KR101503618B1 - Iii족 질화물 반도체 소자 제조용 기판의 제조 방법, iii족 질화물 반도체 자립 기판 또는 iii족 질화물 반도체 소자의 제조 방법, 및 iii족 질화물 성장용 기판 - Google Patents

Iii족 질화물 반도체 소자 제조용 기판의 제조 방법, iii족 질화물 반도체 자립 기판 또는 iii족 질화물 반도체 소자의 제조 방법, 및 iii족 질화물 성장용 기판 Download PDF

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KR101503618B1
KR101503618B1 KR1020137008856A KR20137008856A KR101503618B1 KR 101503618 B1 KR101503618 B1 KR 101503618B1 KR 1020137008856 A KR1020137008856 A KR 1020137008856A KR 20137008856 A KR20137008856 A KR 20137008856A KR 101503618 B1 KR101503618 B1 KR 101503618B1
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layer
chromium
substrate
group iii
gas
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KR20130113452A (ko
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류이치 토바
마사히토 미야시타
타카후미 야오
카츠시 후지이
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도와 일렉트로닉스 가부시키가이샤
도와 홀딩스 가부시키가이샤
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    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
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    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
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    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
    • H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
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    • H10H20/80—Constructional details
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    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
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    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
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    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
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  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Vapour Deposition (AREA)
  • Led Devices (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020137008856A 2010-09-30 2011-09-30 Iii족 질화물 반도체 소자 제조용 기판의 제조 방법, iii족 질화물 반도체 자립 기판 또는 iii족 질화물 반도체 소자의 제조 방법, 및 iii족 질화물 성장용 기판 Expired - Fee Related KR101503618B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010222767A JP5665463B2 (ja) 2010-09-30 2010-09-30 Ｉｉｉ族窒化物半導体素子製造用基板およびｉｉｉ族窒化物半導体自立基板またはｉｉｉ族窒化物半導体素子の製造方法
JPJP-P-2010-222767 2010-09-30
PCT/JP2011/073154 WO2012043885A1 (ja) 2010-09-30 2011-09-30 Iii族窒化物半導体素子製造用基板の製造方法、iii族窒化物半導体自立基板またはiii族窒化物半導体素子の製造方法、およびiii族窒化物成長用基板

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KR20130113452A KR20130113452A (ko) 2013-10-15
KR101503618B1 true KR101503618B1 (ko) 2015-03-18

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FR2997420B1 (fr) * 2012-10-26 2017-02-24 Commissariat Energie Atomique Procede de croissance d'au moins un nanofil a partir d'une couche d'un metal de transition nitrure obtenue en deux etapes
FR2997557B1 (fr) 2012-10-26 2016-01-01 Commissariat Energie Atomique Dispositif electronique a nanofil(s) muni d'une couche tampon en metal de transition, procede de croissance d'au moins un nanofil, et procede de fabrication d'un dispositif
KR102187487B1 (ko) * 2014-04-03 2020-12-08 엘지이노텍 주식회사 발광소자 및 이를 구비한 조명 장치
CN108349814B (zh) * 2015-11-11 2021-09-28 阿莫泰克有限公司 铁氧体片的制造方法及使用其的铁氧体片
JP6266742B1 (ja) * 2016-12-20 2018-01-24 古河機械金属株式会社 Ｉｉｉ族窒化物半導体基板、及び、ｉｉｉ族窒化物半導体基板の製造方法
CN112470260B (zh) * 2018-05-23 2024-05-14 胜高股份有限公司 Iii族氮化物半导体基板及其制造方法
TWI825187B (zh) * 2018-10-09 2023-12-11 日商東京威力科創股份有限公司 氮化物半導體膜之形成方法
US11961765B2 (en) * 2019-05-23 2024-04-16 Mitsubishi Electric Corporation Method for manufacturing a semiconductor substrate and device by bonding an epitaxial substrate to a first support substrate, forming a first and second protective thin film layer, and exposing and bonding a nitride semiconductor layer to a second support substrate
JP7429522B2 (ja) * 2019-11-22 2024-02-08 住友化学株式会社 Ｉｉｉ族窒化物積層基板および半導体素子

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JP2008088026A (ja) 2006-10-03 2008-04-17 Tohoku Techno Arch Co Ltd 構造体
JP2008110912A (ja) 2006-10-03 2008-05-15 Tohoku Techno Arch Co Ltd 基板の製造方法
JP2009054888A (ja) 2007-08-28 2009-03-12 Tohoku Techno Arch Co Ltd Ｉｉｉ族窒化物半導体とその製造方法

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US6218207B1 (en) * 1998-05-29 2001-04-17 Mitsushita Electronics Corporation Method for growing nitride semiconductor crystals, nitride semiconductor device, and method for fabricating the same
JP3631724B2 (ja) * 2001-03-27 2005-03-23 日本電気株式会社 Ｉｉｉ族窒化物半導体基板およびその製造方法
JP4117156B2 (ja) * 2002-07-02 2008-07-16 日本電気株式会社 Ｉｉｉ族窒化物半導体基板の製造方法
EP2197050A1 (en) * 2005-04-04 2010-06-16 Tohoku Techno Arch Co., Ltd. Process for producing a GaN-based element

Patent Citations (3)

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JP2008088026A (ja) 2006-10-03 2008-04-17 Tohoku Techno Arch Co Ltd 構造体
JP2008110912A (ja) 2006-10-03 2008-05-15 Tohoku Techno Arch Co Ltd 基板の製造方法
JP2009054888A (ja) 2007-08-28 2009-03-12 Tohoku Techno Arch Co Ltd Ｉｉｉ族窒化物半導体とその製造方法

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JP2012077345A (ja) 2012-04-19
WO2012043885A1 (ja) 2012-04-05
CN103348043A (zh) 2013-10-09
KR20130113452A (ko) 2013-10-15
JP5665463B2 (ja) 2015-02-04
CN103348043B (zh) 2016-03-09
CN105529248B (zh) 2018-04-06
WO2012043885A9 (ja) 2013-07-18

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