KR101598525B1 - 정보처리 장치, 정보처리 방법, 프로그램 및 기판 제조 시스템 - Google Patents

정보처리 장치, 정보처리 방법, 프로그램 및 기판 제조 시스템 Download PDF

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KR101598525B1
KR101598525B1 KR1020147022305A KR20147022305A KR101598525B1 KR 101598525 B1 KR101598525 B1 KR 101598525B1 KR 1020147022305 A KR1020147022305 A KR 1020147022305A KR 20147022305 A KR20147022305 A KR 20147022305A KR 101598525 B1 KR101598525 B1 KR 101598525B1
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conductive pattern
image data
information processing
processing apparatus
data
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Korean (ko)
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KR20140110081A (ko
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야스유키 와타나베
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가부시기가이샤즈겐
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/394—Routing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/18—Manufacturability analysis or optimisation for manufacturability
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/392—Floor-planning or layout, e.g. partitioning or placement
    • G—PHYSICS
    • G16—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS
    • G16Z—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS, NOT OTHERWISE PROVIDED FOR
    • G16Z99/00—Subject matter not provided for in other main groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coating Apparatus (AREA)
KR1020147022305A 2012-04-11 2013-02-05 정보처리 장치, 정보처리 방법, 프로그램 및 기판 제조 시스템 Active KR101598525B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012090437A JP5907788B2 (ja) 2012-04-11 2012-04-11 情報処理装置、情報処理方法、プログラムおよび基板製造システム
JPJP-P-2012-090437 2012-04-11
PCT/JP2013/000612 WO2013153720A1 (ja) 2012-04-11 2013-02-05 情報処理装置、情報処理方法、プログラムおよび基板製造システム

Publications (2)

Publication Number Publication Date
KR20140110081A KR20140110081A (ko) 2014-09-16
KR101598525B1 true KR101598525B1 (ko) 2016-02-29

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KR1020147022305A Active KR101598525B1 (ko) 2012-04-11 2013-02-05 정보처리 장치, 정보처리 방법, 프로그램 및 기판 제조 시스템

Country Status (5)

Country Link
US (1) US9173296B2 (enExample)
EP (1) EP2804116B1 (enExample)
JP (1) JP5907788B2 (enExample)
KR (1) KR101598525B1 (enExample)
WO (1) WO2013153720A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102639895B1 (ko) 2019-01-21 2024-02-23 삼성전자주식회사 인쇄 회로 기판이 시뮬레이션을 위한 컴퓨터-구현 방법, 프로세서-구현 시스템, 그리고 명령들을 저장하는 비임시의 컴퓨터로 독출 가능한 저장 매체

Citations (2)

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JP2010033571A (ja) * 2008-07-24 2010-02-12 Seiko Epson Corp 画像処理方法、コンピューター読み取り可能な媒体および画像処理システム
JP2010135499A (ja) 2008-12-03 2010-06-17 Seiko Epson Corp 配線形成装置及び配線形成方法

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JPH10177589A (ja) 1996-12-18 1998-06-30 Mitsubishi Electric Corp パターン比較検証装置、パターン比較検証方法およびパターン比較検証プログラムを記録した媒体
JPH11184064A (ja) * 1997-12-18 1999-07-09 Toppan Printing Co Ltd フォトマスクパターン設計装置および設計方法ならびにフォトマスクパターン設計プログラムを記録した記録媒体
JP2001142565A (ja) * 1999-11-12 2001-05-25 Sony Corp 情報処理装置
WO2002006902A2 (en) * 2000-07-17 2002-01-24 Board Of Regents, The University Of Texas System Method and system of automatic fluid dispensing for imprint lithography processes
US20020097417A1 (en) * 2001-01-19 2002-07-25 Chang William Ho System for universal data output
GB2388709A (en) * 2002-05-17 2003-11-19 Seiko Epson Corp Circuit fabrication method
JP2005085877A (ja) * 2003-09-05 2005-03-31 Seiko Epson Corp デバイスの製造方法、デバイス及び電子機器
US7316468B2 (en) * 2004-05-19 2008-01-08 Fujifilm Corporation Liquid droplet ejection head, liquid droplet ejection device and image forming apparatus
JP3956393B2 (ja) * 2004-05-19 2007-08-08 富士フイルム株式会社 液滴吐出装置及び画像形成装置
JP2006330184A (ja) * 2005-05-24 2006-12-07 Fujifilm Holdings Corp 画像処理装置
JP4450769B2 (ja) * 2005-06-16 2010-04-14 富士フイルム株式会社 画像処理装置、画像描画装置及びシステム
JP2007152167A (ja) * 2005-12-01 2007-06-21 Seiko Epson Corp パターン設計方法および液滴配置方法
JP4733065B2 (ja) * 2007-03-28 2011-07-27 富士フイルム株式会社 描画データ検査方法および描画データ検査装置
KR100894700B1 (ko) * 2007-06-11 2009-04-24 삼성전기주식회사 잉크젯 인쇄방법
JP5339626B2 (ja) * 2008-01-30 2013-11-13 三菱製紙株式会社 導電パターンの作製方法
US8099707B1 (en) * 2008-03-17 2012-01-17 Kovio, Inc. Field configured electronic circuits and methods of making the same
JP2009255007A (ja) 2008-04-21 2009-11-05 Hitachi Ltd パターン形成方法、これによる基板の製造方法、基板、並びにパターン形成装置
KR100967966B1 (ko) * 2008-07-21 2010-07-06 삼성전기주식회사 화상데이터 처리방법 및 기록매체
US8424176B2 (en) * 2008-11-25 2013-04-23 Kovio, Inc. Methods of forming tunable capacitors
JP5685855B2 (ja) * 2009-09-08 2015-03-18 株式会社リコー 表示装置および表示装置の製造方法
US20140158193A1 (en) * 2011-08-09 2014-06-12 Solexel, Inc. Structures and methods of formation of contiguous and non-contiguous base regions for high efficiency back-contact solar cells
US9000557B2 (en) * 2012-03-17 2015-04-07 Zvi Or-Bach Semiconductor device and structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010033571A (ja) * 2008-07-24 2010-02-12 Seiko Epson Corp 画像処理方法、コンピューター読み取り可能な媒体および画像処理システム
JP2010135499A (ja) 2008-12-03 2010-06-17 Seiko Epson Corp 配線形成装置及び配線形成方法

Also Published As

Publication number Publication date
EP2804116A1 (en) 2014-11-19
US20140351786A1 (en) 2014-11-27
KR20140110081A (ko) 2014-09-16
WO2013153720A1 (ja) 2013-10-17
JP2013219283A (ja) 2013-10-24
US9173296B2 (en) 2015-10-27
EP2804116A4 (en) 2015-10-14
JP5907788B2 (ja) 2016-04-26
EP2804116B1 (en) 2018-04-04

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