CN205774834U - Novel electroplating device - Google Patents
Novel electroplating device Download PDFInfo
- Publication number
- CN205774834U CN205774834U CN201620484429.7U CN201620484429U CN205774834U CN 205774834 U CN205774834 U CN 205774834U CN 201620484429 U CN201620484429 U CN 201620484429U CN 205774834 U CN205774834 U CN 205774834U
- Authority
- CN
- China
- Prior art keywords
- rebate
- overflow part
- electroplate liquid
- port
- return duct
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 62
- 239000007788 liquid Substances 0.000 claims abstract description 89
- 230000005484 gravity Effects 0.000 claims abstract description 12
- 230000009467 reduction Effects 0.000 claims description 3
- 238000007747 plating Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 description 1
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
This utility model relates to a kind of Novel electroplating device, including electroplating bath, deposit groove, return duct and circulation pipe；Wherein, described electroplating bath is used for accommodating electroplate liquid, and has overflow part；Described return duct includes that the first port and the second port, described first port are communicated to described overflow part, and described second port is communicated to described deposit groove；After described electroplate liquid overflow extremely described overflow part, passed to described deposit groove by described return line flow under gravity；Described return duct is roundabout is bent to form rebate, and this rebate forms fluid-tight after flowing into described electroplate liquid；Described deposit groove is communicated to described electroplating bath through described circulation pipe again.This Novel electroplating device, roundabout is bent to form rebate by being carried out by return duct, thus can form fluid-tight after flowing into electroplate liquid in return duct, close electroplate liquid, reduces and the contacting of air, is prevented effectively from electroplate liquid oxidized.
Description
Technical field
This utility model relates to electroplanting device field, particularly relates to a kind of Novel electroplating device.
Background technology
Current plating tin plating electrolyte generally uses Bivalent Tin (stannous sulfate) as plating main salt, and when Bivalent Tin with
During air contact, easily being become tetravalent tin by the dioxygen oxidation in air, in electroplate liquid, stannic concentration rises, and can cause plating
Liquid is the most aging and unstable, and this is disadvantageous for electroplating work procedure.It is thus desirable to reduce electroplate liquid and air (oxygen) as far as possible
Contact and mixing.
Under current technical status, use vertical continuous electroplating assembly line when carrying out tin plating operation, electroplate liquid the most aging and
Instability, causes vertical continuous electroplating assembly line acceptance in PCB is tin plating the lowest.
This is owing to the design of vertical continuous electroplanting device is generally divided into electroplating bath and the deposit groove two of lower section of top
Point, the electroplating bath of top carries out electroplating activity, and the electroplate liquid that overflow goes out passes through return duct, under flowing under the effect of gravity-head
In the deposit groove of side, the electroplate liquid that deposit groove reclaims and deposit electroplating bath overflow goes out of lower section, then will plating by circulating pump
Liquid draws back electroplating bath, maintains plating liquid level.In this process, electroplate liquid substantially cannot be avoided to contact with air, and electroplate liquid
During laying in groove from electroplating bath below vertically disposed reflux line flows into, due to the effect of gravity, flow velocity is very fast,
Impulsive force can be swept along large quantity of air to enter deposit groove and be formed foam, causes Bivalent Tin in electroplate liquid the most oxidized, and then impact
Electroplating work procedure.
Utility model content
Based on this, it is necessary to provide the Novel electroplating device that a kind of electroplate liquid is the most oxidizable.
A kind of Novel electroplating device, including electroplating bath, deposit groove, return duct and circulation pipe；Wherein,
Described electroplating bath is used for accommodating electroplate liquid, and has overflow part；
Described return duct includes that the first port and the second port, described first port are communicated to described overflow part, described
Two-port netwerk is communicated to described deposit groove；After described electroplate liquid overflow extremely described overflow part, under gravity by described return duct
It is circulated to described deposit groove；
Described return duct is roundabout is bent to form rebate, and this rebate forms fluid-tight after flowing into described electroplate liquid；
Described deposit groove is communicated to described electroplating bath through described circulation pipe again.
Above-mentioned Novel electroplating device, roundabout is bent to form rebate, thus when flowing in return duct by being carried out by return duct
Can form fluid-tight after entering electroplate liquid, close electroplate liquid, minimizing contacts with air, it is to avoid electroplate liquid is oxidized.
Wherein in an embodiment, described first port is communicated to the bottom of described overflow part.It is easy in overflow part
Electroplate liquid total reflux, it is to avoid alluvial.
Wherein in an embodiment, described rebate is less than described overflow part on gravity direction.It is easy to electroplate liquid exist
Flow rapidly into described rebate under action of gravity and be back to lay in groove, improving electroplate liquid cycle efficieny.
