CN102938286B - The Magnitizing method of a kind of electroplating solution and magnetizing assembly - Google Patents

The Magnitizing method of a kind of electroplating solution and magnetizing assembly Download PDF

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Publication number
CN102938286B
CN102938286B CN201210485709.6A CN201210485709A CN102938286B CN 102938286 B CN102938286 B CN 102938286B CN 201210485709 A CN201210485709 A CN 201210485709A CN 102938286 B CN102938286 B CN 102938286B
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China
Prior art keywords
magnetic pole
conduit
electroplating solution
plating solution
coating bath
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CN201210485709.6A
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CN102938286A (en
Inventor
王淯
温禹
胡春新
肖凯业
杨洋
李昂
赵凯
韩秋良
寇益强
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China Atomic Energy Industry Co., Ltd
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Research Institute of Physical and Chemical Engineering of Nuclear Industry
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Abstract

The invention provides the Magnitizing method of a kind of electroplating solution, drawn from coating bath by conduit by plating solution including by metering fluid infusion pump, conduit passes through magnetizing assembly, and plating solution is magnetized, then flows into coating bath via conduit.Described magnetizing assembly, the magnetic pole fixed mount including base and being arranged on base, catheter-fixing rack, magnetic pole fixed mount is provided with magnetic pole, catheter-fixing rack is provided with the conduit through hole placing conduit.The present invention does not consume medicament, free from environmental pollution, low energy consumption, is the physico-chemical process of a kind of practicability and effectiveness improving electroplating solution performance.The apparatus structure of invention is simple, easy to operate, and the magnetization of the plating solution being particularly suitable for middle-size and small-size coating bath processes.

Description

The Magnitizing method of a kind of electroplating solution and magnetizing assembly
Technical field
The invention belongs to Magnitizing method and the magnetizing assembly of electroplating solution, specially one and be applicable to middle-size and small-size coating bath plating solution Magnitizing method and magnetizing assembly.
Background technology
In electroplating process, owing to contacting with each other between plating piece makes electric lines of force there is point effect, (this phenomenon is at barrel plating In particularly evident), be embodied in electric current unstable, have suddenly cash as so that coating fragility is inevitable, and then affects coating matter Amount.Therefore, it is the most necessary for magnetizing electroplating solution to eliminate point effect before plating, but, the magnetization of prior art Technical research is limited in scope, and still has distance with practicality, once has patented technology to be arranged on by magnetic source on coating bath or plating tool, this Method requires more strict for plating solution, is easily corroded by magnetic source, thus pollutes plating solution, the impact plating quality of production.
Summary of the invention
For solving above-mentioned technical problem, the invention provides Magnitizing method and the magnetizing assembly of a kind of electroplating solution.
The technical scheme is that the Magnitizing method of a kind of electroplating solution, including by metering fluid infusion pump by plating solution by Conduit is drawn from coating bath, and conduit passes through magnetizing assembly, and plating solution is magnetized, then flows into coating bath via conduit.
Flow velocity when electroplating solution is magnetized is 50ml/min~200ml/min.
The magnetizing time of electroplating solution is 30~90 minutes.
A kind of magnetizing assembly of electroplating solution, the magnetic pole fixed mount including base and being arranged on base, catheter-fixing rack, Magnetic pole fixed mount is provided with magnetic pole, catheter-fixing rack is provided with the conduit through hole placing conduit.
Described magnetic pole fixed mount is two, and catheter-fixing rack is between two magnetic pole fixed mounts.
Distance between two magnetic pole fixed mounts is 36mm-100mm.
Magnetic pole material is the one in neodymium iron boron, ferrite, aluminum nickel cobalt or SmCo, and magnetic pole fixed mount with the material of base is Aluminum alloy materials;The material of catheter-fixing rack is polytetrafluoroethylmaterial material.
The present invention does not consume medicament, free from environmental pollution, low energy consumption, is the thing of a kind of practicability and effectiveness improving electroplating solution performance Physicochemical method.The apparatus structure of invention is simple, easy to operate, and the magnetization of the plating solution being particularly suitable for middle-size and small-size coating bath processes.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the Magnitizing method of electroplating solution of the present invention;
Fig. 2 is the front view of the magnetizing assembly of electroplating solution of the present invention;
Fig. 3 is the top view of the magnetizing assembly of electroplating solution of the present invention;
Wherein:
1 metering fluid infusion pump 2 plating solution 3 conduit
4 coating bath 5 magnetizing assembly 6 magnetic poles
7 magnetic pole fixed mount 8 catheter-fixing rack 9 bases
10 screw 11 conduit through hole 12 step troughs.
Detailed description of the invention
Below, Magnitizing method and magnetizing assembly in conjunction with accompanying drawing electroplating solution a kind of to the present invention are described further:
As it is shown in figure 1, the Magnitizing method of a kind of electroplating solution, including by metering fluid infusion pump 1 by plating solution 2 by conduit 3 from Coating bath 4 is drawn, and conduit 3 is by magnetizing assembly 5, and plating solution 2 is magnetized, then flows into coating bath 4, such iterative cycles via conduit 3.
Wherein, the running voltage of metering fluid infusion pump 1 is 220 V, and operating current is 40 mA, power 8W;Conduit 3 is diameter The medical latex conduit of Φ 8mm~Φ 12mm, the relative permeability of its material is that 1(is identical with air);Stream during magnetization of the plating solution Speed is 50ml/min~200ml/min, and magnetizing time is 30~90 minutes.
As shown in Figure 2,3, the magnetizing assembly of a kind of electroplating solution, fix including base 9 and the magnetic pole being arranged on base 9 Frame 7, catheter-fixing rack 8, base 9 is cuboid, and the upper surface at base 9 is provided with elongated step trough 12, and step trough 12 is the end of from The upper surface of seat 9 is extended down to lower surface, and magnetic pole fixed mount 7, catheter-fixing rack 8 are fixed on base 9 by step trough 12 by screw 10 Upper surface.
Described magnetic pole fixed mount 7 is two, and catheter-fixing rack 8, between two magnetic pole fixed mounts 7, is fixed at magnetic pole Having rectangle or arc-shaped slot on frame 7, magnetic pole 6 is arranged in groove, and magnetic pole 6 is circular;Catheter-fixing rack 8 is cylinder, Catheter-fixing rack 8 is provided with the conduit through hole 11 placing conduit 3.
The magnetic field intensity that two magnetic poles 6 are formed can be changed by the distance between two magnetic pole fixed mounts 7 of regulation, Distance between two magnetic pole fixed mounts 7 can be between 36mm-100mm.
Magnetic pole material is the one in the magnetic materials such as neodymium iron boron, ferrite, aluminum nickel cobalt or SmCo, magnetic pole fixed mount and the end The material of seat is aluminum alloy materials;The material of catheter-fixing rack is polytetrafluoroethylmaterial material;The material of screw is Cu alloy material, The relative permeability of above material is 1.
The magnetization principle of plating solution is: plating solution passes through magnetic field, after being absorbed energy by magnetic force line cutting, and moisture sub-key generation angle With the deformation of length, hydrogen bond angle is reduced to about 103 ° from 105 °, the change of this microstructure, make plating solution surface tension, The physicochemical properties such as the degree of polymerization (clarifying speed) of angle of wetting, osmotic pressure, electrical conductivity, dissolubility and plating solution there occurs a series of Change.Macro manifestations is: the plating solution after magnetization, and electrical conductivity increases, during barrel plating, owing to Lorentz force makes electric lines of force divide Cloth is uniform, current stabilization, thus improves the crystallization process of electro-deposition, reduces coating hydrogen embrittlement, improves the covering power of plating solution.
The present invention does not consume medicament, free from environmental pollution, low energy consumption, is the thing of a kind of practicability and effectiveness improving electroplating solution performance Physicochemical method.The apparatus structure of invention is simple, easy to operate, and the magnetization of the plating solution being particularly suitable for middle-size and small-size coating bath processes.

