KR101519937B1 - 투명 폴리아미드-이미드 - Google Patents
투명 폴리아미드-이미드 Download PDFInfo
- Publication number
- KR101519937B1 KR101519937B1 KR1020130052370A KR20130052370A KR101519937B1 KR 101519937 B1 KR101519937 B1 KR 101519937B1 KR 1020130052370 A KR1020130052370 A KR 1020130052370A KR 20130052370 A KR20130052370 A KR 20130052370A KR 101519937 B1 KR101519937 B1 KR 101519937B1
- Authority
- KR
- South Korea
- Prior art keywords
- acid
- imide
- polyamide
- cyclohexane
- imido
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 0 CC(*)(C=C(C(C(N1*)=O)=C2)C1=O)C=C2C(*)=O Chemical compound CC(*)(C=C(C(C(N1*)=O)=C2)C1=O)C=C2C(*)=O 0.000 description 3
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/40—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
- Y10T428/139—Open-ended, self-supporting conduit, cylinder, or tube-type article
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyamides (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP12183987 | 2012-09-12 | ||
| EP12183987.2 | 2012-09-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20140034682A KR20140034682A (ko) | 2014-03-20 |
| KR101519937B1 true KR101519937B1 (ko) | 2015-05-13 |
Family
ID=47044771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020130052370A Active KR101519937B1 (ko) | 2012-09-12 | 2013-05-09 | 투명 폴리아미드-이미드 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US9422429B2 (OSRAM) |
| EP (1) | EP2708569B1 (OSRAM) |
| JP (1) | JP5757973B2 (OSRAM) |
| KR (1) | KR101519937B1 (OSRAM) |
| CN (1) | CN103665378B (OSRAM) |
| CA (1) | CA2814733C (OSRAM) |
| TW (1) | TWI480315B (OSRAM) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018147611A1 (ko) * | 2017-02-08 | 2018-08-16 | 에스케이씨 주식회사 | 폴리아마이드-이미드 필름의 제조방법 |
| KR20190092696A (ko) * | 2018-01-31 | 2019-08-08 | 에스케이씨 주식회사 | 폴리아마이드-이미드 필름 및 이의 제조방법 |
| US11028227B2 (en) | 2017-09-08 | 2021-06-08 | Samsung Electronics Co., Ltd. | Poly(amide-imide) copolymer, composition for preparing poly(amide-imide) copolymer, article including poly(amide-imide) copolymer, and display device including the article |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104250376B (zh) * | 2013-06-25 | 2016-12-28 | 中国科学院化学研究所 | 一种透明聚酰胺复合材料及其制备方法 |
| FR3041354B1 (fr) * | 2015-09-22 | 2019-04-19 | Arkema France | Utilisation d'un prepolymere dans des compositions thermoplastiques transparentes, compositions les comprenant et leurs utilisations |
| CN105440284B (zh) * | 2015-12-11 | 2017-08-15 | 中国航空工业集团公司北京航空材料研究院 | 一种无色透明耐高温聚酰亚胺纳米复合薄膜的制备方法 |
| US10370495B2 (en) * | 2016-08-11 | 2019-08-06 | Sk Innovation Co., Ltd. | Polyamic acid resin, polyamideimide film, and method for preparing the same |
| KR102385244B1 (ko) * | 2016-08-11 | 2022-04-12 | 에스케이이노베이션 주식회사 | 폴리아믹산 수지 및 폴리아미드이미드 필름 |
| EP3592927B1 (en) * | 2017-03-09 | 2025-09-03 | Fisher & Paykel Appliances Limited | Refrigeration appliance |
| KR102717867B1 (ko) | 2018-11-08 | 2024-10-15 | 삼성전자주식회사 | 폴리(아미드-이미드) 코폴리머, 폴리(아미드-이미드) 코폴리머 제조용 조성물, 폴리(아미드-이미드) 코폴리머를 포함하는 성형품 및 표시 장치 |
