KR101576118B1 - 임프린트 장치 및 물품의 제조 방법 - Google Patents

임프린트 장치 및 물품의 제조 방법 Download PDF

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KR101576118B1
KR101576118B1 KR1020120073634A KR20120073634A KR101576118B1 KR 101576118 B1 KR101576118 B1 KR 101576118B1 KR 1020120073634 A KR1020120073634 A KR 1020120073634A KR 20120073634 A KR20120073634 A KR 20120073634A KR 101576118 B1 KR101576118 B1 KR 101576118B1
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South Korea
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mold
substrate
mark
holder
information
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KR20130009630A (ko
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다다시 하또리
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캐논 가부시끼가이샤
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023Microembossing

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020120073634A 2011-07-15 2012-07-06 임프린트 장치 및 물품의 제조 방법 Active KR101576118B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011157123A JP5864929B2 (ja) 2011-07-15 2011-07-15 インプリント装置および物品の製造方法
JPJP-P-2011-157123 2011-07-15

Publications (2)

Publication Number Publication Date
KR20130009630A KR20130009630A (ko) 2013-01-23
KR101576118B1 true KR101576118B1 (ko) 2015-12-10

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KR1020120073634A Active KR101576118B1 (ko) 2011-07-15 2012-07-06 임프린트 장치 및 물품의 제조 방법

Country Status (4)

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US (1) US9810979B2 (enExample)
JP (1) JP5864929B2 (enExample)
KR (1) KR101576118B1 (enExample)
TW (1) TWI554378B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6333039B2 (ja) * 2013-05-16 2018-05-30 キヤノン株式会社 インプリント装置、デバイス製造方法およびインプリント方法
JP6120678B2 (ja) 2013-05-27 2017-04-26 キヤノン株式会社 インプリント方法、インプリント装置及びデバイス製造方法
JP6271875B2 (ja) * 2013-06-18 2018-01-31 キヤノン株式会社 インプリント装置、インプリント方法および物品の製造方法
JP6315904B2 (ja) 2013-06-28 2018-04-25 キヤノン株式会社 インプリント方法、インプリント装置及びデバイスの製造方法
JP2015170815A (ja) 2014-03-10 2015-09-28 キヤノン株式会社 インプリント装置、アライメント方法及び物品の製造方法
JP6415120B2 (ja) 2014-06-09 2018-10-31 キヤノン株式会社 インプリント装置及び物品の製造方法
US10538017B2 (en) 2014-09-22 2020-01-21 Koninklijke Philips N.V. Transfer method and apparatus and computer program product
JP6497938B2 (ja) * 2015-01-05 2019-04-10 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法。
US10248018B2 (en) * 2015-03-30 2019-04-02 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
EP3297319B1 (en) * 2015-05-08 2021-07-14 LG Electronics Inc. Methods and devices for transmitting/receiving data using transport block size defined for machine type communication terminal in wireless access system supporting machine type communication
JP6381721B2 (ja) * 2017-03-30 2018-08-29 キヤノン株式会社 インプリント方法、インプリント装置及びデバイス製造方法
US11175598B2 (en) 2017-06-30 2021-11-16 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
JP6979845B2 (ja) * 2017-10-11 2021-12-15 キヤノン株式会社 インプリント装置および物品製造方法
JP6560736B2 (ja) * 2017-12-28 2019-08-14 キヤノン株式会社 インプリント装置、インプリント方法および物品の製造方法
US12266579B2 (en) * 2021-08-30 2025-04-01 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for adjusting the gap between a wafer and a top plate in a thin-film deposition process
EP4390539A1 (en) * 2022-12-19 2024-06-26 Koninklijke Philips N.V. Alignment method for imprint method

