KR101535126B1 - 회로 형성 방법 - Google Patents

회로 형성 방법 Download PDF

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Publication number
KR101535126B1
KR101535126B1 KR1020107009592A KR20107009592A KR101535126B1 KR 101535126 B1 KR101535126 B1 KR 101535126B1 KR 1020107009592 A KR1020107009592 A KR 1020107009592A KR 20107009592 A KR20107009592 A KR 20107009592A KR 101535126 B1 KR101535126 B1 KR 101535126B1
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KR
South Korea
Prior art keywords
trench
circuit pattern
circuit
insulating resin
plating
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Application number
KR1020107009592A
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English (en)
Korean (ko)
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KR20100075589A (ko
Inventor
시게오 하시모토
데루유키 홋타
다카히로 이시자키
Original Assignee
우에무라 고교 가부시키가이샤
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Publication of KR20100075589A publication Critical patent/KR20100075589A/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Chemically Coating (AREA)
KR1020107009592A 2007-11-01 2008-10-03 회로 형성 방법 Active KR101535126B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2007-285363 2007-11-01
JP2007285363A JP5209938B2 (ja) 2007-11-01 2007-11-01 回路形成方法
PCT/JP2008/068085 WO2009057419A1 (ja) 2007-11-01 2008-10-03 回路形成方法

Publications (2)

Publication Number Publication Date
KR20100075589A KR20100075589A (ko) 2010-07-02
KR101535126B1 true KR101535126B1 (ko) 2015-07-08

Family

ID=40590813

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107009592A Active KR101535126B1 (ko) 2007-11-01 2008-10-03 회로 형성 방법

Country Status (6)

Country Link
US (1) US8262831B2 (enExample)
JP (1) JP5209938B2 (enExample)
KR (1) KR101535126B1 (enExample)
CN (1) CN101911846B (enExample)
TW (1) TW200934325A (enExample)
WO (1) WO2009057419A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011062252A1 (ja) * 2009-11-19 2011-05-26 株式会社村田製作所 部品内蔵モジュールの製造方法および部品内蔵モジュール
JP2011151172A (ja) * 2010-01-21 2011-08-04 Seiko Epson Corp 回路配線形成方法、回路基板、及び配線膜の膜厚が配線膜の幅より大きい回路配線膜
JP2011155035A (ja) * 2010-01-26 2011-08-11 Seiko Epson Corp 回路配線形成方法、回路基板、及び配線膜の膜厚が配線膜の幅より大きい回路配線膜
JP5676908B2 (ja) * 2010-04-21 2015-02-25 上村工業株式会社 プリント配線基板の表面処理方法及び表面処理剤
KR101284595B1 (ko) * 2011-12-23 2013-07-15 한국생산기술연구원 멀티 터치용 터치 스크린 패널 및 그 제조 방법
JP2013216731A (ja) * 2012-04-05 2013-10-24 Kyoritsu Kagaku Sangyo Kk カチオン硬化型樹脂組成物
CN103547056A (zh) * 2012-07-12 2014-01-29 绿点高新科技股份有限公司 导电线路装置及其制造方法
US20140014401A1 (en) * 2012-07-12 2014-01-16 Taiwan Green Point Enterprises Co., Ltd. Circuit device and method for making the same
US20140023430A1 (en) * 2012-07-19 2014-01-23 Apple Inc. Attachment Techniques
JP6813496B2 (ja) * 2015-03-20 2021-01-13 コーニング インコーポレイテッド インクジェット用インク組成物、インク被覆方法、および被覆物品
CN106049035B (zh) * 2016-09-06 2018-07-10 复旦大学 一种柔性织物表面导电线路的构建方法
CN119300252A (zh) * 2017-06-15 2025-01-10 捷普有限公司 用于在金属基底上利用表面安装技术的系统、装置和方法
KR102298165B1 (ko) * 2018-03-14 2021-09-06 주식회사 엘지화학 매립형 투명 전극 기판 및 이의 제조방법
US11261529B2 (en) * 2020-03-31 2022-03-01 Futuretech Capital, Inc. Reduced visibility conductive micro mesh touch sensor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06140742A (ja) * 1992-10-29 1994-05-20 Canon Inc プリント基板及びその製造方法
JP2001291957A (ja) * 2000-04-07 2001-10-19 Toppan Printing Co Ltd 配線基板及びその製造方法
JP2005019517A (ja) * 2003-06-24 2005-01-20 Hitachi Chem Co Ltd 内層回路付金属張積層板、多層プリント配線板及びそれらの製造方法
JP2005142338A (ja) * 2003-11-06 2005-06-02 Hitachi Chem Co Ltd プリント配線板の製造方法およびプリント配線板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3805273B2 (ja) * 2002-03-29 2006-08-02 Ｕｈｔ株式会社 積層型電子部品の製造装置
EP1622435A1 (en) * 2004-07-28 2006-02-01 ATOTECH Deutschland GmbH Method of manufacturing an electronic circuit assembly using direct write techniques
CN100574573C (zh) * 2005-12-31 2009-12-23 财团法人工业技术研究院 多层印刷电路板及其制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06140742A (ja) * 1992-10-29 1994-05-20 Canon Inc プリント基板及びその製造方法
JP2001291957A (ja) * 2000-04-07 2001-10-19 Toppan Printing Co Ltd 配線基板及びその製造方法
JP2005019517A (ja) * 2003-06-24 2005-01-20 Hitachi Chem Co Ltd 内層回路付金属張積層板、多層プリント配線板及びそれらの製造方法
JP2005142338A (ja) * 2003-11-06 2005-06-02 Hitachi Chem Co Ltd プリント配線板の製造方法およびプリント配線板

Also Published As

Publication number Publication date
US20100243149A1 (en) 2010-09-30
TWI376173B (enExample) 2012-11-01
KR20100075589A (ko) 2010-07-02
WO2009057419A1 (ja) 2009-05-07
CN101911846B (zh) 2013-01-02
CN101911846A (zh) 2010-12-08
JP2009117415A (ja) 2009-05-28
US8262831B2 (en) 2012-09-11
JP5209938B2 (ja) 2013-06-12
TW200934325A (en) 2009-08-01

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