| CN110437445B (zh) * | 2019-08-21 | 2021-11-16 | 中仑塑业(福建)有限公司 | 一种聚酰胺树脂及其制备方法和用途 |
| EP4028450B1 (en) * | 2019-09-09 | 2023-11-08 | Solvay Specialty Polymers USA, LLC. | Polyamide-imide polymer and process for its manufacture |
| CN115093700A (zh) * | 2022-07-04 | 2022-09-23 | 华润化学材料科技股份有限公司 | 一种尼龙弹性体材料及其制备方法 |
| CN115449071B (zh) * | 2022-09-29 | 2024-04-09 | 株洲时代新材料科技股份有限公司 | 一种含酰亚胺结构的共聚酰胺树脂及其制备方法 |
| CN119287548B (zh) * | 2024-12-16 | 2025-05-30 | 东华大学 | 一种支化聚酰胺6纤维的制备方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0291699A2 (de) | 1987-04-28 | 1988-11-23 | Bayer Ag | Lackbindemittel, ihre Verwendung in Beschichtungsmitteln und ein Verfahren zur Herstellung von Drahtlackierungen |
| JP2008291248A (ja) * | 2007-04-24 | 2008-12-04 | Toray Ind Inc | 樹脂組成物およびそれからなる成形品 |
Family Cites Families (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1770416U (de) | 1958-04-03 | 1958-07-17 | Nikolaus Lehnen | Heugeblaese am ackerschlepper. |
| FR1427087A (fr) | 1964-12-10 | 1966-02-04 | Rhone Poulenc Sa | Nouveaux diacides à enchaînement pyromellimide et nouveaux polycondensats obtenus à partir de ces diacides |
| US3428486A (en) * | 1965-01-04 | 1969-02-18 | George Co P D | Polyamide-imide electrical insulation |
| US3518230A (en) * | 1968-01-04 | 1970-06-30 | Schenectady Chemical | Imide modified amide imide wire enamel |
| DE1795752C3 (de) * | 1968-04-13 | 1980-02-14 | Bayer Ag, 5090 Leverkusen | Hochmolekulare Polyamidimide |
| DE1770202C3 (de) * | 1968-04-13 | 1975-02-27 | Bayer Ag, 5090 Leverkusen | Verfahren zur Herstellung von hochmolekularen Polyamid-tmiden |
| DE1770416A1 (de) | 1968-05-15 | 1971-10-21 | Bayer Ag | Verfahren zur Herstellung von Phthalimido-N-carbonsaeuren |
| US3494890A (en) * | 1968-06-21 | 1970-02-10 | Standard Oil Co | Process for producing polytrimellit-imides using phenol solvents and alkylene oxides as hydrogen halide scavengers |
| JPS4835605B1 (OSRAM) * | 1970-07-18 | 1973-10-29 | ||
| GB1397125A (en) * | 1971-05-26 | 1975-06-11 | Standard Oil Co | Polyamide-acids polyamide-imides and processes for their production |
| US3726712A (en) * | 1971-05-26 | 1973-04-10 | Standard Oil Co | Double coated electrical conductor |
| US3778411A (en) * | 1971-07-30 | 1973-12-11 | Gen Electric | Polyamide acids and polyamideimides |
| US3714131A (en) * | 1971-08-11 | 1973-01-30 | Gen Electric | Polyamideimides |
| US3794625A (en) * | 1971-10-26 | 1974-02-26 | Custom Resins Inc | Transparent polyamides from caprolactam and a mixture of a methyldiamino cyclohexane and a dibasicorganic acid |
| JPS5231915B2 (OSRAM) * | 1972-01-27 | 1977-08-18 | ||
| US3753998A (en) * | 1972-04-24 | 1973-08-21 | Standard Oil Co | Composition and process for producing polyamide-imide and polyamide polymers |
| US3922252A (en) * | 1972-06-23 | 1975-11-25 | Gen Electric | Polyamideimide compositions |
| JPS5319639B1 (OSRAM) * | 1973-02-15 | 1978-06-22 | ||
| JPS5262337A (en) * | 1975-11-18 | 1977-05-23 | Asahi Chem Ind Co Ltd | Resin compositions for powder coatings |
