KR101606604B1 - 광전 반도체칩 - Google Patents

광전 반도체칩 Download PDF

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Publication number
KR101606604B1
KR101606604B1 KR1020117004570A KR20117004570A KR101606604B1 KR 101606604 B1 KR101606604 B1 KR 101606604B1 KR 1020117004570 A KR1020117004570 A KR 1020117004570A KR 20117004570 A KR20117004570 A KR 20117004570A KR 101606604 B1 KR101606604 B1 KR 101606604B1
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South Korea
Prior art keywords
layer
current diffusion
diffusion layer
current
mirror
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English (en)
Korean (ko)
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KR20110044264A (ko
Inventor
루츠 호펠
마티아스 사바틸
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오스람 옵토 세미컨덕터스 게엠베하
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Publication of KR20110044264A publication Critical patent/KR20110044264A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8316—Multi-layer electrodes comprising at least one discontinuous layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/833—Transparent materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/835—Reflective materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Led Devices (AREA)
KR1020117004570A 2008-07-28 2009-06-29 광전 반도체칩 Expired - Fee Related KR101606604B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008035110A DE102008035110A1 (de) 2008-07-28 2008-07-28 Optoelektronischer Halbleiterchip
DE102008035110.5 2008-07-28

Publications (2)

Publication Number Publication Date
KR20110044264A KR20110044264A (ko) 2011-04-28
KR101606604B1 true KR101606604B1 (ko) 2016-03-25

Family

ID=41279336

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117004570A Expired - Fee Related KR101606604B1 (ko) 2008-07-28 2009-06-29 광전 반도체칩

Country Status (8)

Country Link
US (1) US8841685B2 (enExample)
EP (1) EP2313935A1 (enExample)
JP (1) JP5514819B2 (enExample)
KR (1) KR101606604B1 (enExample)
CN (1) CN102106008B (enExample)
DE (1) DE102008035110A1 (enExample)
TW (1) TWI415297B (enExample)
WO (1) WO2010012256A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005094130A1 (ja) * 2004-03-26 2005-10-06 Matsushita Electric Works, Ltd. 有機発光素子
DE102008048648B4 (de) 2008-09-24 2025-05-15 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip
DE102011017196A1 (de) 2011-04-15 2012-10-18 Osram Opto Semiconductors Gmbh Polarisierte Strahlung emittierender Halbleiterchip
DE102015109786A1 (de) 2015-06-18 2016-12-22 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements sowie optoelektronisches Halbleiterbauelement
CN105609596A (zh) * 2015-09-11 2016-05-25 映瑞光电科技(上海)有限公司 具有电流阻挡结构的led垂直芯片及其制备方法
DE102019103638A1 (de) 2019-02-13 2020-08-13 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches halbleiterbauelement mit abschnitten einer leitfähigen schicht und verfahren zur herstellung eines optoelektronischen halbleiterbauelements

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003052838A2 (en) 2001-12-13 2003-06-26 Rensselaer Polytechnic Institute Light-emitting diode with planar omni-directional reflector
US20050093002A1 (en) 2003-10-30 2005-05-05 United Epitaxy Company, Ltd. Light emitting diode device and manufacturing method
JP2007207869A (ja) * 2006-01-31 2007-08-16 Rohm Co Ltd 窒化物半導体発光素子

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11168239A (ja) * 1997-12-05 1999-06-22 Matsushita Electric Ind Co Ltd 窒化ガリウム系化合物半導体発光素子
US6287947B1 (en) * 1999-06-08 2001-09-11 Lumileds Lighting, U.S. Llc Method of forming transparent contacts to a p-type GaN layer
US6420736B1 (en) * 2000-07-26 2002-07-16 Axt, Inc. Window for gallium nitride light emitting diode
US6906352B2 (en) 2001-01-16 2005-06-14 Cree, Inc. Group III nitride LED with undoped cladding layer and multiple quantum well
US6445007B1 (en) 2001-03-19 2002-09-03 Uni Light Technology Inc. Light emitting diodes with spreading and improving light emitting area
DE10147886B4 (de) * 2001-09-28 2006-07-13 Osram Opto Semiconductors Gmbh Lumineszenzdiode mit vergrabenem Kontakt und Herstellungsverfahren
ATE445233T1 (de) 2002-01-28 2009-10-15 Nichia Corp Nitrid-halbleiterbauelement mit einem trägersubstrat und verfahren zu seiner herstellung
JP4635985B2 (ja) 2002-10-03 2011-02-23 日亜化学工業株式会社 発光ダイオード
DE10261676A1 (de) 2002-12-31 2004-07-22 Osram Opto Semiconductors Gmbh Leuchtdioden-Chip mit strahlungsdurchlässiger elektrischer Stromaufweitungsschicht
JP4259268B2 (ja) 2003-10-20 2009-04-30 豊田合成株式会社 半導体発光素子
US7119372B2 (en) * 2003-10-24 2006-10-10 Gelcore, Llc Flip-chip light emitting diode
KR100586949B1 (ko) 2004-01-19 2006-06-07 삼성전기주식회사 플립칩용 질화물 반도체 발광소자
KR101386192B1 (ko) 2004-01-26 2014-04-17 오스람 옵토 세미컨덕터스 게엠베하 전류 분산 구조물을 갖는 박막 ｌｅｄ
DE102004025610A1 (de) 2004-04-30 2005-11-17 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit mehreren Stromaufweitungsschichten und Verfahren zu dessen Herstellung
TWI288979B (en) 2006-02-23 2007-10-21 Arima Optoelectronics Corp Light emitting diode bonded with metal diffusion and manufacturing method thereof
JP2007281037A (ja) 2006-04-03 2007-10-25 Dowa Holdings Co Ltd 半導体発光素子及びその製造方法
DE102006034847A1 (de) 2006-04-27 2007-10-31 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip
TWI322522B (en) 2006-12-18 2010-03-21 Delta Electronics Inc Electroluminescent device, and fabrication method thereof
US7683380B2 (en) 2007-06-25 2010-03-23 Dicon Fiberoptics, Inc. High light efficiency solid-state light emitting structure and methods to manufacturing the same
JP2009260316A (ja) * 2008-03-26 2009-11-05 Panasonic Electric Works Co Ltd 半導体発光素子およびそれを用いる照明装置
DE102008035900A1 (de) 2008-04-30 2009-11-05 Osram Opto Semiconductors Gmbh Leuchtdiodenchip

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003052838A2 (en) 2001-12-13 2003-06-26 Rensselaer Polytechnic Institute Light-emitting diode with planar omni-directional reflector
US20050093002A1 (en) 2003-10-30 2005-05-05 United Epitaxy Company, Ltd. Light emitting diode device and manufacturing method
JP2007207869A (ja) * 2006-01-31 2007-08-16 Rohm Co Ltd 窒化物半導体発光素子

Also Published As

Publication number Publication date
CN102106008B (zh) 2014-12-24
WO2010012256A1 (de) 2010-02-04
KR20110044264A (ko) 2011-04-28
DE102008035110A1 (de) 2010-02-11
EP2313935A1 (de) 2011-04-27
TW201013992A (en) 2010-04-01
TWI415297B (zh) 2013-11-11
CN102106008A (zh) 2011-06-22
JP2011529277A (ja) 2011-12-01
US20110284893A1 (en) 2011-11-24
JP5514819B2 (ja) 2014-06-04
US8841685B2 (en) 2014-09-23

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