KR101456725B1 - 서브미크론 결정립 크기를 갖는 벌크 금속 구조체의 제조 방법 및 이 방법으로 제조된 구조체 - Google Patents

서브미크론 결정립 크기를 갖는 벌크 금속 구조체의 제조 방법 및 이 방법으로 제조된 구조체 Download PDF

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KR101456725B1
KR101456725B1 KR1020090094709A KR20090094709A KR101456725B1 KR 101456725 B1 KR101456725 B1 KR 101456725B1 KR 1020090094709 A KR1020090094709 A KR 1020090094709A KR 20090094709 A KR20090094709 A KR 20090094709A KR 101456725 B1 KR101456725 B1 KR 101456725B1
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high density
metal powder
substrate
grain size
supersonic
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KR20100039259A (ko
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스티븐 에이 밀러
프랩햇 쿠마
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에이치. 씨. 스타아크 아이앤씨
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/02—Coating starting from inorganic powder by application of pressure only
    • C23C24/04—Impact or kinetic deposition of particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/07—Metallic powder characterised by particles having a nanoscale microstructure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/14—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas designed for spraying particulate materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/20—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by extruding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C2200/00—Crystalline structure
    • C22C2200/04—Nanocrystalline
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Physical Vapour Deposition (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
KR1020090094709A 2008-10-06 2009-10-06 서브미크론 결정립 크기를 갖는 벌크 금속 구조체의 제조 방법 및 이 방법으로 제조된 구조체 Expired - Fee Related KR101456725B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/245,840 US8043655B2 (en) 2008-10-06 2008-10-06 Low-energy method of manufacturing bulk metallic structures with submicron grain sizes
US12/245,840 2008-10-06

Publications (2)

Publication Number Publication Date
KR20100039259A KR20100039259A (ko) 2010-04-15
KR101456725B1 true KR101456725B1 (ko) 2014-10-31

Family

ID=41416078

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090094709A Expired - Fee Related KR101456725B1 (ko) 2008-10-06 2009-10-06 서브미크론 결정립 크기를 갖는 벌크 금속 구조체의 제조 방법 및 이 방법으로 제조된 구조체

Country Status (10)

Country Link
US (1) US8043655B2 (enExample)
EP (1) EP2172292B1 (enExample)
JP (1) JP5725700B2 (enExample)
KR (1) KR101456725B1 (enExample)
CN (1) CN101713071B (enExample)
BR (1) BRPI0904976A2 (enExample)
CA (1) CA2681424A1 (enExample)
MX (1) MX2009010724A (enExample)
RU (1) RU2009136708A (enExample)
ZA (1) ZA200906940B (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2607091C (en) * 2005-05-05 2014-08-12 H.C. Starck Gmbh Coating process for manufacture or reprocessing of sputter targets and x-ray anodes
US8802191B2 (en) * 2005-05-05 2014-08-12 H. C. Starck Gmbh Method for coating a substrate surface and coated product
US7837929B2 (en) * 2005-10-20 2010-11-23 H.C. Starck Inc. Methods of making molybdenum titanium sputtering plates and targets
US20080078268A1 (en) * 2006-10-03 2008-04-03 H.C. Starck Inc. Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof
CN101730757B (zh) * 2006-11-07 2015-09-30 H.C.施塔克有限公司 涂覆基材表面的方法和经过涂覆的产品
US20080145688A1 (en) 2006-12-13 2008-06-19 H.C. Starck Inc. Method of joining tantalum clade steel structures
US8197894B2 (en) 2007-05-04 2012-06-12 H.C. Starck Gmbh Methods of forming sputtering targets
US8246903B2 (en) 2008-09-09 2012-08-21 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders
US8709335B1 (en) * 2009-10-20 2014-04-29 Hanergy Holding Group Ltd. Method of making a CIG target by cold spraying
US8449817B2 (en) 2010-06-30 2013-05-28 H.C. Stark, Inc. Molybdenum-containing targets comprising three metal elements
US8449818B2 (en) 2010-06-30 2013-05-28 H. C. Starck, Inc. Molybdenum containing targets
WO2012154817A1 (en) 2011-05-10 2012-11-15 H.C. Starck, Inc. Composite target
US8703233B2 (en) 2011-09-29 2014-04-22 H.C. Starck Inc. Methods of manufacturing large-area sputtering targets by cold spray
US9334565B2 (en) 2012-05-09 2016-05-10 H.C. Starck Inc. Multi-block sputtering target with interface portions and associated methods and articles
JP5679395B2 (ja) * 2012-11-12 2015-03-04 日立金属株式会社 コールドスプレー用粉末
CN106413913A (zh) * 2014-04-15 2017-02-15 联邦科学与工业研究组织 使用冷喷涂生产预制件的方法
CN106694872A (zh) * 2016-11-18 2017-05-24 华中科技大学 一种适用于零件与模具的复合增材制造方法
KR101971252B1 (ko) 2018-07-20 2019-04-22 장준하 파력 실험을 위한 수조 타입 물결파 발생장치
CN110508809B (zh) * 2019-08-29 2020-11-17 华中科技大学 一种增材制造与表面涂覆复合成形系统及方法
KR20240041286A (ko) 2021-05-31 2024-03-29 콤포지트 테크놀로지 알 앤 디 피티와이 리미티드 적층 제조 금속 케이싱
KR102866116B1 (ko) 2021-11-26 2025-09-30 삼성전자주식회사 반도체 패키지
US12370600B2 (en) 2022-01-08 2025-07-29 M4 Sciences, Llc Composite manufacturing methods using metal-polymer amalgamations
CN115338422A (zh) * 2022-06-29 2022-11-15 西北工业大学 一种提高毁伤后效压力的多层药型罩涂层的增材制造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080006624A (ko) * 2005-05-05 2008-01-16 하.체. 스타르크 게엠베하 스퍼터 타깃과 ｘ-레이 애노드의 제조 또는 재처리를 위한코팅 공정