| US4161477A (en) | 1976-04-08 | 1979-07-17 | John V. Long | Polyimide resin-forming composition |
| US4069209A (en) * | 1976-04-12 | 1978-01-17 | The P. D. George Company | Imino acids and resins derived therefrom |
| US4259221A (en) * | 1976-12-20 | 1981-03-31 | General Electric Company | Water-soluble polyamideimides |
| US4268661A (en) * | 1978-12-18 | 1981-05-19 | Inventa Ag Fur Forschung Und Patentverwertung, Zurich | Method for the manufacture of glass clear transparent polyamide |
| US4478913A (en) * | 1980-10-08 | 1984-10-23 | General Electric Company | Blended polyesterimide-polyesteramideimide electrical coating compositions |
| US4461786A (en) * | 1980-10-08 | 1984-07-24 | General Electric Company | Blended polyesterimide-polyesteramide-imide electrical coating compositions |
| US5155206A (en) * | 1987-09-03 | 1992-10-13 | The Boeing Company | Crosslinkable polyamideimide oligomers and a method of preparation |
| US5512676A (en) * | 1987-09-03 | 1996-04-30 | The Boeing Company | Extended amideimide hub for multidimensional oligomers |
| US4831108A (en) * | 1983-02-16 | 1989-05-16 | Amoco Corporation | Polycondensation process with mean dispersion residence time |
| DE3332030A1 (de) * | 1983-09-06 | 1985-03-21 | Bayer Ag, 5090 Leverkusen | Verfahren zur herstellung von polyamidimiden |
| DE3332031A1 (de) * | 1983-09-06 | 1985-03-21 | Bayer Ag, 5090 Leverkusen | Verwendung von polyamidimiden als thermoplaste |
| DE3332033A1 (de) * | 1983-09-06 | 1985-03-21 | Bayer Ag, 5090 Leverkusen | Neue polyamidimide und ihre verwendung |
| DE3431859A1 (de) * | 1984-08-30 | 1986-03-06 | Bayer Ag, 5090 Leverkusen | Aliphatisch-aromatische polyamidimide, enthaltend polyamide |
| DE3431857A1 (de) * | 1984-08-30 | 1986-03-06 | Bayer Ag, 5090 Leverkusen | Verfahren zur herstellung von polyamidimiden |
| US4902740A (en) * | 1985-07-26 | 1990-02-20 | Teijin Limited | Polyamideimides containing 3,4'-diamino-diphenylether as diamine component, with plasticizer |
| DE3829960A1 (de) * | 1988-09-03 | 1990-03-15 | Bayer Ag | Aliphatisch-aromatische polyamidimide |
| DE3829959A1 (de) * | 1988-09-03 | 1990-03-15 | Bayer Ag | Herstellung von polyamidimiden |
| US5214088A (en) * | 1989-10-20 | 1993-05-25 | General Electric Company | Highly dense thermoplastic molding compositions |
| DE4025346A1 (de) | 1990-08-10 | 1992-02-13 | Bayer Ag | Transparente, thermoplastische polyetheresteramidimid-elastomere sowie ihre verwendung zur herstellung von medizinischen gebrauchsartikeln |
| US5322922A (en) * | 1990-08-17 | 1994-06-21 | Ciba-Geigy Corporation | Copolyamide or copolyimide-amide containing sulfo groups |
| JPH0718075A (ja) * | 1993-07-01 | 1995-01-20 | Toyobo Co Ltd | 耐熱性樹脂、その製造法およびそれを含むワニス |
| KR0128814B1 (ko) * | 1993-07-05 | 1998-04-07 | 강박광 | 이소포론디아민 구조를 함유하는 신규 폴리아미드이미드수지 |
| DE4333238A1 (de) * | 1993-09-30 | 1995-04-06 | Basf Ag | Pyrrolidongruppenhaltige Polyester und Polyamide |
