KR101590833B1 - 와이어 소용 가공액 공급 노즐 및 와이어 소로의 가공액 공급 방법 - Google Patents
와이어 소용 가공액 공급 노즐 및 와이어 소로의 가공액 공급 방법 Download PDFInfo
- Publication number
- KR101590833B1 KR101590833B1 KR1020140088783A KR20140088783A KR101590833B1 KR 101590833 B1 KR101590833 B1 KR 101590833B1 KR 1020140088783 A KR1020140088783 A KR 1020140088783A KR 20140088783 A KR20140088783 A KR 20140088783A KR 101590833 B1 KR101590833 B1 KR 101590833B1
- Authority
- KR
- South Korea
- Prior art keywords
- inner tube
- holes
- rod
- wire
- outer tube
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013163464A JP6171700B2 (ja) | 2013-08-06 | 2013-08-06 | ワイヤーソー用加工液供給ノズルおよびワイヤーソーへの加工液供給方法 |
JPJP-P-2013-163464 | 2013-08-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20150017294A KR20150017294A (ko) | 2015-02-16 |
KR101590833B1 true KR101590833B1 (ko) | 2016-02-02 |
Family
ID=52515864
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020140088783A KR101590833B1 (ko) | 2013-08-06 | 2014-07-15 | 와이어 소용 가공액 공급 노즐 및 와이어 소로의 가공액 공급 방법 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6171700B2 (ja) |
KR (1) | KR101590833B1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101631989B1 (ko) * | 2016-01-28 | 2016-06-20 | 영진앵글 주식회사 | 랙 시스템에 적용되는 커버링 어셈블리 |
CN110962248A (zh) * | 2018-09-28 | 2020-04-07 | 胜高股份有限公司 | 线锯用加工液供给喷嘴及向线锯供给加工液的方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008161790A (ja) | 2006-12-27 | 2008-07-17 | Canaan Seiki Kk | スリットノズル |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5940989Y2 (ja) * | 1979-01-26 | 1984-11-24 | 日立工機株式会社 | 給水量調節バルブ |
JPH04372365A (ja) * | 1991-06-21 | 1992-12-25 | Amada Co Ltd | 研削加工時における研削液供給方法およびその装置 |
JP3323621B2 (ja) * | 1993-12-29 | 2002-09-09 | 株式会社日平トヤマ | ワイヤソーのスラリ供給方法およびスラリ供給ノズル |
JPH10156660A (ja) * | 1996-11-29 | 1998-06-16 | Nippei Toyama Corp | 工作機械のクーラント供給装置 |
JP3658920B2 (ja) * | 1997-04-18 | 2005-06-15 | 信越半導体株式会社 | 半導体インゴットのスライス装置 |
JPH1148119A (ja) * | 1997-06-05 | 1999-02-23 | Nippei Toyama Corp | ワイヤソー |
JP2000084824A (ja) * | 1998-09-11 | 2000-03-28 | Tokyo Seimitsu Co Ltd | ワイヤソーのスラリ供給方法及び装置 |
JP2000141221A (ja) * | 1998-11-02 | 2000-05-23 | Tokyo Seimitsu Co Ltd | ワイヤソーの加工液供給装置 |
JP2004195555A (ja) * | 2002-12-16 | 2004-07-15 | Komatsu Electronic Metals Co Ltd | ワイヤソー用スラリーノズル |
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2013
- 2013-08-06 JP JP2013163464A patent/JP6171700B2/ja active Active
-
2014
- 2014-07-15 KR KR1020140088783A patent/KR101590833B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008161790A (ja) | 2006-12-27 | 2008-07-17 | Canaan Seiki Kk | スリットノズル |
Also Published As
Publication number | Publication date |
---|---|
JP2015030082A (ja) | 2015-02-16 |
KR20150017294A (ko) | 2015-02-16 |
JP6171700B2 (ja) | 2017-08-02 |
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