Claims (3)

1. the Magnitizing method of an electroplating solution, it is characterised in that: include by metering fluid infusion pump by plating solution by conduit from coating bath Drawing, conduit passes through magnetizing assembly, and plating solution is magnetized, then flows into coating bath via conduit;When described electroplating solution is magnetized Flow velocity is 50 ml/min~200 ml/min;The magnetizing time of described electroplating solution is 30~90 minutes.
2. the magnetizing assembly of an electroplating solution, it is characterised in that: include base and the magnetic pole fixed mount being arranged on base, lead Tube fixing device, is provided with magnetic pole on magnetic pole fixed mount, is provided with the conduit through hole placing conduit on catheter-fixing rack;Magnetic pole is solid Determining frame is two, and catheter-fixing rack is between two magnetic pole fixed mounts;Distance between two magnetic pole fixed mounts be 36~ 100mm;Being drawn from coating bath by conduit by plating solution by metering fluid infusion pump, conduit passes through magnetizing assembly, and plating solution is magnetized, then via Conduit flows into coating bath.
The magnetizing assembly of electroplating solution the most according to claim 2, it is characterised in that: magnetic pole material is neodymium iron boron, ferrum oxygen One in body, aluminum nickel cobalt or SmCo, magnetic pole fixed mount is aluminum alloy materials with the material of base, and the material of catheter-fixing rack is Polytetrafluoroethylmaterial material.
CN201210485709.6A 2012-11-26 2012-11-26 The Magnitizing method of a kind of electroplating solution and magnetizing assembly Active CN102938286B (en)

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CN201210485709.6A CN102938286B (en) 2012-11-26 2012-11-26 The Magnitizing method of a kind of electroplating solution and magnetizing assembly

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CN102938286B true CN102938286B (en) 2016-09-28

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2091486U (en) * 1991-06-07 1991-12-25 刘惠良 Multi-purpose magnetizing unit
CN2125590U (en) * 1992-06-10 1992-12-23 林忠华 High efficient magnetic electroplating drum
CN1714049A (en) * 2002-12-17 2005-12-28 史蒂文·萨克斯 Magnetic conditioning of fluids and gases and apparatus therefor
CN2937161Y (en) * 2006-08-14 2007-08-22 中国铝业股份有限公司 Electroplating liquid circulation device for electroplating production

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244113A (en) * 2000-02-29 2001-09-07 Yamato Kankyo Kenkyusho:Kk Magnetizer for liquid

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2091486U (en) * 1991-06-07 1991-12-25 刘惠良 Multi-purpose magnetizing unit
CN2125590U (en) * 1992-06-10 1992-12-23 林忠华 High efficient magnetic electroplating drum
CN1714049A (en) * 2002-12-17 2005-12-28 史蒂文·萨克斯 Magnetic conditioning of fluids and gases and apparatus therefor
CN2937161Y (en) * 2006-08-14 2007-08-22 中国铝业股份有限公司 Electroplating liquid circulation device for electroplating production

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Effective date of registration: 20200401

Address after: 100032 Building 9, Huayuan street, Xicheng District, Beijing

Patentee after: China Atomic Energy Industry Co., Ltd

Address before: 300180, No. 168 Jintang Road, Hedong District, Tianjin

Patentee before: RESEARCH INSTITUTE OF PHYSICAL AND CHEMICAL ENGINEERING OF NUCLEAR INDUSTRY

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