Wherein in an embodiment, described rebate is less than described overflow part on gravity direction, and higher than described storage
Standby groove.The making material of return duct can be saved, reduce the production cost of device.
Wherein in an embodiment, described return duct is extended in described overflow part by the bottom of described overflow part, and
Roundabout in described overflow part being bent to form described rebate, described first port is higher than the bottom of described overflow part.
Described rebate is formed in described overflow part, when the electroplate liquid of overflow part is accumulate to enter described rebate, can
It is collectively forming fluid-tight by described overflow part and rebate, electroplate liquid is closed.
Wherein in an embodiment, in described rebate, the position of the bottom of close described overflow part is provided with earial drainage
Hole, the aperture area of described discharge orifice makes the maximum stream flow of this discharge orifice less than described electroplate liquid when described return duct circulates
Flow.
The area of described discharge orifice specifically can carry out appropriate design according to the size of Novel electroplating device and plating flow process；
The maximum stream flow of described discharge orifice refers to, under normal pressure, is allowed in the unit interval aperture area by described discharge orifice
Big electroplate liquid volume or quality.
When utilizing described overflow part to be collectively forming fluid-tight with rebate, after stopping plating, in overflow part, have electroplate liquid
Residual.By arranging this discharge orifice, in electroplating process, in overflow part and return duct during electroplate liquid normal circulation, electroplate liquid is difficult
To be flowed out by this discharge orifice, produce impact thus without on fluid-tight；And when stopping plating, electroplate liquid can be by this discharge orifice stream
Go out, it is to avoid electroplate liquid remains in overflow part.
Wherein in an embodiment, described rebate is provided with anti-siphon hole；Described anti-siphon hole is positioned at described circuitous
Under the liquid level of the fluid-tight that the portion of returning is formed after flowing into described electroplate liquid, and higher than described first port, in described fluid-tight
Liquid level decline after, the air in described overflow part is conducted to described rebate, make described overflow part and described rebate it
Between without pressure reduction.
When electroplate liquid flowing velocity in return duct is too fast, easily forms siphon and evacuate the electroplate liquid in fluid-tight,
Thus lose the effect of closing.By arranging this anti-siphon hole, when siphon is formed, swabbing action makes the liquid level of fluid-tight decline,
After exposing this anti-siphon hole, return duct can be admitted air into, break the closed environment that siphon is formed, it is to avoid the electroplate liquid in fluid-tight
It is evacuated, and then ensures its sealing process in electroplating process.
Wherein in an embodiment, described second port is communicated to the bottom of described deposit groove.
The liquid level of electroplate liquid in deposit groove is thus made to be higher than described second port, it is to avoid when electroplate liquid flows out from return duct
Form impulsive force, bring the air in deposit groove into electroplate liquid.
Wherein in an embodiment, described circulation pipe is provided with circulating pump.
To accelerate the circulation of electroplate liquid, improve electroplating efficiency.
Wherein in an embodiment, described rebate is U-shaped or V-arrangement.
This shape can save the making material of rebate, reduces the production cost of device.
Compared with prior art, this utility model has the advantages that
Novel electroplating device described in the utility model, roundabout is bent to form rebate by being carried out by return duct, thus when
Can form fluid-tight after flowing into electroplate liquid in return duct, close electroplate liquid, minimizing contacts with air, is prevented effectively from plating
Liquid is oxidized.
The structure of rebate is the most rationally set and increases discharge orifice and the setting of anti-siphon hole, it is ensured that above-mentioned fluid-tight
Stability in electroplating process, and avoid plating to terminate rear electroplate liquid in overflow part residual.
Above-mentioned Novel electroplating device, structure is arranged rationally, and cost of manufacture is low.
Accompanying drawing explanation
Fig. 1 is the Novel electroplating device structural representation in this utility model one embodiment；
Fig. 2 is the Novel electroplating device structural representation in another embodiment of this utility model；
Fig. 3 is the rebate structural representation in Novel electroplating device described in Fig. 2, wherein,
11-electroplating bath；12-lays in groove；13-return duct；14-circulation pipe；111-overflow part；131-the first port；132-
Second port；133-rebate；134-discharge orifice；The anti-siphon hole of 135-；141-circulating pump.
Detailed description of the invention
For the ease of understanding this utility model, below with reference to relevant drawings, this utility model is more fully retouched
State.Accompanying drawing gives preferred embodiment of the present utility model.But, this utility model can come real in many different forms
Existing, however it is not limited to embodiment described herein.On the contrary, providing the purpose of these embodiments is to make public affairs of the present utility model
The understanding opening content is more thorough comprehensively.