Family Cites Families (114)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3990784A (en) * 1974-06-05 1976-11-09 Optical Coating Laboratory, Inc. Coated architectural glass system and method
US4011981A (en) * 1975-03-27 1977-03-15 Olin Corporation Process for bonding titanium, tantalum, and alloys thereof
US4073427A (en) * 1976-10-07 1978-02-14 Fansteel Inc. Lined equipment with triclad wall construction
US4140172A (en) * 1976-12-23 1979-02-20 Fansteel Inc. Liners and tube supports for industrial and chemical process equipment
US4291104A (en) * 1978-04-17 1981-09-22 Fansteel Inc. Brazed corrosion resistant lined equipment
US4202932A (en) * 1978-07-21 1980-05-13 Xerox Corporation Magnetic recording medium
DE3130392C2 (de) * 1981-07-31 1985-10-17 Hermann C. Starck Berlin, 1000 Berlin Verfahren zur Herstellung reiner agglomerierter Ventilmetallpulver für Elektrolytkondensatoren, deren Verwendung und Verfahren zur Herstellung von Sinteranoden
US4459062A (en) * 1981-09-11 1984-07-10 Monsanto Company Clad metal joint closure
CA1202599A (en) 1982-06-10 1986-04-01 Michael G. Down Upgrading titanium, zirconium and hafnium powders by plasma processing
DE3309891A1 (de) * 1983-03-18 1984-10-31 Hermann C. Starck Berlin, 1000 Berlin Verfahren zur herstellung von ventilmetallanoden fuer elektrolytkondensatoren
US4508563A (en) * 1984-03-19 1985-04-02 Sprague Electric Company Reducing the oxygen content of tantalum
US4818629A (en) * 1985-08-26 1989-04-04 Fansteel Inc. Joint construction for lined equipment
US4722756A (en) * 1987-02-27 1988-02-02 Cabot Corp Method for deoxidizing tantalum material
US4731111A (en) * 1987-03-16 1988-03-15 Gte Products Corporation Hydrometallurical process for producing finely divided spherical refractory metal based powders
JPS6415353A (en) * 1987-07-08 1989-01-19 Toshiba Corp Alloy for thermal spraying
US4915745A (en) * 1988-09-22 1990-04-10 Atlantic Richfield Company Thin film solar cell and method of making
US5242481A (en) 1989-06-26 1993-09-07 Cabot Corporation Method of making powders and products of tantalum and niobium
US4964906A (en) * 1989-09-26 1990-10-23 Fife James A Method for controlling the oxygen content of tantalum material
DE69016433T2 (de) * 1990-05-19 1995-07-20 Papyrin Anatolij Nikiforovic Beschichtungsverfahren und -vorrichtung.
US5091244A (en) * 1990-08-10 1992-02-25 Viratec Thin Films, Inc. Electrically-conductive, light-attenuating antireflection coating
US5270858A (en) 1990-10-11 1993-12-14 Viratec Thin Films Inc D.C. reactively sputtered antireflection coatings
US5612254A (en) * 1992-06-29 1997-03-18 Intel Corporation Methods of forming an interconnect on a semiconductor substrate
US5693203A (en) 1992-09-29 1997-12-02 Japan Energy Corporation Sputtering target assembly having solid-phase bonded interface
US5305946A (en) * 1992-11-05 1994-04-26 Nooter Corporation Welding process for clad metals
US5679473A (en) * 1993-04-01 1997-10-21 Asahi Komag Co., Ltd. Magnetic recording medium and method for its production
US6103392A (en) 1994-12-22 2000-08-15 Osram Sylvania Inc. Tungsten-copper composite powder
US5795626A (en) * 1995-04-28 1998-08-18 Innovative Technology Inc. Coating or ablation applicator with a debris recovery attachment
US5993513A (en) * 1996-04-05 1999-11-30 Cabot Corporation Method for controlling the oxygen content in valve metal materials