| BE1008499A3 (nl) * | 1994-07-11 | 1996-05-07 | Dsm Nv | Polyamide-imide. |
| DE4444948C2 (de) * | 1994-12-16 | 2000-02-24 | Inventa Ag | Teilkristalline Block-Copolyesterpolyamide und Verwendung |
| JP3972600B2 (ja) * | 2000-09-14 | 2007-09-05 | ソニーケミカル&インフォメーションデバイス株式会社 | ポリイミド前駆体、その製造方法及び感光性樹脂組成物 |
| CN100376386C (zh) * | 2001-11-01 | 2008-03-26 | 荒川化学工业株式会社 | 聚酰亚胺-金属层压体和聚酰胺酰亚胺-金属层压体 |
| US7569708B2 (en) * | 2003-11-20 | 2009-08-04 | Mitsubishi Gas Chemical Company, Inc. | Liquid cyclohexane-tricarboxylic acid anhydride |
| US7238770B2 (en) * | 2004-01-29 | 2007-07-03 | Wellman, Inc. | Methods of making imide-modified polyester resins |
| US7973122B2 (en) * | 2004-06-17 | 2011-07-05 | General Cable Technologies Corporation | Polyamideimide compositions having multifunctional core structures |
| TW200634095A (en) * | 2005-03-16 | 2006-10-01 | Chang Chun Plastics Co Ltd | Polyoxyalkyleneamine modified polyamidepolyimide resin and composition thereof |
| ES2456691T3 (es) * | 2006-12-12 | 2014-04-23 | Toyobo Co., Ltd. | Resina de poliamida, material laminar metálico flexible, incoloro y transparente obtenido a partir de la misma y placa de circuitos |
| FR2932486B1 (fr) | 2008-06-12 | 2012-12-07 | Rhodia Operations | Procede de preparation d'un polyamideimide, polyamideimide et composition comprenant ce polyamideimide. |
| WO2012020584A1 (ja) * | 2010-08-09 | 2012-02-16 | 日立化成工業株式会社 | 新規な含ケイ素脂環式ポリイミド樹脂及びポリアミド酸樹脂並びにそれらの製造方法 |
| TW201235411A (en) * | 2011-02-01 | 2012-09-01 | Dainippon Ink & Chemicals | Hot curable polyimide resin composition, cured article thereof and interlayer adhesive film for printed wiring board |
| US10406791B2 (en) * | 2011-05-12 | 2019-09-10 | Elantas Pdg, Inc. | Composite insulating film |
-
2013
- 2013-04-23 EP EP13164834.7A patent/EP2708569B1/de active Active
- 2013-04-24 JP JP2013091346A patent/JP5757973B2/ja active Active
- 2013-05-01 CA CA2814733A patent/CA2814733C/en active Active
- 2013-05-02 US US13/875,921 patent/US9422429B2/en not_active Expired - Fee Related
- 2013-05-08 TW TW102116303A patent/TWI480315B/zh active
- 2013-05-09 KR KR1020130052370A patent/KR101519937B1/ko active Active
- 2013-06-05 CN CN201310221331.3A patent/CN103665378B/zh active Active
-
2016
- 2016-04-11 US US15/096,176 patent/US20160222210A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0291699A2 (de) | 1987-04-28 | 1988-11-23 | Bayer Ag | Lackbindemittel, ihre Verwendung in Beschichtungsmitteln und ein Verfahren zur Herstellung von Drahtlackierungen |
| JP2008291248A (ja) * | 2007-04-24 | 2008-12-04 | Toray Ind Inc | 樹脂組成物およびそれからなる成形品 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018147611A1 (ko) * | 2017-02-08 | 2018-08-16 | 에스케이씨 주식회사 | 폴리아마이드-이미드 필름의 제조방법 |
| CN110325568A (zh) * | 2017-02-08 | 2019-10-11 | Skc株式会社 | 聚酰胺-酰亚胺膜的制备方法 |
| CN110325568B (zh) * | 2017-02-08 | 2021-12-10 | Skc株式会社 | 聚酰胺-酰亚胺膜的制备方法 |
| US11433573B2 (en) | 2017-02-08 | 2022-09-06 | Skc Co., Ltd. | Method for producing polyamide-imide film |
