TWI518762B - 為監控在基材上的多個區域而選擇參考資料庫 - Google Patents
為監控在基材上的多個區域而選擇參考資料庫 Download PDFInfo
- Publication number
- TWI518762B TWI518762B TW100124261A TW100124261A TWI518762B TW I518762 B TWI518762 B TW I518762B TW 100124261 A TW100124261 A TW 100124261A TW 100124261 A TW100124261 A TW 100124261A TW I518762 B TWI518762 B TW I518762B
- Authority
- TW
- Taiwan
- Prior art keywords
- databases
- substrate
- region
- grinding
- subset
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 234
- 238000012544 monitoring process Methods 0.000 title claims description 41
- 238000001228 spectrum Methods 0.000 claims description 154
- 238000000227 grinding Methods 0.000 claims description 99
- 238000005498 polishing Methods 0.000 claims description 88
- 238000000034 method Methods 0.000 claims description 47
- 230000003595 spectral effect Effects 0.000 claims description 33
- 238000005259 measurement Methods 0.000 claims description 22
- 238000011065 in-situ storage Methods 0.000 claims description 11
- 238000004590 computer program Methods 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 description 32
- 238000012886 linear function Methods 0.000 description 24
- 238000007517 polishing process Methods 0.000 description 20
- 230000008569 process Effects 0.000 description 18
- 235000012431 wafers Nutrition 0.000 description 13
- 230000006870 function Effects 0.000 description 10
- 230000015654 memory Effects 0.000 description 9
- 238000012545 processing Methods 0.000 description 7
- 238000003801 milling Methods 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 238000004364 calculation method Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 238000005070 sampling Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000012625 in-situ measurement Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000012795 verification Methods 0.000 description 3
- 101150107278 POLD1 gene Proteins 0.000 description 2
- 101150043219 POLD2 gene Proteins 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- VSQYNPJPULBZKU-UHFFFAOYSA-N mercury xenon Chemical compound [Xe].[Hg] VSQYNPJPULBZKU-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0208—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the configuration of the monitoring system
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31459—Library with metrology plan for different type of workpieces
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45232—CMP chemical mechanical polishing of wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/847,721 US8954186B2 (en) | 2010-07-30 | 2010-07-30 | Selecting reference libraries for monitoring of multiple zones on a substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201212114A TW201212114A (en) | 2012-03-16 |
| TWI518762B true TWI518762B (zh) | 2016-01-21 |
Family
ID=45527300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100124261A TWI518762B (zh) | 2010-07-30 | 2011-07-08 | 為監控在基材上的多個區域而選擇參考資料庫 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8954186B2 (enExample) |
| JP (1) | JP2013532912A (enExample) |
| KR (1) | KR101587008B1 (enExample) |
| TW (1) | TWI518762B (enExample) |
| WO (1) | WO2012015699A2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120034844A1 (en) * | 2010-08-05 | 2012-02-09 | Applied Materials, Inc. | Spectrographic monitoring using index tracking after detection of layer clearing |
| US9296084B2 (en) * | 2012-07-19 | 2016-03-29 | Applied Materials, Inc. | Polishing control using weighting with default sequence |
| KR20150085000A (ko) | 2012-11-16 | 2015-07-22 | 어플라이드 머티어리얼스, 인코포레이티드 | 캐리어 헤드용 센서들에 의한 기록 측정들 |
| JP6107353B2 (ja) * | 2013-04-12 | 2017-04-05 | 株式会社島津製作所 | 表面処理状況モニタリング装置 |
| US10048748B2 (en) * | 2013-11-12 | 2018-08-14 | Excalibur Ip, Llc | Audio-visual interaction with user devices |
| WO2015163164A1 (ja) * | 2014-04-22 | 2015-10-29 | 株式会社 荏原製作所 | 研磨方法および研磨装置 |
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| WO2010062497A2 (en) * | 2008-10-27 | 2010-06-03 | Applied Materials, Inc. | Goodness of fit in spectrographic monitoring of a substrate during processing |
| US20100114532A1 (en) | 2008-11-03 | 2010-05-06 | Applied Materials, Inc. | Weighted spectrographic monitoring of a substrate during processing |
| US8579675B2 (en) | 2008-11-26 | 2013-11-12 | Applied Materials, Inc. | Methods of using optical metrology for feed back and feed forward process control |
-
2010
- 2010-07-30 US US12/847,721 patent/US8954186B2/en active Active
-
2011
- 2011-07-08 TW TW100124261A patent/TWI518762B/zh active
- 2011-07-22 WO PCT/US2011/045096 patent/WO2012015699A2/en not_active Ceased
- 2011-07-22 JP JP2013523190A patent/JP2013532912A/ja active Pending
- 2011-07-22 KR KR1020137005009A patent/KR101587008B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20120028813A1 (en) | 2012-02-02 |
| TW201212114A (en) | 2012-03-16 |
| KR101587008B1 (ko) | 2016-01-20 |
| KR20130135237A (ko) | 2013-12-10 |
| WO2012015699A3 (en) | 2012-05-24 |
| JP2013532912A (ja) | 2013-08-19 |
| WO2012015699A2 (en) | 2012-02-02 |
| US8954186B2 (en) | 2015-02-10 |
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