KR101531389B1 - 필름 공급 및 부착 장치, 이를 구비한 반도체 칩 패키지 제조 장치, 및 반도체 칩 패키지 제조 방법 - Google Patents

필름 공급 및 부착 장치, 이를 구비한 반도체 칩 패키지 제조 장치, 및 반도체 칩 패키지 제조 방법 Download PDF

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KR101531389B1
KR101531389B1 KR1020130144121A KR20130144121A KR101531389B1 KR 101531389 B1 KR101531389 B1 KR 101531389B1 KR 1020130144121 A KR1020130144121 A KR 1020130144121A KR 20130144121 A KR20130144121 A KR 20130144121A KR 101531389 B1 KR101531389 B1 KR 101531389B1
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South Korea
Prior art keywords
film
fluorescent film
semiconductor chip
piece
strip
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KR1020130144121A
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English (en)
Korean (ko)
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KR20150020981A (ko
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김준섭
노주섭
하상관
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(주)피엔티
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Priority to CN201410273971.3A priority Critical patent/CN104425689B/zh
Publication of KR20150020981A publication Critical patent/KR20150020981A/ko
Application granted granted Critical
Publication of KR101531389B1 publication Critical patent/KR101531389B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020130144121A 2013-08-19 2013-11-25 필름 공급 및 부착 장치, 이를 구비한 반도체 칩 패키지 제조 장치, 및 반도체 칩 패키지 제조 방법 KR101531389B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410273971.3A CN104425689B (zh) 2013-08-19 2014-06-18 供膜及贴膜装置、具有该装置的半导体芯片封装件制造装置以及半导体芯片封装件制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020130098148 2013-08-19
KR20130098148 2013-08-19

Publications (2)

Publication Number Publication Date
KR20150020981A KR20150020981A (ko) 2015-02-27
KR101531389B1 true KR101531389B1 (ko) 2015-06-24

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KR1020130144121A KR101531389B1 (ko) 2013-08-19 2013-11-25 필름 공급 및 부착 장치, 이를 구비한 반도체 칩 패키지 제조 장치, 및 반도체 칩 패키지 제조 방법

Country Status (2)

Country Link
KR (1) KR101531389B1 (zh)
CN (1) CN104425689B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101703656B1 (ko) * 2015-07-31 2017-02-08 (주) 루켄테크놀러지스 엘이디 패키지 제조장치
CN106469773B (zh) * 2015-08-18 2019-01-01 江苏诚睿达光电有限公司 一种基于led封装的有机硅树脂光转换体融膜的工艺方法及装备系统
CN106558642B (zh) * 2015-09-30 2017-12-22 江苏诚睿达光电有限公司 一种精制光转换体贴合封装led的工艺方法及精制装备系统
CN106469778B (zh) * 2015-08-18 2017-12-22 江苏诚睿达光电有限公司 一种异形有机硅树脂光转换体贴合封装led的工艺方法
CN105932144B (zh) * 2016-07-03 2018-05-01 江苏罗化新材料有限公司 一种芯片级led封装设备、方法以及荧光膜制备方法
CN110473816A (zh) * 2019-09-18 2019-11-19 佛山市佛大华康科技有限公司 一种制冷芯片封边设备
KR102626195B1 (ko) * 2020-11-27 2024-01-19 이종인 복렬형 양면테이프 부착장치
TWI777780B (zh) * 2021-09-23 2022-09-11 均華精密工業股份有限公司 供膜裝置及預剝膜機台

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009158609A (ja) * 2007-12-25 2009-07-16 Panasonic Electric Works Co Ltd チップオンフィルム（ｃｏｆ）構造の半導体装置の製造方法、及びｃｏｆ構造の半導体装置
KR20120018605A (ko) * 2010-08-23 2012-03-05 하나 마이크론(주) Ｌｅｄ 패키지 및 그 제조 방법
KR20120038723A (ko) * 2010-10-14 2012-04-24 삼성엘이디 주식회사 발광소자 패키지의 제조방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05121630A (ja) * 1991-10-29 1993-05-18 Fujitsu Ltd 樹脂パツケージのリードフレーム構造
JP2001345482A (ja) * 2000-06-01 2001-12-14 Toshiba Corp 蛍光表示装置
CN102241180A (zh) * 2010-05-11 2011-11-16 尚富煜科技股份有限公司 可自动撕离型纸的贴膜机
CN202156098U (zh) * 2011-08-04 2012-03-07 厦门市弘瀚电子科技有限公司 一种led胶膜贴膜机

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009158609A (ja) * 2007-12-25 2009-07-16 Panasonic Electric Works Co Ltd チップオンフィルム（ｃｏｆ）構造の半導体装置の製造方法、及びｃｏｆ構造の半導体装置
KR20120018605A (ko) * 2010-08-23 2012-03-05 하나 마이크론(주) Ｌｅｄ 패키지 및 그 제조 방법
KR20120038723A (ko) * 2010-10-14 2012-04-24 삼성엘이디 주식회사 발광소자 패키지의 제조방법

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CN104425689A (zh) 2015-03-18
KR20150020981A (ko) 2015-02-27
CN104425689B (zh) 2017-05-17

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