It should be noted that when element is referred to as " being fixed on " another element, and it can be directly on another element
Or element placed in the middle can also be there is.When an element is considered as " connection " another element, and it can be to be directly connected to
To another element or may be simultaneously present centering elements.
Unless otherwise defined, all of technology used herein and scientific terminology are led with belonging to technology of the present utility model
The implication that the technical staff in territory is generally understood that is identical.At term used in the description of the present utility model it is simply herein
The purpose of specific embodiment is described, it is not intended that in limiting this utility model.Term as used herein " and/or " include
Arbitrary and all of combination of one or more relevant Listed Items.
The present embodiment one Novel electroplating device 10, its structure is as it is shown in figure 1, include electroplating bath 11, deposit groove 12, return duct
13 and circulation pipe 14；Electroplating bath 11 is used for accommodating electroplate liquid, and has overflow part 111, and return duct 13 includes the first port 131 He
Second port 132, the first port 131 is communicated to overflow part 111, and the second port 132 is communicated to lay in groove 12；Electroplate liquid overflow is extremely
After overflow part 111, it is circulated to lay in groove 12 by return duct 13 under gravity；Deposit groove 12 is communicated to electricity through circulation pipe 14 again
Coating bath 11, thus formation loop between electroplating bath 11 and deposit groove 12, wherein,
The roundabout rebate 133 being bent to form U-shaped of return duct 13, this rebate 133 forms fluid-tight after flowing into electroplate liquid.
When carrying out electroplating operations, the electroplate liquid overflow in electroplating bath 11 is to overflow part 111, then flows through the first port 131
Entering rebate 133, form fluid-tight, thus close electroplate liquid at rebate 133, minimizing electroplate liquid connects with air
Touch, it is to avoid electroplate liquid is oxidized.
First port 131 is arranged at the bottom of overflow part 111, and rebate 133 is less than overflow part on gravity direction
111, and higher than deposit groove 12, be thus easy to electroplate liquid and flow rapidly into described rebate under gravity and be back to lay in groove
In, raising electroplate liquid cycle efficieny, and the making material of return duct can be saved, reduce the production cost of device.Additionally, when stopping
When only electroplating, the electroplate liquid in overflow part 111 can to rebate 131 or be laid in groove 12 by total reflux, it is to avoid direct and air
Contact.It is understood that in other embodiments, rebate 133 can also be positioned at other height and position.
Second port 132 is arranged on the bottom of deposit groove 12 or the side bottom deposit groove 12, thus makes deposit
In groove 12, the liquid level of electroplate liquid is higher than the second port 132, it is to avoid form impulsive force when electroplate liquid flows out from return duct 13, will storage
Air in standby groove 12 brings electroplate liquid into.It is understood that in other embodiments, the second port 132 can also be not provided with
Bottom in deposit groove 12.
It is provided with circulating pump 141 on circulation pipe 14, in order to accelerate the circulation of electroplate liquid, improves electroplating efficiency.
The present embodiment one Novel electroplating device 20, its structure as in figure 2 it is shown, each structure is similar with Novel electroplating device 10,
Difference is: return duct 13 is extended to overflow part 111 by the bottom of overflow part 111, and forms the circuitous of U-shaped in overflow part 111
Going back to portion 131, the first port 131 is higher than the bottom of overflow part 111.Thus it is accumulate to enter roundabout when the electroplate liquid of overflow part 111
Behind portion 131, fluid-tight can be collectively forming by overflow part 111 and rebate 131, electroplate liquid is closed.
When forming above-mentioned fluid-tight, when electroplate liquid flowing velocity in return duct is too fast, easily form siphon and evacuate liquid
The electroplate liquid of inside front cover, thus loses the effect of closing.Therefore as it is shown on figure 3, Novel electroplating device 20 is arranged in rebate 131
Having anti-siphon hole 135, it is positioned under the liquid level of the fluid-tight that rebate 131 is formed after flowing into electroplate liquid, and higher than the first end
Mouth 131.
Thus when siphon is formed, swabbing action makes the liquid level of fluid-tight decline, after exposing this anti-siphon hole 135, and overflow
The air in portion 111 enters rebate 131, makes between overflow part 111 and rebate 131 without pressure reduction, breaks the airtight of siphon formation
Environment, it is to avoid the electroplate liquid in fluid-tight is evacuated, and then ensure its sealing process in electroplating process, concrete is preferably liquid
2cm below face.
Further as it is shown on figure 3, Novel electroplating device 20 also in rebate 131 near the position of the bottom of overflow part 111
Install and be equipped with discharge orifice 134, when the aperture area of discharge orifice 134 makes its maximum stream flow flow in return duct 13 less than electroplate liquid
Flow, specifically can carry out hole area design according to the size that electroplanting device is concrete.