| US11028227B2 (en) | 2017-09-08 | 2021-06-08 | Samsung Electronics Co., Ltd. | Poly(amide-imide) copolymer, composition for preparing poly(amide-imide) copolymer, article including poly(amide-imide) copolymer, and display device including the article |
| US11898012B2 (en) | 2017-09-08 | 2024-02-13 | Samsung Electronics Co., Ltd. | Poly(amide-imide) copolymer, composition for preparing poly(amide-imide) copolymer, article including poly(amide-imide) copolymer, and display device including the article |
| KR20190092696A (ko) * | 2018-01-31 | 2019-08-08 | 에스케이씨 주식회사 | 폴리아마이드-이미드 필름 및 이의 제조방법 |
| KR102036227B1 (ko) | 2018-01-31 | 2019-10-24 | 에스케이씨 주식회사 | 폴리아마이드-이미드 필름 및 이의 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2814733C (en) | 2015-12-22 |
| CN103665378B (zh) | 2016-01-20 |
| KR20140034682A (ko) | 2014-03-20 |
| EP2708569A1 (de) | 2014-03-19 |
| TW201410741A (zh) | 2014-03-16 |
| US20160222210A1 (en) | 2016-08-04 |
| CN103665378A (zh) | 2014-03-26 |
| US20140072745A1 (en) | 2014-03-13 |
| CA2814733A1 (en) | 2014-03-12 |
| TWI480315B (zh) | 2015-04-11 |
| EP2708569B1 (de) | 2018-05-23 |
| JP5757973B2 (ja) | 2015-08-05 |
| JP2014055278A (ja) | 2014-03-27 |
| US9422429B2 (en) | 2016-08-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5757973B2 (ja) | 透明なポリアミド−イミド | |
| US11098194B2 (en) | Glass filler-reinforced polyamide moulding compounds based on amorphous copolyamides | |
| JP5335208B2 (ja) | ポリアミド成形組成物及びその使用 | |
| KR100712018B1 (ko) | 개선된 성질을 가진 폴리아미드 성형 재료 | |
| CN111825977B (zh) | 增强热塑性模塑组合物 | |
| KR20140058383A (ko) | 비정질 폴리아미드로 제조된 휴대용 전자 장치 | |
| US9090739B2 (en) | Polyamide and polyamide composition | |
| KR20100098370A (ko) | 충전 폴리아미드 성형 화합물 | |
| US20110251341A1 (en) | Reinforced polyamide composition | |
| EP3674345B1 (en) | Polyamide resin composition and article comprising the same | |
| JP5942108B2 (ja) | ポリアミド組成物及びポリアミド組成物を成形した成形体 | |
| US20220259379A1 (en) | Copolyamides obtainable from 4-(aminomethyl)benzoic acid | |
| KR102402212B1 (ko) | 폴리아미드 수지 조성물 및 이를 포함하는 성형품 | |
| KR101811919B1 (ko) | 폴리아미드 수지, 이를 포함하는 폴리아미드 수지 조성물, 이의 제조방법 및 이를 포함하는 성형품 | |
| EP3950843B1 (en) | Polyamide resin composition and molded product comprising same | |
| US20250270375A1 (en) | Smart device component comprising a polyamide composition with low water uptake | |
| CN114364718A (zh) | 聚酰胺-酰亚胺聚合物及其制造方法 | |
| CN112533993A (zh) | 纤维增强聚酰胺组合物及由其制成的模制件 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| R15-X000 | Change to inventor requested |
St.27 status event code: A-3-3-R10-R15-oth-X000 |
|
| R16-X000 | Change to inventor recorded |
St.27 status event code: A-3-3-R10-R16-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-5-5-R10-R17-oth-X000 |
|
| FPAY | Annual fee payment |
Payment date: 20180427 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20190425 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 11 |
|
| U11 | Full renewal or maintenance fee paid |
Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE) Year of fee payment: 11 |