IN2014CN02599A - - Google Patents

Info

Publication number
IN2014CN02599A
IN2014CN02599A IN2599CHN2014A IN2014CN02599A IN 2014CN02599 A IN2014CN02599 A IN 2014CN02599A IN 2599CHN2014 A IN2599CHN2014 A IN 2599CHN2014A IN 2014CN02599 A IN2014CN02599 A IN 2014CN02599A
Authority
IN
India
Prior art keywords
radio frequency
package
frequency package
pop
circuit
Prior art date
Application number
Other languages
English (en)
Inventor
Aristotele Hadjichristos
Gurkanwal Singh Sahota
Steven C Ciccarelli
David J Wilding
Ryan D Lane
Christian Holenstein
Milind P Shah
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of IN2014CN02599A publication Critical patent/IN2014CN02599A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07254—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/227—Multiple bumps having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/728—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked discrete passive device, e.g. resistors, capacitors or inductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/5317—Laminated device

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Amplifiers (AREA)
  • Transceivers (AREA)
IN2599CHN2014 2011-11-15 2012-11-15 IN2014CN02599A (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161560157P 2011-11-15 2011-11-15
US13/677,054 US9131634B2 (en) 2011-11-15 2012-11-14 Radio frequency package on package circuit
PCT/US2012/065363 WO2013074846A1 (en) 2011-11-15 2012-11-15 Radio frequency package on package circuit

Publications (1)

Publication Number Publication Date
IN2014CN02599A true IN2014CN02599A (https=) 2015-08-07

Family

ID=48281100

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2599CHN2014 IN2014CN02599A (https=) 2011-11-15 2012-11-15

Country Status (7)

Country Link
US (1) US9131634B2 (https=)
EP (1) EP2780941A1 (https=)
JP (1) JP6109842B2 (https=)
KR (1) KR101613274B1 (https=)
CN (1) CN103930989B (https=)
IN (1) IN2014CN02599A (https=)
WO (1) WO2013074846A1 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9252147B2 (en) * 2013-08-05 2016-02-02 Qualcomm Incorporated Methods and apparatuses for forming multiple radio frequency (RF) components associated with different RF bands on a chip
WO2016117196A1 (ja) * 2015-01-21 2016-07-28 株式会社村田製作所 電力増幅モジュール
WO2016189951A1 (ja) * 2015-05-26 2016-12-01 株式会社村田製作所 フィルタ装置
WO2017033564A1 (ja) 2015-08-27 2017-03-02 株式会社村田製作所 高周波モジュール
CN105514094A (zh) * 2016-01-29 2016-04-20 宜确半导体（苏州）有限公司 一种射频天线开关芯片
DE102016110862B4 (de) * 2016-06-14 2022-06-30 Snaptrack, Inc. Modul und Verfahren zur Herstellung einer Vielzahl von Modulen
US10312193B2 (en) * 2016-08-12 2019-06-04 Qualcomm Incorporated Package comprising switches and filters
US10685924B2 (en) * 2017-08-24 2020-06-16 Qualcomm Incorporated Antenna-on-package arrangements
WO2019065668A1 (ja) * 2017-09-29 2019-04-04 株式会社村田製作所 高周波モジュールおよび通信装置
WO2019075450A1 (en) * 2017-10-15 2019-04-18 Skyworks Solutions, Inc. STACK ASSEMBLY WITH ELECTRO-ACOUSTIC DEVICE
CN108807350B (zh) * 2018-08-10 2024-08-02 浙江熔城半导体有限公司 放大器芯片电极外设的多腔室封装结构及其制作方法
CN109087909B (zh) * 2018-08-10 2024-08-02 浙江熔城半导体有限公司 具有金属柱的多腔室封装结构及其制作方法
WO2020218643A1 (ko) * 2019-04-25 2020-10-29 엘지전자 주식회사 커넥터를 구비하는 전자 기기
CN111276475B (zh) * 2020-05-07 2020-08-18 杭州臻镭微波技术有限公司 一种三维异构集成综合射频前端微系统
JP2022007366A (ja) * 2020-06-26 2022-01-13 株式会社村田製作所 高周波モジュールおよび通信装置
US11152707B1 (en) * 2020-07-02 2021-10-19 International Business Machines Corporation Fast radio frequency package
CN112117978A (zh) * 2020-10-15 2020-12-22 北京飞宇微电子电路有限责任公司 一种信号处理装置及其预处理模块
CN112117984A (zh) * 2020-10-15 2020-12-22 北京飞宇微电子电路有限责任公司 一种预处理模块
CN112865835A (zh) * 2021-01-05 2021-05-28 上海闻泰信息技术有限公司 一种射频前端模组的封装结构及移动终端
CN115037357B (zh) * 2022-06-08 2023-03-14 西安交通大学 一种瓦片式下变频器、相控阵天线系统及卫星通信系统

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JPS59172271A (ja) 1983-03-19 1984-09-28 Fujitsu Ltd 半導体装置
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JP2000223656A (ja) * 1999-02-03 2000-08-11 Rohm Co Ltd 無線通信装置用半導体装置およびこれを用いた無線通信装置
US6856007B2 (en) 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
US20060255446A1 (en) 2001-10-26 2006-11-16 Staktek Group, L.P. Stacked modules and method
JP3662219B2 (ja) 2001-12-27 2005-06-22 三菱電機株式会社 積層高周波モジュール
US7239020B2 (en) 2004-05-06 2007-07-03 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Multi-mode integrated circuit structure
US7772708B2 (en) 2006-08-31 2010-08-10 Intel Corporation Stacking integrated circuit dies
US7989895B2 (en) 2006-11-15 2011-08-02 Avx Corporation Integration using package stacking with multi-layer organic substrates
JP4734282B2 (ja) * 2007-04-23 2011-07-27 株式会社日立製作所 半導体チップおよび半導体装置
US8159208B2 (en) * 2007-12-20 2012-04-17 Anritsu Company Hand-held microwave spectrum analyzer with operation range from 9 KHz to over 20 GHz
US20090321876A1 (en) * 2008-06-30 2009-12-31 Telesphor Kamgaing System with radio frequency integrated circuits
JP4833307B2 (ja) * 2009-02-24 2011-12-07 インターナショナル・ビジネス・マシーンズ・コーポレーション 半導体モジュール、端子板、端子板の製造方法および半導体モジュールの製造方法
JP5352437B2 (ja) 2009-11-30 2013-11-27 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN102184906B (zh) * 2011-03-31 2013-05-08 锐迪科创微电子（北京）有限公司 带有绝缘体填充的阱结构的封装基板及其制造方法

Also Published As

Publication number Publication date
CN103930989A (zh) 2014-07-16
KR20140094616A (ko) 2014-07-30
CN103930989B (zh) 2017-07-21
EP2780941A1 (en) 2014-09-24
WO2013074846A1 (en) 2013-05-23
JP2014533911A (ja) 2014-12-15
US20130122833A1 (en) 2013-05-16
KR101613274B1 (ko) 2016-04-18
JP6109842B2 (ja) 2017-04-05
US9131634B2 (en) 2015-09-08

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