KR101590833B1 - 와이어 소용 가공액 공급 노즐 및 와이어 소로의 가공액 공급 방법 - Google Patents

와이어 소용 가공액 공급 노즐 및 와이어 소로의 가공액 공급 방법 Download PDF

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Publication number
KR101590833B1
KR101590833B1 KR1020140088783A KR20140088783A KR101590833B1 KR 101590833 B1 KR101590833 B1 KR 101590833B1 KR 1020140088783 A KR1020140088783 A KR 1020140088783A KR 20140088783 A KR20140088783 A KR 20140088783A KR 101590833 B1 KR101590833 B1 KR 101590833B1
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KR
South Korea
Prior art keywords
inner tube
holes
rod
wire
outer tube
Prior art date
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KR1020140088783A
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English (en)
Korean (ko)
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KR20150017294A (ko
Inventor
요시히로 에토우
다이스케 하시모토
켄타 나카무라
Original Assignee
가부시키가이샤 사무코
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Application filed by 가부시키가이샤 사무코 filed Critical 가부시키가이샤 사무코
Publication of KR20150017294A publication Critical patent/KR20150017294A/ko
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Publication of KR101590833B1 publication Critical patent/KR101590833B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020140088783A 2013-08-06 2014-07-15 와이어 소용 가공액 공급 노즐 및 와이어 소로의 가공액 공급 방법 KR101590833B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013163464A JP6171700B2 (ja) 2013-08-06 2013-08-06 ワイヤーソー用加工液供給ノズルおよびワイヤーソーへの加工液供給方法
JPJP-P-2013-163464 2013-08-06

Publications (2)

Publication Number Publication Date
KR20150017294A KR20150017294A (ko) 2015-02-16
KR101590833B1 true KR101590833B1 (ko) 2016-02-02

Family

ID=52515864

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140088783A KR101590833B1 (ko) 2013-08-06 2014-07-15 와이어 소용 가공액 공급 노즐 및 와이어 소로의 가공액 공급 방법

Country Status (2)

Country Link
JP (1) JP6171700B2 (ja)
KR (1) KR101590833B1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101631989B1 (ko) * 2016-01-28 2016-06-20 영진앵글 주식회사 랙 시스템에 적용되는 커버링 어셈블리
CN110962248A (zh) * 2018-09-28 2020-04-07 胜高股份有限公司 线锯用加工液供给喷嘴及向线锯供给加工液的方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008161790A (ja) 2006-12-27 2008-07-17 Canaan Seiki Kk スリットノズル

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5940989Y2 (ja) * 1979-01-26 1984-11-24 日立工機株式会社 給水量調節バルブ
JPH04372365A (ja) * 1991-06-21 1992-12-25 Amada Co Ltd 研削加工時における研削液供給方法およびその装置
JP3323621B2 (ja) * 1993-12-29 2002-09-09 株式会社日平トヤマ ワイヤソーのスラリ供給方法およびスラリ供給ノズル
JPH10156660A (ja) * 1996-11-29 1998-06-16 Nippei Toyama Corp 工作機械のクーラント供給装置
JP3658920B2 (ja) * 1997-04-18 2005-06-15 信越半導体株式会社 半導体インゴットのスライス装置
JPH1148119A (ja) * 1997-06-05 1999-02-23 Nippei Toyama Corp ワイヤソー
JP2000084824A (ja) * 1998-09-11 2000-03-28 Tokyo Seimitsu Co Ltd ワイヤソーのスラリ供給方法及び装置
JP2000141221A (ja) * 1998-11-02 2000-05-23 Tokyo Seimitsu Co Ltd ワイヤソーの加工液供給装置
JP2004195555A (ja) * 2002-12-16 2004-07-15 Komatsu Electronic Metals Co Ltd ワイヤソー用スラリーノズル

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008161790A (ja) 2006-12-27 2008-07-17 Canaan Seiki Kk スリットノズル

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Publication number Publication date
JP2015030082A (ja) 2015-02-16
KR20150017294A (ko) 2015-02-16
JP6171700B2 (ja) 2017-08-02

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