KR101613356B1 - 압축 성형 장치 및 금형면 평행도의 조정 방법, 다이 높이의 조정 방법 - Google Patents

압축 성형 장치 및 금형면 평행도의 조정 방법, 다이 높이의 조정 방법 Download PDF

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KR101613356B1
KR101613356B1 KR1020140084328A KR20140084328A KR101613356B1 KR 101613356 B1 KR101613356 B1 KR 101613356B1 KR 1020140084328 A KR1020140084328 A KR 1020140084328A KR 20140084328 A KR20140084328 A KR 20140084328A KR 101613356 B1 KR101613356 B1 KR 101613356B1
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molding
mold
molding die
die
unit
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KR20150062108A (ko
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마사노부 타카하시
시게루 히라타
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토와 가부시기가이샤
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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020140084328A 2013-11-28 2014-07-07 압축 성형 장치 및 금형면 평행도의 조정 방법, 다이 높이의 조정 방법 Active KR101613356B1 (ko)

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JP2013246402A JP6018037B2 (ja) 2013-11-28 2013-11-28 圧縮成形装置および型面平行度の調整方法、ダイハイトの調整方法
JPJP-P-2013-246402 2013-11-28

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KR20150062108A KR20150062108A (ko) 2015-06-05
KR101613356B1 true KR101613356B1 (ko) 2016-04-29

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180098134A (ko) * 2017-02-24 2018-09-03 토와 가부시기가이샤 수지 성형 장치, 수지 성형 방법, 및 수지 성형품의 제조 방법

Families Citing this family (4)

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Publication number Priority date Publication date Assignee Title
JP2017051972A (ja) * 2015-09-09 2017-03-16 Towa株式会社 プレス機構、プレス方法、圧縮成形装置および圧縮成形方法
TWI787417B (zh) * 2018-02-09 2022-12-21 日商山田尖端科技股份有限公司 壓縮成形用模具及壓縮成形裝置
CN110265192B (zh) * 2019-07-29 2024-04-05 湖州师范学院 厚度可调双套滚轮漆包扁线导体成形装置
CN118456779B (zh) * 2024-04-26 2024-10-01 扬州市中环高科技塑业有限公司 一种塑料花盆成型装置及其方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010046988A (ja) 2008-08-25 2010-03-04 Apic Yamada Corp プレス装置
JP2010094931A (ja) 2008-10-20 2010-04-30 Towa Corp 圧縮成形方法及び装置

Family Cites Families (9)

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Publication number Priority date Publication date Assignee Title
JPH0611141Y2 (ja) * 1989-11-09 1994-03-23 川崎油工株式会社 プレス成形用平衡支持装置
JPH0760812A (ja) * 1993-08-25 1995-03-07 Fanuc Ltd 電動式射出成形機の型締め装置
FR2883793B1 (fr) * 2005-04-01 2009-10-30 Sidel Sas Dispositif de moulage a fond reglable en hauteur pour le moulage de recipients thermoplastiques de hauteurs diverses
JP5055225B2 (ja) * 2008-08-18 2012-10-24 Towa株式会社 樹脂封止装置及び樹脂封止方法
JP2011005739A (ja) * 2009-06-25 2011-01-13 Sumitomo Heavy Ind Ltd 圧縮型の樹脂封止装置
CN201633181U (zh) * 2009-12-01 2010-11-17 宁波通用塑料机械制造有限公司 一种调整注塑机模板平行度的装置
JP5565973B2 (ja) * 2011-09-02 2014-08-06 アイダエンジニアリング株式会社 スライド駆動装置
CN202592617U (zh) * 2012-05-23 2012-12-12 萨驰华辰机械(苏州)有限公司 自动调模装置
JP5658308B2 (ja) * 2013-05-21 2015-01-21 Towa株式会社 圧縮成形方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010046988A (ja) 2008-08-25 2010-03-04 Apic Yamada Corp プレス装置
JP2010094931A (ja) 2008-10-20 2010-04-30 Towa Corp 圧縮成形方法及び装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180098134A (ko) * 2017-02-24 2018-09-03 토와 가부시기가이샤 수지 성형 장치, 수지 성형 방법, 및 수지 성형품의 제조 방법
KR102202436B1 (ko) * 2017-02-24 2021-01-13 토와 가부시기가이샤 수지 성형 장치, 수지 성형 방법, 및 수지 성형품의 제조 방법

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CN104669501B (zh) 2017-05-10
JP2015104812A (ja) 2015-06-08
KR20150062108A (ko) 2015-06-05
CN104669501A (zh) 2015-06-03
TW201524735A (zh) 2015-07-01
TWI589423B (zh) 2017-07-01
JP6018037B2 (ja) 2016-11-02

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