KR101499848B1 - 알루미늄 또는 알루미늄 합금의 표면처리 방법 - Google Patents

알루미늄 또는 알루미늄 합금의 표면처리 방법 Download PDF

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Publication number
KR101499848B1
KR101499848B1 KR1020080002883A KR20080002883A KR101499848B1 KR 101499848 B1 KR101499848 B1 KR 101499848B1 KR 1020080002883 A KR1020080002883 A KR 1020080002883A KR 20080002883 A KR20080002883 A KR 20080002883A KR 101499848 B1 KR101499848 B1 KR 101499848B1
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KR
South Korea
Prior art keywords
aluminum
film
plating
electroless
plating film
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Application number
KR1020080002883A
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English (en)
Korean (ko)
Other versions
KR20080066580A (ko
Inventor
히로키 우치다
가즈키 요시카와
도시아키 시바타
Original Assignee
우에무라 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 우에무라 고교 가부시키가이샤 filed Critical 우에무라 고교 가부시키가이샤
Publication of KR20080066580A publication Critical patent/KR20080066580A/ko
Application granted granted Critical
Publication of KR101499848B1 publication Critical patent/KR101499848B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1806—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by mechanical pretreatment, e.g. grinding, sanding
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemically Coating (AREA)
KR1020080002883A 2007-01-12 2008-01-10 알루미늄 또는 알루미늄 합금의 표면처리 방법 KR101499848B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00004721 2007-01-12
JP2007004721A JP5136746B2 (ja) 2007-01-12 2007-01-12 アルミニウム又はアルミニウム合金の表面処理方法

Publications (2)

Publication Number Publication Date
KR20080066580A KR20080066580A (ko) 2008-07-16
KR101499848B1 true KR101499848B1 (ko) 2015-03-06

Family

ID=39697820

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080002883A KR101499848B1 (ko) 2007-01-12 2008-01-10 알루미늄 또는 알루미늄 합금의 표면처리 방법

Country Status (3)

Country Link
JP (1) JP5136746B2 (zh)
KR (1) KR101499848B1 (zh)
TW (1) TWI419995B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190060587A (ko) * 2017-11-24 2019-06-03 주식회사 엘지화학 수도커패시터용 집전체의 제조 방법

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100973021B1 (ko) 2008-07-09 2010-07-30 주식회사 빅솔론 우선 처리 식별자를 설정할 수 있는 프린터 장치
JP4605409B2 (ja) * 2008-08-21 2011-01-05 上村工業株式会社 アルミニウム又はアルミニウム合金の表面処理方法
CN102226283B (zh) * 2011-05-18 2013-04-17 王定志 喷枪的表面处理方法
KR101586659B1 (ko) * 2013-09-10 2016-01-20 한국기계연구원 고반응성 금속분말의 산화막 제어방법
KR20150092778A (ko) 2014-02-05 2015-08-17 연세대학교 산학협력단 보호피막을 갖는 금속 재료 및 그 제조 방법
KR101658383B1 (ko) 2014-04-14 2016-09-22 연세대학교 산학협력단 마그네슘 재료
JP2018204066A (ja) * 2017-06-02 2018-12-27 公益財団法人福岡県産業・科学技術振興財団 電極形成方法及び半導体素子電極構造
JP2019024037A (ja) * 2017-07-24 2019-02-14 國立成功大學Ｎａｔｉｏｎａｌ Ｃｈｅｎｇ Ｋｕｎｇ Ｕｎｉｖｅｒｓｉｔｙ 高伝導卑金属電極と合金ローオームチップ抵抗の作製方法
JP7023890B2 (ja) * 2019-05-22 2022-02-22 成電智慧材料股▲フン▼有限公司 高伝導卑金属電極と合金ローオームチップ抵抗の作製方法
CN111705287B (zh) * 2020-07-10 2021-07-30 武汉大学 一种电气绝缘设备金属表面处理防止c4f7n腐蚀的方法
JP7416425B2 (ja) * 2020-12-08 2024-01-17 メルテックス株式会社 アルミニウムおよびアルミニウム合金のめっき前処理方法
CN113122846B (zh) * 2021-04-03 2023-04-28 昆山陆新新材料科技有限公司 一种铝合金金属镀件
CN113529079B (zh) * 2021-06-24 2023-10-31 惠州市安泰普表面处理科技有限公司 一种在铝合金表面化学镀镍的方法
JP2023069841A (ja) * 2021-11-08 2023-05-18 上村工業株式会社 金属置換処理液、アルミニウム又はアルミニウム合金の表面処理方法
CN115440989A (zh) * 2022-09-30 2022-12-06 楚能新能源股份有限公司 一种锂离子电池用负极集流体、极片及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273956A (ja) * 2003-03-11 2004-09-30 Seiko Epson Corp バンプ構造、半導体チップ、半導体装置、電子デバイスおよび電子機器
KR20060063778A (ko) * 2003-10-03 2006-06-12 신꼬오덴기 고교 가부시키가이샤 배선 기판의 패드 구조 및 배선 기판

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001200390A (ja) * 1999-11-12 2001-07-24 Osaka Gas Co Ltd コンプレッサー用部材
JP3673445B2 (ja) * 2000-05-02 2005-07-20 メルテックス株式会社 亜鉛置換処理液
JP4203724B2 (ja) * 2003-03-04 2009-01-07 上村工業株式会社 アルミニウム酸化皮膜用除去液及びアルミニウム又はアルミニウム合金の表面処理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273956A (ja) * 2003-03-11 2004-09-30 Seiko Epson Corp バンプ構造、半導体チップ、半導体装置、電子デバイスおよび電子機器
KR20060063778A (ko) * 2003-10-03 2006-06-12 신꼬오덴기 고교 가부시키가이샤 배선 기판의 패드 구조 및 배선 기판

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190060587A (ko) * 2017-11-24 2019-06-03 주식회사 엘지화학 수도커패시터용 집전체의 제조 방법
KR102364363B1 (ko) * 2017-11-24 2022-02-16 주식회사 엘지에너지솔루션 수도커패시터용 집전체의 제조 방법

Also Published As

Publication number Publication date
KR20080066580A (ko) 2008-07-16
TWI419995B (zh) 2013-12-21
JP5136746B2 (ja) 2013-02-06
JP2008169447A (ja) 2008-07-24
TW200905011A (en) 2009-02-01

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