KR101521254B1 - 이중으로 몰딩된 다중칩 패키지 시스템 - Google Patents

이중으로 몰딩된 다중칩 패키지 시스템 Download PDF

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KR101521254B1
KR101521254B1 KR1020070140692A KR20070140692A KR101521254B1 KR 101521254 B1 KR101521254 B1 KR 101521254B1 KR 1020070140692 A KR1020070140692 A KR 1020070140692A KR 20070140692 A KR20070140692 A KR 20070140692A KR 101521254 B1 KR101521254 B1 KR 101521254B1
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integrated circuit
capsule
circuit die
package system
semiconductor device
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KR20080063197A (ko
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캄브함파티 라마크리슈나
심일권
셍 관 초우
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스태츠 칩팩 엘티디
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    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/11—Device type
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/181—Encapsulation

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  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020070140692A 2006-12-30 2007-12-28 이중으로 몰딩된 다중칩 패키지 시스템 Active KR101521254B1 (ko)

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US11/618,806 US8178982B2 (en) 2006-12-30 2006-12-30 Dual molded multi-chip package system

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US20120193805A1 (en) 2012-08-02
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US20080157402A1 (en) 2008-07-03
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US8178982B2 (en) 2012-05-15
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US8558399B2 (en) 2013-10-15

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