KR101488018B1 - 폴리실세스퀴옥산 화합물로 이루어지는 성형 재료, 밀봉재및 광소자 밀봉체 - Google Patents

폴리실세스퀴옥산 화합물로 이루어지는 성형 재료, 밀봉재및 광소자 밀봉체 Download PDF

Info

Publication number
KR101488018B1
KR101488018B1 KR20080059121A KR20080059121A KR101488018B1 KR 101488018 B1 KR101488018 B1 KR 101488018B1 KR 20080059121 A KR20080059121 A KR 20080059121A KR 20080059121 A KR20080059121 A KR 20080059121A KR 101488018 B1 KR101488018 B1 KR 101488018B1
Authority
KR
South Korea
Prior art keywords
group
sealing material
compound
molding material
formula
Prior art date
Application number
KR20080059121A
Other languages
English (en)
Korean (ko)
Other versions
KR20090004536A (ko
Inventor
미키히로 가시오
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20090004536A publication Critical patent/KR20090004536A/ko
Application granted granted Critical
Publication of KR101488018B1 publication Critical patent/KR101488018B1/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/10—Definition of the polymer structure
    • C08G2261/13—Morphological aspects
    • C08G2261/133—Rod-like building block
    • C08G2261/1336—Ladder-type, e.g. ladder-poly-p-phenylenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR20080059121A 2007-06-29 2008-06-23 폴리실세스퀴옥산 화합물로 이루어지는 성형 재료, 밀봉재및 광소자 밀봉체 KR101488018B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007171478 2007-06-29
JPJP-P-2007-00171478 2007-06-29
JP2008051568A JP5425406B2 (ja) 2007-06-29 2008-03-03 ポリシルセスキオキサン化合物からなる成形材料、封止材および光素子封止体
JPJP-P-2008-00051568 2008-03-03

Publications (2)

Publication Number Publication Date
KR20090004536A KR20090004536A (ko) 2009-01-12
KR101488018B1 true KR101488018B1 (ko) 2015-01-29

Family

ID=40400868

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20080059121A KR101488018B1 (ko) 2007-06-29 2008-06-23 폴리실세스퀴옥산 화합물로 이루어지는 성형 재료, 밀봉재및 광소자 밀봉체

Country Status (3)

Country Link
JP (1) JP5425406B2 (zh)
KR (1) KR101488018B1 (zh)
TW (1) TWI429687B (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101524058B1 (ko) 2008-02-14 2015-05-29 린텍 가부시키가이샤 폴리오르가노실록산 화합물로 이루어진 성형재료, 봉합재료 및 봉합 광학 장치
TWI518137B (zh) * 2010-02-10 2016-01-21 Lintec Corp A hardened composition, a hardened product, and a hardened composition
TWI504681B (zh) * 2010-03-08 2015-10-21 Lintec Corp A hardening composition, a hardened product, and a hardening composition
TWI509023B (zh) * 2010-03-09 2015-11-21 Lintec Corp A hardened composition, a hardened product, and a hardening composition
JP5779431B2 (ja) * 2010-07-16 2015-09-16 リンテック株式会社 光素子固定材用組成物、その使用方法、及び光素子封止体
KR101820087B1 (ko) * 2011-07-19 2018-01-18 주식회사 동진쎄미켐 광경화형 수지 조성물
KR101937140B1 (ko) * 2011-08-03 2019-04-09 주식회사 동진쎄미켐 광경화형 유-무기 하이브리드 수지 조성물
WO2013019040A2 (ko) * 2011-08-03 2013-02-07 주식회사 동진쎄미켐 광경화형 유-무기 하이브리드 수지 조성물
EP2829579A4 (en) * 2012-03-23 2015-10-28 Lintec Corp HARDENABLE COMPOSITION, HARDENED PRODUCT, AND METHOD FOR USE OF A HARDENABLE COMPOSITION
CN104781309B (zh) * 2012-10-30 2018-01-19 琳得科株式会社 固化性聚倍半硅氧烷化合物、其制造方法、固化性组合物、固化物、以及固化性组合物等的使用方法
WO2015041339A1 (ja) * 2013-09-20 2015-03-26 リンテック株式会社 硬化性組成物、硬化物および硬化性組成物の使用方法
WO2015041342A1 (ja) * 2013-09-20 2015-03-26 リンテック株式会社 硬化性組成物、硬化物および硬化性組成物の使用方法
WO2017122796A1 (ja) * 2016-01-15 2017-07-20 シチズン時計株式会社 縮合反応型のダイボンディング剤、ｌｅｄ発光装置及びその製造方法
KR20180065185A (ko) * 2016-12-07 2018-06-18 한국과학기술연구원 자가-치유가 가능한 폴리실세스퀴옥산 및 이를 이용한 하이브리드 필름