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060005657A1 (en) * 2004-06-01 2006-01-12 Molecular Imprints, Inc. Method and system to control movement of a body for nano-scale manufacturing
US7027156B2 (en) * 2002-08-01 2006-04-11 Molecular Imprints, Inc. Scatterometry alignment for imprint lithography
TW568349U (en) * 2003-05-02 2003-12-21 Ind Tech Res Inst Parallelism adjusting device for nano-transferring
JP2005101201A (ja) * 2003-09-24 2005-04-14 Canon Inc ナノインプリント装置
JP4574240B2 (ja) * 2004-06-11 2010-11-04 キヤノン株式会社 加工装置、加工方法、デバイス製造方法
US7309225B2 (en) * 2004-08-13 2007-12-18 Molecular Imprints, Inc. Moat system for an imprint lithography template
JP3958344B2 (ja) * 2005-06-07 2007-08-15 キヤノン株式会社 インプリント装置、インプリント方法及びチップの製造方法
JP4290177B2 (ja) * 2005-06-08 2009-07-01 キヤノン株式会社 モールド、アライメント方法、パターン形成装置、パターン転写装置、及びチップの製造方法
US7298495B2 (en) * 2005-06-23 2007-11-20 Lewis George C System and method for positioning an object through use of a rotating laser metrology system
JP4533358B2 (ja) * 2005-10-18 2010-09-01 キヤノン株式会社 インプリント方法、インプリント装置およびチップの製造方法
JP2007173614A (ja) * 2005-12-22 2007-07-05 Ricoh Co Ltd 微細加工装置
US7875866B2 (en) * 2006-03-24 2011-01-25 Pioneer Corporation Beam recording apparatus and beam adjustment method
JP4185941B2 (ja) * 2006-04-04 2008-11-26 キヤノン株式会社 ナノインプリント方法及びナノインプリント装置
JP4795300B2 (ja) * 2006-04-18 2011-10-19 キヤノン株式会社 位置合わせ方法、インプリント方法、位置合わせ装置、インプリント装置、及び位置計測方法
JP4958614B2 (ja) * 2006-04-18 2012-06-20 キヤノン株式会社 パターン転写装置、インプリント装置、パターン転写方法および位置合わせ装置
JP4848832B2 (ja) * 2006-05-09 2011-12-28 凸版印刷株式会社 ナノインプリント装置及びナノインプリント方法
JP5371349B2 (ja) * 2008-09-19 2013-12-18 キヤノン株式会社 インプリント装置、および物品の製造方法
JP2010080631A (ja) * 2008-09-25 2010-04-08 Canon Inc 押印装置および物品の製造方法
JP2010080630A (ja) 2008-09-25 2010-04-08 Canon Inc 押印装置および物品の製造方法
JP5361309B2 (ja) 2008-09-25 2013-12-04 キヤノン株式会社 インプリント装置およびインプリント方法
NL2004281A (en) * 2009-03-19 2010-09-20 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
JP2010283207A (ja) * 2009-06-05 2010-12-16 Toshiba Corp パターン形成装置およびパターン形成方法
NL2005092A (en) * 2009-07-16 2011-01-18 Asml Netherlands Bv Object alignment measurement method and apparatus.
JP5662741B2 (ja) * 2009-09-30 2015-02-04 キヤノン株式会社 インプリント装置および物品の製造方法
JP2011124346A (ja) * 2009-12-09 2011-06-23 Canon Inc インプリント装置及び物品の製造方法
JP5809409B2 (ja) * 2009-12-17 2015-11-10 キヤノン株式会社 インプリント装置及びパターン転写方法
NL2006454A (en) * 2010-05-03 2011-11-07 Asml Netherlands Bv Imprint lithography method and apparatus.
JP5539011B2 (ja) * 2010-05-14 2014-07-02 キヤノン株式会社 インプリント装置、検出装置、位置合わせ装置、及び物品の製造方法
JP5669466B2 (ja) * 2010-07-12 2015-02-12 キヤノン株式会社 保持装置、インプリント装置及び物品の製造方法
JP2013538447A (ja) * 2010-08-05 2013-10-10 エーエスエムエル ネザーランズ ビー.ブイ. インプリントリソグラフィ
JP5395769B2 (ja) * 2010-09-13 2014-01-22 株式会社東芝 テンプレートチャック、インプリント装置、及びパターン形成方法
JP6039222B2 (ja) * 2011-05-10 2016-12-07 キヤノン株式会社 検出装置、検出方法、インプリント装置及びデバイス製造方法
JP6066565B2 (ja) * 2012-01-31 2017-01-25 キヤノン株式会社 インプリント装置、および、物品の製造方法
JP6180131B2 (ja) * 2012-03-19 2017-08-16 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP5723337B2 (ja) * 2012-09-07 2015-05-27 株式会社東芝 パターン形成方法及びパターン形成装置

Also Published As

Publication number Publication date
JP2013026288A (ja) 2013-02-04
JP5864929B2 (ja) 2016-02-17
TWI554378B (zh) 2016-10-21
US9810979B2 (en) 2017-11-07
TW201302419A (zh) 2013-01-16
KR20130009630A (ko) 2013-01-23
US20130015597A1 (en) 2013-01-17

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