KR101555389B1 - 전극 어셈블리 플레넘을 세정하는 방법 및 세정 픽스쳐 - Google Patents
전극 어셈블리 플레넘을 세정하는 방법 및 세정 픽스쳐 Download PDFInfo
- Publication number
- KR101555389B1 KR101555389B1 KR1020107010167A KR20107010167A KR101555389B1 KR 101555389 B1 KR101555389 B1 KR 101555389B1 KR 1020107010167 A KR1020107010167 A KR 1020107010167A KR 20107010167 A KR20107010167 A KR 20107010167A KR 101555389 B1 KR101555389 B1 KR 101555389B1
- Authority
- KR
- South Korea
- Prior art keywords
- fluid
- plenum
- cleaning
- ports
- cleaning fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
Landscapes
- Drying Of Semiconductors (AREA)
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/869,340 US7736441B2 (en) | 2007-10-09 | 2007-10-09 | Cleaning fixtures and methods of cleaning electrode assembly plenums |
| US11/869,340 | 2007-10-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20100090768A KR20100090768A (ko) | 2010-08-17 |
| KR101555389B1 true KR101555389B1 (ko) | 2015-09-23 |
Family
ID=40522244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020107010167A Active KR101555389B1 (ko) | 2007-10-09 | 2008-09-09 | 전극 어셈블리 플레넘을 세정하는 방법 및 세정 픽스쳐 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7736441B2 (enExample) |
| JP (1) | JP5579068B2 (enExample) |
| KR (1) | KR101555389B1 (enExample) |
| TW (1) | TWI390613B (enExample) |
| WO (1) | WO2009048702A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10391526B2 (en) | 2013-12-12 | 2019-08-27 | Lam Research Corporation | Electrostatic chuck cleaning fixture |
| JP5764228B1 (ja) * | 2014-03-18 | 2015-08-12 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法、プログラム及び記録媒体 |
| JP5885870B2 (ja) * | 2015-04-06 | 2016-03-16 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法、プログラム及び記録媒体 |
| CN112222096B (zh) * | 2019-07-15 | 2023-10-10 | 长鑫存储技术有限公司 | 清洁装置以及晶圆处理设备以及晶圆载台的清洁方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005109194A (ja) * | 2003-09-30 | 2005-04-21 | Japan Steel Works Ltd:The | Cvd反応室のクリーニング装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5273588A (en) * | 1992-06-15 | 1993-12-28 | Materials Research Corporation | Semiconductor wafer processing CVD reactor apparatus comprising contoured electrode gas directing means |
| US5266153A (en) * | 1992-06-16 | 1993-11-30 | National Semiconductor Corp. | Gas distribution head for plasma deposition and etch systems |
| JP2005167087A (ja) * | 2003-12-04 | 2005-06-23 | Tokyo Electron Ltd | クリーニング方法及び半導体製造装置 |
| US7645341B2 (en) * | 2003-12-23 | 2010-01-12 | Lam Research Corporation | Showerhead electrode assembly for plasma processing apparatuses |
| JP2006128485A (ja) * | 2004-10-29 | 2006-05-18 | Asm Japan Kk | 半導体処理装置 |
| US7052553B1 (en) * | 2004-12-01 | 2006-05-30 | Lam Research Corporation | Wet cleaning of electrostatic chucks |
| US7442114B2 (en) * | 2004-12-23 | 2008-10-28 | Lam Research Corporation | Methods for silicon electrode assembly etch rate and etch uniformity recovery |
| US7247579B2 (en) * | 2004-12-23 | 2007-07-24 | Lam Research Corporation | Cleaning methods for silicon electrode assembly surface contamination removal |