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08143818A (ja) * 1994-11-25 1996-06-04 Showa Denko Kk 半導体絶縁膜用及び平坦化膜用組成物並びにその膜の形成方法
JP2004359933A (ja) 2003-05-14 2004-12-24 Nagase Chemtex Corp 光素子用封止材
JP2005239829A (ja) 2004-02-25 2005-09-08 Lintec Corp ポリシルセスキオキサングラフト重合体の製造方法、粘着剤および粘着シート
JP2007056146A (ja) 2005-08-25 2007-03-08 Nagase Chemtex Corp 光素子用封止樹脂組成物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2930463B2 (ja) * 1992-01-16 1999-08-03 三菱電機株式会社 Ｍｏｓメモリデバイスの製法
US5491203A (en) * 1994-09-08 1996-02-13 Showa Denko K. K. Polyorganosiloxane and process for producing the same
JPH1087834A (ja) * 1996-09-10 1998-04-07 Showa Denko Kk ポリオルガノシルセスキオキサン、その製造方法並びに該化合物を含有する樹脂組成物
JP2006328231A (ja) * 2005-05-26 2006-12-07 Nagase Chemtex Corp 光素子用封止樹脂組成物
WO2008038550A1 (fr) * 2006-09-25 2008-04-03 Hitachi Chemical Company, Ltd. Composition sensible au rayonnement, procédé de formation d'un film de protection à base de silice, film de protection à base de silice, appareil et élément comportant un film de protection à base de silice et agent photosensibilisant destiné à isoler un film

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08143818A (ja) * 1994-11-25 1996-06-04 Showa Denko Kk 半導体絶縁膜用及び平坦化膜用組成物並びにその膜の形成方法
JP2004359933A (ja) 2003-05-14 2004-12-24 Nagase Chemtex Corp 光素子用封止材
JP2005239829A (ja) 2004-02-25 2005-09-08 Lintec Corp ポリシルセスキオキサングラフト重合体の製造方法、粘着剤および粘着シート
JP2007056146A (ja) 2005-08-25 2007-03-08 Nagase Chemtex Corp 光素子用封止樹脂組成物

Also Published As

Publication number Publication date
TWI429687B (zh) 2014-03-11
JP2009030013A (ja) 2009-02-12
TW200920767A (en) 2009-05-16
KR20090004536A (ko) 2009-01-12
JP5425406B2 (ja) 2014-02-26

Similar Documents

Publication Publication Date Title
KR101488018B1 (ko) 폴리실세스퀴옥산 화합물로 이루어지는 성형 재료, 밀봉재및 광소자 밀봉체
JP5400624B2 (ja) ポリオルガノシロキサン化合物からなる成形材料、封止材及び光素子封止体
US8481669B2 (en) Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element
KR101412945B1 (ko) 광 소자용 밀봉재 및 광 소자 밀봉체
KR101581974B1 (ko) 폴리오르가노실록산 화합물을 주성분으로 하는 접착제
KR101768246B1 (ko) 경화성 조성물, 경화물 및 경화성 조성물의 사용 방법
JP5667326B2 (ja) 硬化性樹脂組成物及びその硬化物、封止剤、並びに光半導体装置
KR101530742B1 (ko) 실란 화합물 중합체로 이루어지는 고정재 및 광 소자 밀봉체
KR101732211B1 (ko) 경화성 조성물, 경화물 및 경화성 조성물의 사용 방법
JP2004292714A (ja) 硬化性組成物、硬化物、その製造方法およびその硬化物により封止された発光ダイオード
KR102105811B1 (ko) 경화성 조성물, 경화물, 경화성 조성물의 사용 방법, 그리고, 광 소자 밀봉체 및 그 제조 방법
US20170218128A1 (en) Curable Silicone Resin Composition, Cured Object Obtained Therefrom, and Optical Semiconductor Device Formed Using Same
WO2016013421A1 (ja) 硬化性シリコーン樹脂組成物およびその硬化物、並びにこれらを用いた光半導体装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20180111

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20190110

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20200109

Year of fee payment: 6