KR101613274B1 - 무선 주파수 패키지 온 패키지 회로 및 무선 주파수 패키지 온 패키지 회로를 생성하기 위한 방법, 장치, 컴퓨터 판독가능 매체 - Google Patents

무선 주파수 패키지 온 패키지 회로 및 무선 주파수 패키지 온 패키지 회로를 생성하기 위한 방법, 장치, 컴퓨터 판독가능 매체 Download PDF

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KR101613274B1
KR101613274B1 KR1020147016356A KR20147016356A KR101613274B1 KR 101613274 B1 KR101613274 B1 KR 101613274B1 KR 1020147016356 A KR1020147016356 A KR 1020147016356A KR 20147016356 A KR20147016356 A KR 20147016356A KR 101613274 B1 KR101613274 B1 KR 101613274B1
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South Korea
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radio frequency
package
frequency package
circuit
components
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Expired - Fee Related
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KR1020147016356A
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KR20140094616A (ko
Inventor
아리스토텔레 하드지크리스토스
구르칸왈 싱 사호타
스티븐 씨. 시카렐리
데이비드 제이. 와일딩
리안 디. 레인
크리스티안 홀렌슈타인
밀린드 피. 샤
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퀄컴 인코포레이티드
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07254—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/227—Multiple bumps having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/728—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked discrete passive device, e.g. resistors, capacitors or inductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/5317—Laminated device

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Amplifiers (AREA)
  • Transceivers (AREA)
KR1020147016356A 2011-11-15 2012-11-15 무선 주파수 패키지 온 패키지 회로 및 무선 주파수 패키지 온 패키지 회로를 생성하기 위한 방법, 장치, 컴퓨터 판독가능 매체 Expired - Fee Related KR101613274B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161560157P 2011-11-15 2011-11-15
US61/560,157 2011-11-15
US13/677,054 2012-11-14
US13/677,054 US9131634B2 (en) 2011-11-15 2012-11-14 Radio frequency package on package circuit
PCT/US2012/065363 WO2013074846A1 (en) 2011-11-15 2012-11-15 Radio frequency package on package circuit

Publications (2)

Publication Number Publication Date
KR20140094616A KR20140094616A (ko) 2014-07-30
KR101613274B1 true KR101613274B1 (ko) 2016-04-18

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KR1020147016356A Expired - Fee Related KR101613274B1 (ko) 2011-11-15 2012-11-15 무선 주파수 패키지 온 패키지 회로 및 무선 주파수 패키지 온 패키지 회로를 생성하기 위한 방법, 장치, 컴퓨터 판독가능 매체

Country Status (7)

Country Link
US (1) US9131634B2 (https=)
EP (1) EP2780941A1 (https=)
JP (1) JP6109842B2 (https=)
KR (1) KR101613274B1 (https=)
CN (1) CN103930989B (https=)
IN (1) IN2014CN02599A (https=)
WO (1) WO2013074846A1 (https=)

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US9252147B2 (en) * 2013-08-05 2016-02-02 Qualcomm Incorporated Methods and apparatuses for forming multiple radio frequency (RF) components associated with different RF bands on a chip
WO2016117196A1 (ja) * 2015-01-21 2016-07-28 株式会社村田製作所 電力増幅モジュール
WO2016189951A1 (ja) * 2015-05-26 2016-12-01 株式会社村田製作所 フィルタ装置
WO2017033564A1 (ja) 2015-08-27 2017-03-02 株式会社村田製作所 高周波モジュール
CN105514094A (zh) * 2016-01-29 2016-04-20 宜确半导体（苏州）有限公司 一种射频天线开关芯片
DE102016110862B4 (de) * 2016-06-14 2022-06-30 Snaptrack, Inc. Modul und Verfahren zur Herstellung einer Vielzahl von Modulen
US10312193B2 (en) * 2016-08-12 2019-06-04 Qualcomm Incorporated Package comprising switches and filters
US10685924B2 (en) * 2017-08-24 2020-06-16 Qualcomm Incorporated Antenna-on-package arrangements
WO2019065668A1 (ja) * 2017-09-29 2019-04-04 株式会社村田製作所 高周波モジュールおよび通信装置
WO2019075450A1 (en) * 2017-10-15 2019-04-18 Skyworks Solutions, Inc. STACK ASSEMBLY WITH ELECTRO-ACOUSTIC DEVICE
CN108807350B (zh) * 2018-08-10 2024-08-02 浙江熔城半导体有限公司 放大器芯片电极外设的多腔室封装结构及其制作方法
CN109087909B (zh) * 2018-08-10 2024-08-02 浙江熔城半导体有限公司 具有金属柱的多腔室封装结构及其制作方法
WO2020218643A1 (ko) * 2019-04-25 2020-10-29 엘지전자 주식회사 커넥터를 구비하는 전자 기기
CN111276475B (zh) * 2020-05-07 2020-08-18 杭州臻镭微波技术有限公司 一种三维异构集成综合射频前端微系统
JP2022007366A (ja) * 2020-06-26 2022-01-13 株式会社村田製作所 高周波モジュールおよび通信装置
US11152707B1 (en) * 2020-07-02 2021-10-19 International Business Machines Corporation Fast radio frequency package
CN112117978A (zh) * 2020-10-15 2020-12-22 北京飞宇微电子电路有限责任公司 一种信号处理装置及其预处理模块
CN112117984A (zh) * 2020-10-15 2020-12-22 北京飞宇微电子电路有限责任公司 一种预处理模块
CN112865835A (zh) * 2021-01-05 2021-05-28 上海闻泰信息技术有限公司 一种射频前端模组的封装结构及移动终端
CN115037357B (zh) * 2022-06-08 2023-03-14 西安交通大学 一种瓦片式下变频器、相控阵天线系统及卫星通信系统

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US20080111226A1 (en) * 2006-11-15 2008-05-15 White George E Integration using package stacking with multi-layer organic substrates
US20090160430A1 (en) 2007-12-20 2009-06-25 Anritsu Company HAND-HELD MICROWAVE SPECTRUM ANALYZER WITH OPERATION RANGE FROM 9 KHz TO OVER 20 GHz
US20110128713A1 (en) 2009-11-30 2011-06-02 Renesas Electronics Corporation Semiconductor device and method of manufacturing the same

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US20080111226A1 (en) * 2006-11-15 2008-05-15 White George E Integration using package stacking with multi-layer organic substrates
US20090160430A1 (en) 2007-12-20 2009-06-25 Anritsu Company HAND-HELD MICROWAVE SPECTRUM ANALYZER WITH OPERATION RANGE FROM 9 KHz TO OVER 20 GHz
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Also Published As

Publication number Publication date
CN103930989A (zh) 2014-07-16
KR20140094616A (ko) 2014-07-30
CN103930989B (zh) 2017-07-21
EP2780941A1 (en) 2014-09-24
IN2014CN02599A (https=) 2015-08-07
WO2013074846A1 (en) 2013-05-23
JP2014533911A (ja) 2014-12-15
US20130122833A1 (en) 2013-05-16
JP6109842B2 (ja) 2017-04-05
US9131634B2 (en) 2015-09-08

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