By arranging this discharge orifice 134, in electroplating process, electroplate liquid normal circulation in overflow part 111 and return duct 13
Time, electroplate liquid is difficult to be flowed out by discharge orifice 134, produces impact thus without on fluid-tight；And when stopping plating, electroplate liquid can be by
Discharge orifice 134 flows out, it is to avoid electroplate liquid remains in overflow part 111.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, not to above-mentioned reality
The all possible combination of each technical characteristic executed in example is all described, but, as long as the combination of these technical characteristics is not deposited
In contradiction, all it is considered to be the scope that this specification is recorded.
Embodiment described above only have expressed several embodiments of the present utility model, and it describes more concrete and detailed,
But therefore can not be interpreted as the restriction to utility model patent scope.It should be pointed out that, for the common skill of this area
For art personnel, without departing from the concept of the premise utility, it is also possible to make some deformation and improvement, these broadly fall into
Protection domain of the present utility model.Therefore, the protection domain of this utility model patent should be as the criterion with claims.
Claims (10)
1. a Novel electroplating device, it is characterised in that include electroplating bath, deposit groove, return duct and circulation pipe；Wherein,
Described electroplating bath is used for accommodating electroplate liquid, and has overflow part；
Described return duct includes that the first port and the second port, described first port are communicated to described overflow part, described second end
Mouth is communicated to described deposit groove；After described electroplate liquid overflow extremely described overflow part, circulated by described return duct under gravity
To described deposit groove；
Described return duct is roundabout is bent to form rebate, and this rebate forms fluid-tight after flowing into described electroplate liquid；
Described deposit groove is communicated to described electroplating bath through described circulation pipe again.
Novel electroplating device the most according to claim 1, it is characterised in that described first port is communicated to described overflow part
Bottom.
Novel electroplating device the most according to claim 2, it is characterised in that described rebate is less than institute on gravity direction
State overflow part.
Novel electroplating device the most according to claim 3, it is characterised in that described rebate is less than institute on gravity direction
State overflow part, and higher than described deposit groove.
Novel electroplating device the most according to claim 1, it is characterised in that described return duct is by the bottom of described overflow part
Extending in described overflow part, and roundabout in described overflow part be bent to form described rebate, described first port is higher than institute
State the bottom of overflow part.
Novel electroplating device the most according to claim 5, it is characterised in that near described overflow part in described rebate
The position of bottom is provided with discharge orifice, and the aperture area of described discharge orifice makes the maximum stream flow of this discharge orifice less than described electroplate liquid
Flow when described return duct circulates.
Novel electroplating device the most according to claim 5, it is characterised in that be provided with anti-siphon hole in described rebate；
Described anti-siphon hole is positioned at described rebate under the liquid level flowing into the fluid-tight formed after described electroplate liquid, and higher than described the
Single port, after declining at the liquid level of described fluid-tight, is conducted to described rebate by the air in described overflow part, makes described
Without pressure reduction between overflow part and described rebate.
8. according to the Novel electroplating device described in any one of claim 1-7, it is characterised in that described second port is communicated to institute
State the bottom of deposit groove.
9. according to the Novel electroplating device described in any one of claim 1-7, it is characterised in that be provided with on described circulation pipe and follow
Ring pump.
10. according to the Novel electroplating device described in any one of claim 1-7, it is characterised in that described rebate is U-shaped or V
Shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620484429.7U CN205774834U (en) | 2016-05-24 | 2016-05-24 | Novel electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620484429.7U CN205774834U (en) | 2016-05-24 | 2016-05-24 | Novel electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205774834U true CN205774834U (en) | 2016-12-07 |
Family
ID=58113722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620484429.7U Expired - Fee Related CN205774834U (en) | 2016-05-24 | 2016-05-24 | Novel electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205774834U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105803497A (en) * | 2016-05-24 | 2016-07-27 | 广州杰赛科技股份有限公司 | Novel electroplating device |
-
2016
- 2016-05-24 CN CN201620484429.7U patent/CN205774834U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105803497A (en) * | 2016-05-24 | 2016-07-27 | 广州杰赛科技股份有限公司 | Novel electroplating device |
| CN105803497B (en) * | 2016-05-24 | 2018-05-18 | 广州杰赛科技股份有限公司 | Novel electroplating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180503 Address after: 510700 3 building, 56 C, Yun Qing Road, Whampoa District, Guangzhou, Guangdong. Patentee after: GUANGZHOU JIESAI COMMUNICATION PLANNING AND DESIGN INSTITUTE Co.,Ltd. Address before: 510310 No. 381 middle Xingang Road, Guangzhou, Guangdong, Haizhuqu District Patentee before: GCI SCIENCE & TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161207 |
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| CF01 | Termination of patent right due to non-payment of annual fee |