KR101596070B1 - 복사 방출 장치 및 복사 방출 장치의 제조 방법 - Google Patents

복사 방출 장치 및 복사 방출 장치의 제조 방법 Download PDF

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KR101596070B1
KR101596070B1 KR1020117004233A KR20117004233A KR101596070B1 KR 101596070 B1 KR101596070 B1 KR 101596070B1 KR 1020117004233 A KR1020117004233 A KR 1020117004233A KR 20117004233 A KR20117004233 A KR 20117004233A KR 101596070 B1 KR101596070 B1 KR 101596070B1
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South Korea
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electrode
substrate
metal film
encapsulation part
film
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KR20110055568A (ko
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마르쿠스 클레인
틸만 슈렌커
앤드류 잉글
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오스람 오엘이디 게엠베하
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/26—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H10K59/80515—Anodes characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8721—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020117004233A 2008-07-25 2009-07-21 복사 방출 장치 및 복사 방출 장치의 제조 방법 Active KR101596070B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102008034717 2008-07-25
DE102008034717.5 2008-07-25
DE102008053326A DE102008053326A1 (de) 2008-07-25 2008-10-27 Strahlungsemittierende Vorrichtung und Verfahren zur Herstellung einer strahlungsemittierenden Vorrichtung
DE102008053326.2 2008-10-27

Publications (2)

Publication Number Publication Date
KR20110055568A KR20110055568A (ko) 2011-05-25
KR101596070B1 true KR101596070B1 (ko) 2016-02-19

Family

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KR1020117004233A Active KR101596070B1 (ko) 2008-07-25 2009-07-21 복사 방출 장치 및 복사 방출 장치의 제조 방법

Country Status (7)

Country Link
US (1) US8772818B2 (enExample)
EP (1) EP2308117B1 (enExample)
JP (1) JP5794915B2 (enExample)
KR (1) KR101596070B1 (enExample)
CN (1) CN102106018B (enExample)
DE (1) DE102008053326A1 (enExample)
WO (1) WO2010009716A2 (enExample)

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EP2356372B1 (de) 2008-12-11 2016-08-10 OSRAM OLED GmbH Organische leuchtdiode und beleuchtungsmittel
US8803135B2 (en) * 2010-06-04 2014-08-12 Mitsui Mining & Smelting Co., Ltd. Electrode foil and organic device
JP2012054225A (ja) * 2010-08-04 2012-03-15 Canon Inc 表示装置
KR101430173B1 (ko) * 2010-10-19 2014-08-13 삼성디스플레이 주식회사 유기 발광 표시 장치
US9934836B2 (en) * 2011-06-27 2018-04-03 Thin Film Electronics Asa Short circuit reduction in an electronic component comprising a stack of layers arranged on a flexible substrate
EP2782418A4 (en) * 2011-11-14 2015-11-04 Konica Minolta Inc ORGANIC ELECTROLUMINESCENT ELEMENT AND PLANE ELECTROLUMINESCENT UNIT
EP2794814B1 (de) 2011-12-19 2017-10-18 InovisCoat GmbH Leuchtelemente mit einer elektrolumineszenzanordnung sowie verfahren zur herstellung eines leuchtelements
DE102012109228A1 (de) * 2012-09-28 2014-04-03 Osram Opto Semiconductors Gmbh Verfahren zum Ermitteln der Permeabilität einer dielektrischen Schicht eines optoelektronischen Bauelementes; Vorrichtung zum Ermitteln der Permeabilität einer dielektrischen Schicht eines optoelektronischen Bauelementes; optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelementes
KR102083448B1 (ko) * 2012-12-20 2020-03-03 삼성디스플레이 주식회사 기상 증착 장치, 이를 이용한 증착 방법 및 유기 발광 표시 장치 제조 방법
US8921839B2 (en) * 2013-03-12 2014-12-30 Sharp Laboratories Of America, Inc. Light emitting device with spherical back mirror
US9356256B2 (en) * 2013-07-31 2016-05-31 Samsung Display Co., Ltd. Flexible display device and manufacturing method thereof
KR102253531B1 (ko) * 2014-07-25 2021-05-18 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
CN109994643B (zh) * 2018-01-02 2021-02-02 京东方科技集团股份有限公司 有机发光二极管器件及其制造方法、显示基板、显示装置
US20220209166A1 (en) * 2019-04-11 2022-06-30 Sharp Kabushiki Kaisha Light-emitting element and display device
CN110943184B (zh) * 2019-12-13 2022-08-16 昆山国显光电有限公司 显示面板及其制造方法、蒸镀掩模版组及显示装置
CN115275779A (zh) * 2022-07-13 2022-11-01 常州承芯半导体有限公司 垂直腔面发射激光器及其形成方法

