KR101521322B1 - 액처리 장치 및 액처리 방법 - Google Patents

액처리 장치 및 액처리 방법 Download PDF

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Publication number
KR101521322B1
KR101521322B1 KR1020110119560A KR20110119560A KR101521322B1 KR 101521322 B1 KR101521322 B1 KR 101521322B1 KR 1020110119560 A KR1020110119560 A KR 1020110119560A KR 20110119560 A KR20110119560 A KR 20110119560A KR 101521322 B1 KR101521322 B1 KR 101521322B1
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South Korea
Prior art keywords
substrate
wafer
holding
diw
discharge
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KR1020110119560A
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English (en)
Korean (ko)
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KR20120086236A (ko
Inventor
지로 히가시지마
노리히로 이토
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도쿄엘렉트론가부시키가이샤
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Publication of KR20120086236A publication Critical patent/KR20120086236A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/61—Electrolytic etching
    • H10P50/613—Electrolytic etching of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
KR1020110119560A 2011-01-25 2011-11-16 액처리 장치 및 액처리 방법 Active KR101521322B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-013458 2011-01-25
JP2011013458A JP5646354B2 (ja) 2011-01-25 2011-01-25 液処理装置および液処理方法

Publications (2)

Publication Number Publication Date
KR20120086236A KR20120086236A (ko) 2012-08-02
KR101521322B1 true KR101521322B1 (ko) 2015-05-18

Family

ID=46543268

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110119560A Active KR101521322B1 (ko) 2011-01-25 2011-11-16 액처리 장치 및 액처리 방법

Country Status (4)

Country Link
US (1) US9396975B2 (https=)
JP (1) JP5646354B2 (https=)
KR (1) KR101521322B1 (https=)
TW (1) TWI492283B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017010663A1 (ko) * 2015-07-13 2017-01-19 주식회사 제우스 기판 액처리 장치 및 방법

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5926086B2 (ja) * 2012-03-28 2016-05-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US9805946B2 (en) * 2013-08-30 2017-10-31 Taiwan Semiconductor Manufacturing Company Limited Photoresist removal
US9460944B2 (en) * 2014-07-02 2016-10-04 SCREEN Holdings Co., Ltd. Substrate treating apparatus and method of treating substrate
JP6376863B2 (ja) * 2014-07-02 2018-08-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6320945B2 (ja) * 2015-01-30 2018-05-09 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP6456712B2 (ja) * 2015-02-16 2019-01-23 東京エレクトロン株式会社 基板保持機構及びこれを用いた基板処理装置
KR101619166B1 (ko) * 2015-06-12 2016-05-18 카즈오 스기하라 기판의 세정·건조 처리 장치
US10720343B2 (en) 2016-05-31 2020-07-21 Lam Research Ag Method and apparatus for processing wafer-shaped articles
TWI733875B (zh) * 2016-08-10 2021-07-21 美商維克儀器公司 雙層式的膠帶框架的清洗組件
WO2018076151A1 (en) * 2016-10-25 2018-05-03 Acm Research (Shanghai) Inc. Apparatus and method for wet process on semiconductor substrate
JP6815912B2 (ja) * 2017-03-23 2021-01-20 株式会社荏原製作所 洗浄装置及び基板処理装置
US11049741B2 (en) 2017-12-01 2021-06-29 Elemental Scientific, Inc. Systems for integrated decomposition and scanning of a semiconducting wafer
JP6996438B2 (ja) * 2018-07-11 2022-01-17 株式会社Sumco 半導体ウェーハの洗浄方法、および該洗浄方法を用いた半導体ウェーハの製造方法
JP7117392B2 (ja) * 2018-11-16 2022-08-12 東京エレクトロン株式会社 基板処理装置及び基板処理装置の洗浄方法
KR102176209B1 (ko) * 2018-12-13 2020-11-09 주식회사 제우스 이물질 제거용 기판처리장치
JP7245059B2 (ja) * 2019-01-24 2023-03-23 株式会社ジェイ・イー・ティ 基板処理装置及び基板処理方法
KR102271566B1 (ko) * 2019-10-28 2021-07-01 세메스 주식회사 기판 처리 장치
CN115398615A (zh) * 2020-04-16 2022-11-25 基础科学公司 用于半导体晶圆的集成分解和扫描的系统
KR102777613B1 (ko) * 2020-06-22 2025-03-12 주식회사 제우스 기판처리장치
TW202410187A (zh) * 2022-07-12 2024-03-01 日商東京威力科創股份有限公司 基板處理方法及基板處理裝置
JP7572998B2 (ja) * 2022-08-26 2024-10-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US20250079227A1 (en) * 2023-09-05 2025-03-06 Taiwan Semiconductor Manufacturing Company Limited Wafer retaining device
TWI873069B (zh) * 2024-08-20 2025-02-11 積凱科技股份有限公司 風扇型吸盤

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002533920A (ja) * 1998-12-22 2002-10-08 ステアーグ ミクロテヒ ゲゼルシャフト ミット ベシュレンクテル ハフツング 基板を処理する装置及び方法
JP2005353739A (ja) * 2004-06-09 2005-12-22 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JP2007180144A (ja) * 2005-12-27 2007-07-12 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2007318140A (ja) * 2006-05-25 2007-12-06 Semes Co Ltd 基板処理装置及び方法、そしてこれに用いられる噴射ヘッド

Family Cites Families (5)

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JPH1092784A (ja) * 1996-09-10 1998-04-10 Toshiba Microelectron Corp ウェーハ処理装置およびウェーハ処理方法
JP3563605B2 (ja) * 1998-03-16 2004-09-08 東京エレクトロン株式会社 処理装置
JP4357943B2 (ja) * 2003-12-02 2009-11-04 エス・イー・エス株式会社 基板処理法及び基板処理装置
JP4734063B2 (ja) * 2005-08-30 2011-07-27 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法。
JP2007149892A (ja) * 2005-11-25 2007-06-14 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002533920A (ja) * 1998-12-22 2002-10-08 ステアーグ ミクロテヒ ゲゼルシャフト ミット ベシュレンクテル ハフツング 基板を処理する装置及び方法
JP2005353739A (ja) * 2004-06-09 2005-12-22 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JP2007180144A (ja) * 2005-12-27 2007-07-12 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2007318140A (ja) * 2006-05-25 2007-12-06 Semes Co Ltd 基板処理装置及び方法、そしてこれに用いられる噴射ヘッド

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017010663A1 (ko) * 2015-07-13 2017-01-19 주식회사 제우스 기판 액처리 장치 및 방법
KR20170007988A (ko) * 2015-07-13 2017-01-23 주식회사 제우스 기판 액처리 장치 및 방법
KR101880232B1 (ko) * 2015-07-13 2018-07-19 주식회사 제우스 기판 액처리 장치 및 방법

Also Published As

Publication number Publication date
TW201246324A (en) 2012-11-16
TWI492283B (zh) 2015-07-11
JP5646354B2 (ja) 2014-12-24
KR20120086236A (ko) 2012-08-02
US20120186744A1 (en) 2012-07-26
JP2012156266A (ja) 2012-08-16
US9396975B2 (en) 2016-07-19

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