| US7507670B2 (en) * | 2004-12-23 | 2009-03-24 | Lam Research Corporation | Silicon electrode assembly surface decontamination by acidic solution |
| US7638004B1 (en) * | 2006-05-31 | 2009-12-29 | Lam Research Corporation | Method for cleaning microwave applicator tube |
| US7942973B2 (en) * | 2006-10-16 | 2011-05-17 | Lam Research Corporation | Methods and apparatus for wet cleaning electrode assemblies for plasma processing apparatuses |
| US8221552B2 (en) * | 2007-03-30 | 2012-07-17 | Lam Research Corporation | Cleaning of bonded silicon electrodes |
| US7578889B2 (en) * | 2007-03-30 | 2009-08-25 | Lam Research Corporation | Methodology for cleaning of surface metal contamination from electrode assemblies |
| JP2007204855A (ja) * | 2007-05-20 | 2007-08-16 | Tokyo Electron Ltd | 成膜装置 |
-
2007
- 2007-10-09 US US11/869,340 patent/US7736441B2/en not_active Expired - Fee Related
-
2008
- 2008-09-09 KR KR1020107010167A patent/KR101555389B1/ko active Active
- 2008-09-09 JP JP2010528919A patent/JP5579068B2/ja not_active Expired - Fee Related
- 2008-09-09 WO PCT/US2008/075675 patent/WO2009048702A1/en not_active Ceased
- 2008-09-10 TW TW097134774A patent/TWI390613B/zh not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005109194A (ja) * | 2003-09-30 | 2005-04-21 | Japan Steel Works Ltd:The | Cvd反応室のクリーニング装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US7736441B2 (en) | 2010-06-15 |
| WO2009048702A1 (en) | 2009-04-16 |
| JP5579068B2 (ja) | 2014-08-27 |
| JP2011501411A (ja) | 2011-01-06 |
| TW200933713A (en) | 2009-08-01 |
| US20090090393A1 (en) | 2009-04-09 |
| KR20100090768A (ko) | 2010-08-17 |
| TWI390613B (zh) | 2013-03-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101555389B1 (ko) | 전극 어셈블리 플레넘을 세정하는 방법 및 세정 픽스쳐 | |
| KR101438705B1 (ko) | 기판 처리 샤워헤드용의 재구성 가능한 복수-구역 가스 전달 하드웨어 | |
| KR101598516B1 (ko) | 가열식 샤워헤드 조립체 | |
| KR101637498B1 (ko) | 웨이퍼 수납용기 | |
| TWI618141B (zh) | 晶圓處理設備中的化學物質控制特徵 | |
| WO2007131057A4 (en) | Vacuum processing chamber suitable for etching high aspect ratio features and components of same | |
| CN101314867B (zh) | 狭口阀 | |
| CN207966923U (zh) | 晶元处理设备的排气装置 | |
| KR101758213B1 (ko) | 가스 노즐플레이트를 구비한 사이드 스토리지 | |
| KR20020020854A (ko) | 유체 제어 장치 및 이것을 이용한 가스 처리 장치 | |
| KR20220035488A (ko) | 반도체 처리 챔버들 및 이를 세정하기 위한 방법들 | |
| KR20160140486A (ko) | 멀티-층 세라믹 제조 기법들을 사용한 라이트업 방지 | |
| EP1715279A4 (en) | HEAT EXCHANGER, METHOD FOR ITS MANUFACTURE AND ARTIFICIAL HEART-LUNG MACHINE | |
| CN108102877A (zh) | 一种集成单细胞捕获与筛选功能的微流控芯片与筛选方法 | |
| KR102036391B1 (ko) | 가스 주입기를 세정하기 위한 시스템 및 방법 | |
| KR20080095103A (ko) | 세정 및 배기 장치 | |
| JP2011501411A5 (enExample) | ||
| KR20120045758A (ko) | 비접촉식 이송장치 | |
| KR20250135845A (ko) | 질량 유동 제어기 기반 고속 가스 교환 | |
| KR20240010213A (ko) | 공압 피딩 블록체 및 이를 포함하는 기판 처리 장치 | |
| KR20090095915A (ko) | 밸브조립체 및 그를 가지는 진공처리장치 | |
| KR101056040B1 (ko) | 기판흡착용 진공 척 | |
| KR102187532B1 (ko) | 기판처리장치의 진공 처킹 서셉터 | |
| KR101486801B1 (ko) | 증착챔버의 노즐장치 및 그 제조방법 | |
| JP4522984B2 (ja) | プラズマ処理装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| FPAY | Annual fee payment |
Payment date: 20180904 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |