KR101472444B1 - 발광 다이오드의 형광체 위치 파악 장치, 발광 다이오드의 형광체 위치 파악 장치를 포함한 부품 실장기, 발광 다이오드의 형광체 위치 파악 방법 및 렌즈 설치 방법 - Google Patents

발광 다이오드의 형광체 위치 파악 장치, 발광 다이오드의 형광체 위치 파악 장치를 포함한 부품 실장기, 발광 다이오드의 형광체 위치 파악 방법 및 렌즈 설치 방법 Download PDF

Info

Publication number
KR101472444B1
KR101472444B1 KR1020120065245A KR20120065245A KR101472444B1 KR 101472444 B1 KR101472444 B1 KR 101472444B1 KR 1020120065245 A KR1020120065245 A KR 1020120065245A KR 20120065245 A KR20120065245 A KR 20120065245A KR 101472444 B1 KR101472444 B1 KR 101472444B1
Authority
KR
South Korea
Prior art keywords
light
substrate
phosphor
emitting diode
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020120065245A
Other languages
English (en)
Korean (ko)
Other versions
KR20130142023A (ko
Inventor
박재현
Original Assignee
삼성테크윈 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성테크윈 주식회사 filed Critical 삼성테크윈 주식회사
Priority to KR1020120065245A priority Critical patent/KR101472444B1/ko
Priority to CN201210427982.3A priority patent/CN103512491A/zh
Priority to CN201710846194.0A priority patent/CN107655407A/zh
Priority to JP2013126556A priority patent/JP5944349B2/ja
Publication of KR20130142023A publication Critical patent/KR20130142023A/ko
Application granted granted Critical
Publication of KR101472444B1 publication Critical patent/KR101472444B1/ko
Assigned to 한화정밀기계 주식회사 reassignment 한화정밀기계 주식회사 권리의 전부이전등록 Assignors: 한화에어로스페이스 주식회사
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Biochemistry (AREA)
  • Optics & Photonics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Led Device Packages (AREA)
  • Studio Devices (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020120065245A 2012-06-18 2012-06-18 발광 다이오드의 형광체 위치 파악 장치, 발광 다이오드의 형광체 위치 파악 장치를 포함한 부품 실장기, 발광 다이오드의 형광체 위치 파악 방법 및 렌즈 설치 방법 Active KR101472444B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020120065245A KR101472444B1 (ko) 2012-06-18 2012-06-18 발광 다이오드의 형광체 위치 파악 장치, 발광 다이오드의 형광체 위치 파악 장치를 포함한 부품 실장기, 발광 다이오드의 형광체 위치 파악 방법 및 렌즈 설치 방법
CN201210427982.3A CN103512491A (zh) 2012-06-18 2012-10-31 检测led的磷光体的位置的设备和方法以及安装透镜的方法
CN201710846194.0A CN107655407A (zh) 2012-06-18 2012-10-31 检测led的磷光体的位置的设备和方法以及安装透镜的方法
JP2013126556A JP5944349B2 (ja) 2012-06-18 2013-06-17 発光ダイオードの蛍光体位置把握装置、発光ダイオードの蛍光体位置把握装置を備える部品実装器、発光ダイオードの蛍光体位置把握方法及びレンズ取り付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120065245A KR101472444B1 (ko) 2012-06-18 2012-06-18 발광 다이오드의 형광체 위치 파악 장치, 발광 다이오드의 형광체 위치 파악 장치를 포함한 부품 실장기, 발광 다이오드의 형광체 위치 파악 방법 및 렌즈 설치 방법

Publications (2)

Publication Number Publication Date
KR20130142023A KR20130142023A (ko) 2013-12-27
KR101472444B1 true KR101472444B1 (ko) 2014-12-24

Family

ID=49895610

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120065245A Active KR101472444B1 (ko) 2012-06-18 2012-06-18 발광 다이오드의 형광체 위치 파악 장치, 발광 다이오드의 형광체 위치 파악 장치를 포함한 부품 실장기, 발광 다이오드의 형광체 위치 파악 방법 및 렌즈 설치 방법

Country Status (3)

Country Link
JP (1) JP5944349B2 (OSRAM)
KR (1) KR101472444B1 (OSRAM)
CN (2) CN103512491A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10217680B2 (en) 2016-08-03 2019-02-26 Samsung Electronics Co., Ltd. Test apparatus and manufacturing apparatus of light emitting device package

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102268172B1 (ko) * 2014-07-07 2021-06-23 엘지전자 주식회사 광원 모듈 어셈블리 조립 장치 및 조립 방법
KR20160056167A (ko) * 2014-11-11 2016-05-19 삼성전자주식회사 발광 장치의 제조 방법, 발광 모듈 검사 장비 및 발광 모듈의 양불 판단 방법
JP6860440B2 (ja) * 2017-07-20 2021-04-14 日本メクトロン株式会社 基板位置認識装置、位置認識加工装置および基板製造方法
CN109216532B (zh) * 2018-11-01 2023-09-12 上海悦威电子设备有限公司 一种紫外led石英透镜装配结构及方法
KR102825008B1 (ko) * 2020-02-05 2025-06-27 삼성디스플레이 주식회사 광학 검사 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000011616A (ko) * 1998-07-10 2000-02-25 모리시타 요이찌 전자부품실장장치,인식장치및인식방법
JP2000149781A (ja) * 1998-11-06 2000-05-30 Matsushita Electric Ind Co Ltd プラズマディスプレイ蛍光体検査装置
KR20040039697A (ko) * 2002-11-04 2004-05-12 엘지전자 주식회사 플라즈마 디스플레이 패널의 형광체 검사 장치 및 방법
KR20110085957A (ko) * 2011-06-15 2011-07-27 삼성엘이디 주식회사 발광 디바이스 제조 장치 및 발광 디바이스 제조 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003196949A (ja) * 2001-12-27 2003-07-11 Hitachi High-Tech Instruments Co Ltd 光学ディスク検査装置
JP3723845B2 (ja) * 2002-03-26 2005-12-07 国立大学法人富山大学 有機エレクトロルミネッセンス素子に使用される有機薄膜の膜厚測定法および測定装置
JP2006162427A (ja) * 2004-12-07 2006-06-22 Toshiba Corp Ｌｅｄチップの検査方法及びｌｅｄチップの検査装置
KR101168316B1 (ko) * 2009-12-01 2012-07-25 삼성전자주식회사 발광다이오드 검사 장치
CN102087226B (zh) * 2009-12-04 2015-03-25 三星电子株式会社 Led测试装置及其测试方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000011616A (ko) * 1998-07-10 2000-02-25 모리시타 요이찌 전자부품실장장치,인식장치및인식방법
JP2000149781A (ja) * 1998-11-06 2000-05-30 Matsushita Electric Ind Co Ltd プラズマディスプレイ蛍光体検査装置
KR20040039697A (ko) * 2002-11-04 2004-05-12 엘지전자 주식회사 플라즈마 디스플레이 패널의 형광체 검사 장치 및 방법
KR20110085957A (ko) * 2011-06-15 2011-07-27 삼성엘이디 주식회사 발광 디바이스 제조 장치 및 발광 디바이스 제조 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10217680B2 (en) 2016-08-03 2019-02-26 Samsung Electronics Co., Ltd. Test apparatus and manufacturing apparatus of light emitting device package

Also Published As

Publication number Publication date
KR20130142023A (ko) 2013-12-27
CN103512491A (zh) 2014-01-15
JP2014002150A (ja) 2014-01-09
JP5944349B2 (ja) 2016-07-05
CN107655407A (zh) 2018-02-02

Similar Documents

Publication Publication Date Title
KR101575833B1 (ko) 전자 부품 및/또는 캐리어를 배출 장치에 대하여 위치 결정하기 위한 장치 및 방법
KR20130142023A (ko) 발광 다이오드의 형광체 위치 파악 장치, 발광 다이오드의 형광체 위치 파악 장치를 포함한 부품 실장기, 발광 다이오드의 형광체 위치 파악 방법 및 렌즈 설치 방법
US8359735B2 (en) Head assembly for chip mounter
JP6224727B2 (ja) 部品撮像装置及びこれを用いた表面実装機
JP5558073B2 (ja) ボンディング装置
TW201624051A (zh) 光學模組、其製造方法以及包含光學模組之電子裝置
TW201825866A (zh) 接合裝置以及被攝體的高度檢測方法
KR102427131B1 (ko) 칩 본딩 장치
WO2018134862A1 (ja) 撮像装置及びこれを用いた表面実装機
EP1378932B1 (en) Semiconductor chip mounting apparatus and mounting method
TW201340241A (zh) 發光元件的定位方法及所用吸嘴
JP5829501B2 (ja) 半導体素子画像認識装置及び半導体素子画像認識方法
JP5561715B2 (ja) ボンディング装置
KR20140074709A (ko) 발광 다이오드 패키지 및 그 제조 방법
KR102387983B1 (ko) 이송 유닛 및 이를 포함하는 칩 본딩 장치
JP6033965B2 (ja) ピックアップ装置
TWI540762B (zh) 發光二極體模組之製造方法
KR101248143B1 (ko) 영상 처리 모듈 및 이를 이용한 엘이디 칩 본딩 장치
KR101172789B1 (ko) 듀얼 스테이지 시스템 및 이를 이용하는 프릿 가공방법
JP6392958B2 (ja) 部品撮像装置及びこれを用いた表面実装機
US9246064B2 (en) Apparatus for mounting optical member and method of manufacturing light emitting device
KR101132139B1 (ko) 와이어 본더의 조명장치를 이용한 와이어 본딩방법
JP5132923B2 (ja) 電子部品製造装置および電子部品製造方法
KR101606674B1 (ko) Ｌｅｄ 패키지의 봉지재 에칭 시스템
KR102352494B1 (ko) 칩 본딩 장치

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
A302 Request for accelerated examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

D12-X000 Request for substantive examination rejected

St.27 status event code: A-1-2-D10-D12-exm-X000

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20171129

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20181126

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

FPAY Annual fee payment

Payment date: 20191202

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 12

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000