KR101563418B1 - 와이어 쏘 및 와이어 쏘의 제조방법 - Google Patents

와이어 쏘 및 와이어 쏘의 제조방법 Download PDF

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Publication number
KR101563418B1
KR101563418B1 KR1020140023279A KR20140023279A KR101563418B1 KR 101563418 B1 KR101563418 B1 KR 101563418B1 KR 1020140023279 A KR1020140023279 A KR 1020140023279A KR 20140023279 A KR20140023279 A KR 20140023279A KR 101563418 B1 KR101563418 B1 KR 101563418B1
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KR
South Korea
Prior art keywords
layer
abrasive grains
wire saw
electrodeposition
abriboelectric
Prior art date
Application number
KR1020140023279A
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English (en)
Korean (ko)
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KR20140122999A (ko
Inventor
미야사카 요시오
카토 오사무
사사베 히로시
니시오 타카히데
사카타 신이치
Original Assignee
가부시키가이샤 후지키한
와이어 엔지니어링 프로덕티버티 엘엘씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 가부시키가이샤 후지키한, 와이어 엔지니어링 프로덕티버티 엘엘씨 filed Critical 가부시키가이샤 후지키한
Publication of KR20140122999A publication Critical patent/KR20140122999A/ko
Application granted granted Critical
Publication of KR101563418B1 publication Critical patent/KR101563418B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020140023279A 2013-04-11 2014-02-27 와이어 쏘 및 와이어 쏘의 제조방법 KR101563418B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-083332 2013-04-11
JP2013083332A JP6245833B2 (ja) 2013-04-11 2013-04-11 ワイヤソーの製造方法

Publications (2)

Publication Number Publication Date
KR20140122999A KR20140122999A (ko) 2014-10-21
KR101563418B1 true KR101563418B1 (ko) 2015-10-26

Family

ID=51666008

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140023279A KR101563418B1 (ko) 2013-04-11 2014-02-27 와이어 쏘 및 와이어 쏘의 제조방법

Country Status (4)

Country Link
JP (1) JP6245833B2 (ja)
KR (1) KR101563418B1 (ja)
CN (1) CN104097270B (ja)
TW (1) TWI566864B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104908500B (zh) * 2015-05-18 2017-08-25 刘肖梅 一种钢丝纹理加工装置的雕刻轮
CN104849211B (zh) * 2015-05-27 2017-11-17 深圳市常兴技术股份有限公司 电镀磨具表面金刚石加厚程度的检测方法
CN106086950B (zh) * 2016-06-24 2018-12-18 中国有色桂林矿产地质研究院有限公司 一种齿缝镶嵌金刚石的内圆刀片的制备方法
CN108527664A (zh) * 2018-02-09 2018-09-14 江苏中博钻石科技有限公司 环形金刚石线锯切割装置
CN110091435A (zh) * 2019-06-12 2019-08-06 成都易德莱斯科技有限公司 负反馈自动调控绳锯及调控方法
CN110704985A (zh) * 2019-10-16 2020-01-17 北京航空航天大学 一种渐开线砂轮磨削表面形貌仿真方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010201542A (ja) * 2009-03-02 2010-09-16 Sumitomo Electric Ind Ltd ダイヤモンドワイヤーソー、ダイヤモンドワイヤーソーの製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10100070A (ja) * 1996-09-26 1998-04-21 Toyota Banmotsupusu Kk メタルボンド砥石
KR100299102B1 (ko) * 1998-11-24 2001-11-22 홍영철 취성재료절단용다이아몬드전착와이어및그제조방법
JP2002075767A (ja) * 2000-08-31 2002-03-15 Sumitomo Special Metals Co Ltd 耐食性被膜を有する希土類系永久磁石およびその製造方法
TW571000B (en) * 2001-10-19 2004-01-11 Nihon Parkerizing Methods of preparing metal wires for plastic processing
JP2004009238A (ja) * 2002-06-10 2004-01-15 Kanai Hiroaki ソーワイヤ製造方法及びソーワイヤ
JP2007152485A (ja) * 2005-12-05 2007-06-21 Kanai Hiroaki ソーワイヤの製造方法
DE602005014019D1 (de) * 2005-12-27 2009-05-28 Japan Fine Steel Co Ltd Fester schleifdraht
JP2007268627A (ja) * 2006-03-30 2007-10-18 Noritake Super Abrasive:Kk 電着ワイヤソー
KR20120038550A (ko) * 2009-08-14 2012-04-23 생-고벵 아브라시프 연신체에 연마입자가 결합된 연마제품
JP5576177B2 (ja) * 2010-04-28 2014-08-20 株式会社リード 固定砥粒ワイヤーソー及びその製造方法
JP2012157908A (ja) * 2011-01-28 2012-08-23 Sumco Corp 硬脆性材料のスライス方法
JP5863170B2 (ja) * 2011-01-31 2016-02-16 サンコール株式会社 固定砥粒ワイヤの製造方法
TWM412050U (en) * 2011-03-17 2011-09-21 Tomohiko Sinosaki Wire saw structure with fixed abrasive particle
KR20120117594A (ko) * 2011-04-16 2012-10-24 다이섹(주) 엔드리스 와이어 톱용 컷팅 비드
JP2014530770A (ja) * 2011-09-16 2014-11-20 サンーゴバンアブレイシブズ，インコーポレイティド 研磨物品および形成方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010201542A (ja) * 2009-03-02 2010-09-16 Sumitomo Electric Ind Ltd ダイヤモンドワイヤーソー、ダイヤモンドワイヤーソーの製造方法

Also Published As

Publication number Publication date
CN104097270B (zh) 2016-03-30
CN104097270A (zh) 2014-10-15
TWI566864B (zh) 2017-01-21
JP6245833B2 (ja) 2017-12-13
JP2014205211A (ja) 2014-10-30
KR20140122999A (ko) 2014-10-21
TW201438833A (zh) 2014-10-16

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