US5954856A (en) * 1996-04-25 1999-09-21 Cabot Corporation Method of making tantalum metal powder with controlled size distribution and products made therefrom
US5859654A (en) * 1996-10-31 1999-01-12 Hewlett-Packard Company Print head for ink-jet printing a method for making print heads
WO1998037249A1 (de) * 1997-02-19 1998-08-27 H.C. Starck Gmbh & Co. Kg Tantalpulver, verfahren zu seiner herstellung, sowie daraus erhältliche sinteranoden
US5972065A (en) * 1997-07-10 1999-10-26 The Regents Of The University Of California Purification of tantalum by plasma arc melting
WO1999027579A1 (en) * 1997-11-26 1999-06-03 Applied Materials, Inc. Damage-free sculptured coating deposition
US6911124B2 (en) * 1998-09-24 2005-06-28 Applied Materials, Inc. Method of depositing a TaN seed layer
US6171363B1 (en) * 1998-05-06 2001-01-09 H. C. Starck, Inc. Method for producing tantallum/niobium metal powders by the reduction of their oxides with gaseous magnesium
US6189663B1 (en) * 1998-06-08 2001-02-20 General Motors Corporation Spray coatings for suspension damper rods
DE19847012A1 (de) * 1998-10-13 2000-04-20 Starck H C Gmbh Co Kg Niobpulver und Verfahren zu dessen Herstellung
FR2785897B1 (fr) * 1998-11-16 2000-12-08 Commissariat Energie Atomique Couche mince d'oxyde d'hafnium et procede de depot
US6328927B1 (en) 1998-12-24 2001-12-11 Praxair Technology, Inc. Method of making high-density, high-purity tungsten sputter targets
US6197082B1 (en) * 1999-02-17 2001-03-06 H.C. Starck, Inc. Refining of tantalum and tantalum scrap with carbon
US6558447B1 (en) * 1999-05-05 2003-05-06 H.C. Starck, Inc. Metal powders produced by the reduction of the oxides with gaseous magnesium
US6139913A (en) * 1999-06-29 2000-10-31 National Center For Manufacturing Sciences Kinetic spray coating method and apparatus
JP2001020065A (ja) * 1999-07-07 2001-01-23 Hitachi Metals Ltd スパッタリング用ターゲット及びその製造方法ならびに高融点金属粉末材料
US6261337B1 (en) * 1999-08-19 2001-07-17 Prabhat Kumar Low oxygen refractory metal powder for powder metallurgy
US6521173B2 (en) * 1999-08-19 2003-02-18 H.C. Starck, Inc. Low oxygen refractory metal powder for powder metallurgy
DE19942916A1 (de) * 1999-09-08 2001-03-15 Linde Gas Ag Herstellen von aufschäumbaren Metallkörpern und Metallschäumen
JP2001085378A (ja) * 1999-09-13 2001-03-30 Sony Corp 半導体装置およびその製造方法
US6258402B1 (en) * 1999-10-12 2001-07-10 Nakhleh Hussary Method for repairing spray-formed steel tooling
CN1214129C (zh) * 1999-12-28 2005-08-10 东芝株式会社 真空成膜装置用部件及使用该部件的真空成膜装置及其觇板装置
US6331233B1 (en) * 2000-02-02 2001-12-18 Honeywell International Inc. Tantalum sputtering target with fine grains and uniform texture and method of manufacture
US7122069B2 (en) 2000-03-29 2006-10-17 Osram Sylvania Inc. Mo-Cu composite powder
US6502767B2 (en) * 2000-05-03 2003-01-07 Asb Industries Advanced cold spray system
US20030023132A1 (en) * 2000-05-31 2003-01-30 Melvin David B. Cyclic device for restructuring heart chamber geometry
JP2001347672A (ja) * 2000-06-07 2001-12-18 Fuji Photo Film Co Ltd インクジェット記録ヘッドおよびインクジェット記録ヘッドの製造方法ならびにインクジェットプリンタ
WO2002027768A2 (en) * 2000-09-27 2002-04-04 Nüp2 Incorporated Fabrication of semiconductor devices
US6498091B1 (en) * 2000-11-01 2002-12-24 Applied Materials, Inc. Method of using a barrier sputter reactor to remove an underlying barrier layer
US6669782B1 (en) 2000-11-15 2003-12-30 Randhir P. S. Thakur Method and apparatus to control the formation of layers useful in integrated circuits
