KR101518067B1 - 다층 프린트 배선판 및 그 제조 방법 - Google Patents

다층 프린트 배선판 및 그 제조 방법 Download PDF

Info

Publication number
KR101518067B1
KR101518067B1 KR1020090030767A KR20090030767A KR101518067B1 KR 101518067 B1 KR101518067 B1 KR 101518067B1 KR 1020090030767 A KR1020090030767 A KR 1020090030767A KR 20090030767 A KR20090030767 A KR 20090030767A KR 101518067 B1 KR101518067 B1 KR 101518067B1
Authority
KR
South Korea
Prior art keywords
wiring board
printed wiring
conductor
multilayer
connecting portion
Prior art date
Application number
KR1020090030767A
Other languages
English (en)
Korean (ko)
Other versions
KR20100002088A (ko
Inventor
고우키 나카마
Original Assignee
스미토모 덴코 프린트 써키트 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미토모 덴코 프린트 써키트 가부시키가이샤 filed Critical 스미토모 덴코 프린트 써키트 가부시키가이샤
Publication of KR20100002088A publication Critical patent/KR20100002088A/ko
Application granted granted Critical
Publication of KR101518067B1 publication Critical patent/KR101518067B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
KR1020090030767A 2008-06-24 2009-04-09 다층 프린트 배선판 및 그 제조 방법 KR101518067B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008164808A JP2010010217A (ja) 2008-06-24 2008-06-24 多層プリント配線板およびその製造方法
JPJP-P-2008-164808 2008-06-24

Publications (2)

Publication Number Publication Date
KR20100002088A KR20100002088A (ko) 2010-01-06
KR101518067B1 true KR101518067B1 (ko) 2015-05-06

Family

ID=41495830

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090030767A KR101518067B1 (ko) 2008-06-24 2009-04-09 다층 프린트 배선판 및 그 제조 방법

Country Status (3)

Country Link
JP (1) JP2010010217A (ja)
KR (1) KR101518067B1 (ja)
CN (1) CN101616534A (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012011165A1 (ja) * 2010-07-20 2012-01-26 住友電気工業株式会社 多層プリント配線板およびその製造方法
CN103676285A (zh) * 2013-12-31 2014-03-26 京东方科技集团股份有限公司 覆晶薄膜以及液晶显示装置
CN106793488B (zh) * 2015-11-20 2019-04-30 财团法人工业技术研究院 软性电子装置与软性电子装置制作工艺方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005322871A (ja) 2004-04-09 2005-11-17 Dainippon Printing Co Ltd リジッド−フレキシブル基板及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3209772B2 (ja) * 1991-07-08 2001-09-17 株式会社フジクラ リジッドフレックス配線板の製造方法
JPH0575270A (ja) * 1991-09-11 1993-03-26 Sony Chem Corp 複合多層配線板の製造方法
JP3259873B2 (ja) * 1993-10-05 2002-02-25 住友電気工業株式会社 高周波回路用フレックスリジッド多層板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005322871A (ja) 2004-04-09 2005-11-17 Dainippon Printing Co Ltd リジッド−フレキシブル基板及びその製造方法

Also Published As

Publication number Publication date
CN101616534A (zh) 2009-12-30
JP2010010217A (ja) 2010-01-14
KR20100002088A (ko) 2010-01-06

Similar Documents

Publication Publication Date Title
JP4955970B2 (ja) フレキシブルプリント配線板およびその製造方法
KR100560624B1 (ko) 프린트배선판
KR100338908B1 (ko) 인쇄회로기판및그의제조방법과전자구성부품패키지및그의제조방법
US9040837B2 (en) Wiring board and method for manufacturing the same
US8383948B2 (en) Flex-rigid wiring board and method for manufacturing the same
KR100759004B1 (ko) 도체 패턴 및 수지 필름을 갖는 다층 기판 및 그 제조 방법
JP2587596B2 (ja) 回路基板接続材とそれを用いた多層回路基板の製造方法
KR20070084635A (ko) 다층 프린트 배선 기판 및 그 제조 방법
JP2009200113A (ja) シールド配線回路基板
JP2007173477A (ja) フレキシブルプリント配線板
KR101518067B1 (ko) 다층 프린트 배선판 및 그 제조 방법
CN108811323B (zh) 印刷电路板及其制造方法
US20030137815A1 (en) Printed wiring board and method of manufacturing the same
JP4041048B2 (ja) フレキシブル・リジッド型配線板およびその製造方法
JP3167840B2 (ja) 印刷配線板および印刷配線板の製造方法
CN216087116U (zh) 一种布线板之间的通孔
KR20150037801A (ko) 인쇄회로기판 및 그 제조방법
JP4899409B2 (ja) 多層プリント配線基板及びその製造方法
JPH1070363A (ja) 印刷配線板の製造方法
JP2012169688A (ja) 多層プリント配線板の製造方法
JPH08264939A (ja) 印刷配線板の製造方法
JP3694708B2 (ja) 印刷配線板の製造方法および印刷配線板
JP3474896B2 (ja) 印刷配線板およびその製造方法
JP2004179171A (ja) 配線基板
JP4892924B2 (ja) 多層プリント配線基板及びその製造方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20180418

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20190418

Year of fee payment: 5