KR101587008B1 - 기판상의 다중 구역들의 모니터링을 위한 선택 기준 라이브러리들 - Google Patents

기판상의 다중 구역들의 모니터링을 위한 선택 기준 라이브러리들 Download PDF

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KR101587008B1
KR101587008B1 KR1020137005009A KR20137005009A KR101587008B1 KR 101587008 B1 KR101587008 B1 KR 101587008B1 KR 1020137005009 A KR1020137005009 A KR 1020137005009A KR 20137005009 A KR20137005009 A KR 20137005009A KR 101587008 B1 KR101587008 B1 KR 101587008B1
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libraries
polishing
substrate
library
monitoring system
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KR20130135237A (ko
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준 퀴안
보거슬로 에이. 스웨덱
해리 큐. 이
제프리 드루에 데이비드
시바쿠마르 드한다파니
토마스 에이치. 오스터헬드
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어플라이드 머티어리얼스, 인코포레이티드
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0208—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the configuration of the monitoring system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31459—Library with metrology plan for different type of workpieces
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45232—CMP chemical mechanical polishing of wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020137005009A 2010-07-30 2011-07-22 기판상의 다중 구역들의 모니터링을 위한 선택 기준 라이브러리들 Active KR101587008B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/847,721 2010-07-30
US12/847,721 US8954186B2 (en) 2010-07-30 2010-07-30 Selecting reference libraries for monitoring of multiple zones on a substrate
PCT/US2011/045096 WO2012015699A2 (en) 2010-07-30 2011-07-22 Selecting reference libraries for monitoring of multiple zones on a substrate

Publications (2)

Publication Number Publication Date
KR20130135237A KR20130135237A (ko) 2013-12-10
KR101587008B1 true KR101587008B1 (ko) 2016-01-20

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KR1020137005009A Active KR101587008B1 (ko) 2010-07-30 2011-07-22 기판상의 다중 구역들의 모니터링을 위한 선택 기준 라이브러리들

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Country Link
US (1) US8954186B2 (enExample)
JP (1) JP2013532912A (enExample)
KR (1) KR101587008B1 (enExample)
TW (1) TWI518762B (enExample)
WO (1) WO2012015699A2 (enExample)

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US20120034844A1 (en) * 2010-08-05 2012-02-09 Applied Materials, Inc. Spectrographic monitoring using index tracking after detection of layer clearing
US9296084B2 (en) * 2012-07-19 2016-03-29 Applied Materials, Inc. Polishing control using weighting with default sequence
KR20150085000A (ko) 2012-11-16 2015-07-22 어플라이드 머티어리얼스, 인코포레이티드 캐리어 헤드용 센서들에 의한 기록 측정들
JP6107353B2 (ja) * 2013-04-12 2017-04-05 株式会社島津製作所 表面処理状況モニタリング装置
US10048748B2 (en) * 2013-11-12 2018-08-14 Excalibur Ip, Llc Audio-visual interaction with user devices
US10399203B2 (en) 2014-04-22 2019-09-03 Ebara Corporation Polishing method and polishing apparatus

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US20080206993A1 (en) 2007-02-23 2008-08-28 Lee Harry Q Using Spectra to Determine Polishing Endpoints
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Also Published As

Publication number Publication date
US8954186B2 (en) 2015-02-10
WO2012015699A3 (en) 2012-05-24
WO2012015699A2 (en) 2012-02-02
US20120028813A1 (en) 2012-02-02
TWI518762B (zh) 2016-01-21
KR20130135237A (ko) 2013-12-10
TW201212114A (en) 2012-03-16
JP2013532912A (ja) 2013-08-19

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