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JP2004319484A (ja) * 2003-04-11 2004-11-11 Eastman Kodak Co 透明防湿層を形成するための方法及び装置並びに防湿型ｏｌｅｄデバイス
JP2007073338A (ja) * 2005-09-07 2007-03-22 Toyota Industries Corp 有機ｅｌ装置の製造方法及び有機ｅｌ装置

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JPH11339969A (ja) * 1998-05-22 1999-12-10 Tdk Corp 有機ｅｌ素子
CA2353506A1 (en) * 1998-11-02 2000-05-11 3M Innovative Properties Company Transparent conductive oxides for plastic flat panel displays
US6633121B2 (en) * 2000-01-31 2003-10-14 Idemitsu Kosan Co., Ltd. Organic electroluminescence display device and method of manufacturing same
US20020110673A1 (en) * 2001-02-14 2002-08-15 Ramin Heydarpour Multilayered electrode/substrate structures and display devices incorporating the same
US7074501B2 (en) * 2001-08-20 2006-07-11 Nova-Plasma Inc. Coatings with low permeation of gases and vapors
JP4383077B2 (ja) * 2003-03-31 2009-12-16 大日本印刷株式会社 ガスバリア性基板
US7229703B2 (en) 2003-03-31 2007-06-12 Dai Nippon Printing Co. Ltd. Gas barrier substrate
EP1712109A4 (en) 2003-12-30 2008-03-19 Agency Science Tech & Res FLEXIBLE ELECTROLUMINESCENT FACILITIES
KR100666550B1 (ko) 2004-04-07 2007-01-09 삼성에스디아이 주식회사 평판표시장치 및 그의 제조방법
DE102004022004B4 (de) * 2004-05-03 2007-07-05 Novaled Ag Schichtanordnung für eine organische lichtemittierende Diode
JP2006024535A (ja) 2004-07-09 2006-01-26 Seiko Epson Corp 有機薄膜素子の製造方法、電気光学装置の製造方法及び電子機器の製造方法
US7504770B2 (en) * 2005-02-09 2009-03-17 Osram Opto Semiconductors Gmbh Enhancement of light extraction with cavity and surface modification
US7597603B2 (en) * 2005-12-06 2009-10-06 Corning Incorporated Method of encapsulating a display element
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JP2007073338A (ja) * 2005-09-07 2007-03-22 Toyota Industries Corp 有機ｅｌ装置の製造方法及び有機ｅｌ装置

Also Published As

Publication number Publication date
CN102106018B (zh) 2015-04-22
WO2010009716A2 (de) 2010-01-28
JP5794915B2 (ja) 2015-10-14
WO2010009716A3 (de) 2010-05-14
EP2308117A2 (de) 2011-04-13
US8772818B2 (en) 2014-07-08
KR20110055568A (ko) 2011-05-25
US20110260201A1 (en) 2011-10-27
DE102008053326A1 (de) 2010-01-28
EP2308117B1 (de) 2019-12-11
JP2011529244A (ja) 2011-12-01
CN102106018A (zh) 2011-06-22

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