEARCH INSTITUTE OF PHYSICAL AND CHEMICAL ENGINEERING OF NUCLEAR INDUSTRY

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