US6491208B2 (en) 2000-12-05 2002-12-10 Siemens Westinghouse Power Corporation Cold spray repair process
US6444259B1 (en) * 2001-01-30 2002-09-03 Siemens Westinghouse Power Corporation Thermal barrier coating applied with cold spray technique
EP1362132B1 (en) * 2001-02-14 2006-05-10 H. C. Starck, Inc. Rejuvenation of a tantalum sputtering target.
US7794554B2 (en) 2001-02-14 2010-09-14 H.C. Starck Inc. Rejuvenation of refractory metal products
PT1366203E (pt) * 2001-02-20 2006-12-29 Starck H C Inc Placas de metal refratario de textura uniforme e métodos para a sua preparação
US6915964B2 (en) * 2001-04-24 2005-07-12 Innovative Technology, Inc. System and process for solid-state deposition and consolidation of high velocity powder particles using thermal plastic deformation
US6722584B2 (en) * 2001-05-02 2004-04-20 Asb Industries, Inc. Cold spray system nozzle
US7053294B2 (en) * 2001-07-13 2006-05-30 Midwest Research Institute Thin-film solar cell fabricated on a flexible metallic substrate
AU2002333640A1 (en) * 2001-09-17 2003-04-01 Heraeus, Inc. Refurbishing spent sputtering targets
US7081148B2 (en) * 2001-09-18 2006-07-25 Praxair S.T. Technology, Inc. Textured-grain-powder metallurgy tantalum sputter target
US6770154B2 (en) * 2001-09-18 2004-08-03 Praxair S.T. Technology, Inc. Textured-grain-powder metallurgy tantalum sputter target
US6986471B1 (en) * 2002-01-08 2006-01-17 Flame Spray Industries, Inc. Rotary plasma spray method and apparatus for applying a coating utilizing particle kinetics
US6861101B1 (en) * 2002-01-08 2005-03-01 Flame Spray Industries, Inc. Plasma spray method for applying a coating utilizing particle kinetics
WO2003062491A2 (en) * 2002-01-24 2003-07-31 H. C. Starck Inc. Refractrory metal and alloy refining by laser forming and melting
US6627814B1 (en) * 2002-03-22 2003-09-30 David H. Stark Hermetically sealed micro-device package with window
BE1014736A5 (fr) 2002-03-29 2004-03-02 Alloys For Technical Applic S Procede de fabrication et de recharge de cibles pour pulverisation cathodique.
US6896933B2 (en) * 2002-04-05 2005-05-24 Delphi Technologies, Inc. Method of maintaining a non-obstructed interior opening in kinetic spray nozzles
US20030219542A1 (en) * 2002-05-25 2003-11-27 Ewasyshyn Frank J. Method of forming dense coatings by powder spraying
DE10224777A1 (de) * 2002-06-04 2003-12-18 Linde Ag Verfahren und Vorrichtung zum Kaltgasspritzen
DE10224780A1 (de) * 2002-06-04 2003-12-18 Linde Ag Verfahren und Vorrichtung zum Kaltgasspritzen
US6759085B2 (en) * 2002-06-17 2004-07-06 Sulzer Metco (Us) Inc. Method and apparatus for low pressure cold spraying
US7128988B2 (en) * 2002-08-29 2006-10-31 Lambeth Systems Magnetic material structures, devices and methods
JP4883546B2 (ja) * 2002-09-20 2012-02-22 Ｊｘ日鉱日石金属株式会社 タンタルスパッタリングターゲットの製造方法
US7108893B2 (en) * 2002-09-23 2006-09-19 Delphi Technologies, Inc. Spray system with combined kinetic spray and thermal spray ability
US20040065546A1 (en) * 2002-10-04 2004-04-08 Michaluk Christopher A. Method to recover spent components of a sputter target
CA2444917A1 (en) 2002-10-18 2004-04-18 United Technologies Corporation Cold sprayed copper for rocket engine applications
US6749002B2 (en) 2002-10-21 2004-06-15 Ford Motor Company Method of spray joining articles
DE10253794B4 (de) 2002-11-19 2005-03-17 Hühne, Erwin Dieter Niedertemperatur Hochgeschwindigkeits-Flammspritzsystem
TW571342B (en) * 2002-12-18 2004-01-11 Au Optronics Corp Method of forming a thin film transistor
TWI341337B (en) * 2003-01-07 2011-05-01 Cabot Corp Powder metallurgy sputtering targets and methods of producing same
WO2004074540A1 (en) 2003-02-24 2004-09-02 Tekna Plasma Systems Inc. Process and apparatus for the maufacture of a sputtering target
JP4008388B2 (ja) * 2003-06-30 2007-11-14 シャープ株式会社 半導体キャリア用フィルムおよびそれを用いた半導体装置、液晶モジュール
US7170915B2 (en) * 2003-07-23 2007-01-30 Intel Corporation Anti-reflective (AR) coating for high index gain media
US7208230B2 (en) * 2003-08-29 2007-04-24 General Electric Company Optical reflector for reducing radiation heat transfer to hot engine parts
US7128948B2 (en) * 2003-10-20 2006-10-31 The Boeing Company Sprayed preforms for forming structural members
US20070172378A1 (en) * 2004-01-30 2007-07-26 Nippon Tungsten Co., Ltd. Tungsten based sintered compact and method for production thereof
US6905728B1 (en) * 2004-03-22 2005-06-14 Honeywell International, Inc. Cold gas-dynamic spray repair on gas turbine engine components
US20050220995A1 (en) * 2004-04-06 2005-10-06 Yiping Hu Cold gas-dynamic spraying of wear resistant alloys on turbine blades
US20060021870A1 (en) * 2004-07-27 2006-02-02 Applied Materials, Inc. Profile detection and refurbishment of deposition targets
US20060045785A1 (en) * 2004-08-30 2006-03-02 Yiping Hu Method for repairing titanium alloy components
US20060042728A1 (en) * 2004-08-31 2006-03-02 Brad Lemon Molybdenum sputtering targets
WO2006032522A1 (de) * 2004-09-25 2006-03-30 Abb Technology Ag Verfahren zur herstellung einer abbrandfesten beschichtung, sowie entsprechende schirmung für vakuumschaltkammern
US20060090593A1 (en) * 2004-11-03 2006-05-04 Junhai Liu Cold spray formation of thin metal coatings
US20060121187A1 (en) * 2004-12-03 2006-06-08 Haynes Jeffrey D Vacuum cold spray process
US7479299B2 (en) * 2005-01-26 2009-01-20 Honeywell International Inc. Methods of forming high strength coatings
US7399335B2 (en) * 2005-03-22 2008-07-15 H.C. Starck Inc. Method of preparing primary refractory metal
US20060251872A1 (en) * 2005-05-05 2006-11-09 Wang Jenn Y Conductive barrier layer, especially an alloy of ruthenium and tantalum and sputter deposition thereof
US8802191B2 (en) * 2005-05-05 2014-08-12 H. C. Starck Gmbh Method for coating a substrate surface and coated product
US20060289139A1 (en) * 2005-06-24 2006-12-28 Fushan Zhang Retention and drainage in the manufacture of paper
JP4795157B2 (ja) * 2005-10-24 2011-10-19 新日本製鐵株式会社 コールドスプレー装置
US20080078268A1 (en) * 2006-10-03 2008-04-03 H.C. Starck Inc. Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof
CN101730757B (zh) * 2006-11-07 2015-09-30 H.C.施塔克有限公司 涂覆基材表面的方法和经过涂覆的产品
US20080145688A1 (en) * 2006-12-13 2008-06-19 H.C. Starck Inc. Method of joining tantalum clade steel structures
JP5215192B2 (ja) * 2007-01-05 2013-06-19 株式会社東芝 スパッタリングターゲット
US8784729B2 (en) 2007-01-16 2014-07-22 H.C. Starck Inc. High density refractory metals and alloys sputtering targets
US8197894B2 (en) 2007-05-04 2012-06-12 H.C. Starck Gmbh Methods of forming sputtering targets
US8246903B2 (en) * 2008-09-09 2012-08-21 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080006624A (ko) * 2005-05-05 2008-01-16 하.체. 스타르크 게엠베하 스퍼터 타깃과 ｘ-레이 애노드의 제조 또는 재처리를 위한코팅 공정

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