KR101437256B1 - 이방성 도전 필름, 접합체 및 접속 방법 - Google Patents

이방성 도전 필름, 접합체 및 접속 방법 Download PDF

Info

Publication number
KR101437256B1
KR101437256B1 KR1020127030305A KR20127030305A KR101437256B1 KR 101437256 B1 KR101437256 B1 KR 101437256B1 KR 1020127030305 A KR1020127030305 A KR 1020127030305A KR 20127030305 A KR20127030305 A KR 20127030305A KR 101437256 B1 KR101437256 B1 KR 101437256B1
Authority
KR
South Korea
Prior art keywords
circuit member
anisotropic conductive
amine
conductive film
silane coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020127030305A
Other languages
English (en)
Korean (ko)
Other versions
KR20130029770A (ko
Inventor
도모유키 이시마츠
히로시 하마치
레이지 츠카오
Original Assignee
데쿠세리아루즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 데쿠세리아루즈 가부시키가이샤 filed Critical 데쿠세리아루즈 가부시키가이샤
Publication of KR20130029770A publication Critical patent/KR20130029770A/ko
Application granted granted Critical
Publication of KR101437256B1 publication Critical patent/KR101437256B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
KR1020127030305A 2010-04-20 2011-04-13 이방성 도전 필름, 접합체 및 접속 방법 Expired - Fee Related KR101437256B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010097358A JP5558184B2 (ja) 2010-04-20 2010-04-20 異方性導電フィルム、接合体及び接続方法
JPJP-P-2010-097358 2010-04-20
PCT/JP2011/059146 WO2011132578A1 (ja) 2010-04-20 2011-04-13 異方性導電フィルム、接合体及び接続方法

Publications (2)

Publication Number Publication Date
KR20130029770A KR20130029770A (ko) 2013-03-25
KR101437256B1 true KR101437256B1 (ko) 2014-09-02

Family

ID=42767265

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127030305A Expired - Fee Related KR101437256B1 (ko) 2010-04-20 2011-04-13 이방성 도전 필름, 접합체 및 접속 방법

Country Status (4)

Country Link
JP (1) JP5558184B2 (enExample)
KR (1) KR101437256B1 (enExample)
TW (1) TWI498410B (enExample)
WO (1) WO2011132578A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6782532B2 (ja) * 2014-07-23 2020-11-11 日本乳化剤株式会社 イオン結合性塩、イオン結合性塩組成物およびこれを含む樹脂組成物
CN110265843B (zh) * 2014-10-28 2021-05-11 迪睿合株式会社 各向异性导电膜
PL3807384T3 (pl) 2018-06-18 2024-09-02 Chemetall Us, Inc. Połączone układy funkcjonalizowanych grupą aminową organosilanów / organofosforanów jako środki ep / inhibitory korozji w kompozycjach do obróbki powierzchni metalowych

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11279424A (ja) * 1998-03-26 1999-10-12 Asahi Glass Co Ltd 硬化性組成物
KR100642445B1 (ko) * 2004-12-29 2006-11-02 제일모직주식회사 이방 도전성 접착제용 수지 조성물
KR20100017828A (ko) * 2008-03-27 2010-02-16 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 이방성 도전 필름, 그리고 접합체 및 그 제조방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3909816B2 (ja) * 2001-10-31 2007-04-25 オプトレックス株式会社 液晶表示パネルへの回路部品接続装置
JP2004047228A (ja) * 2002-07-10 2004-02-12 Bridgestone Corp 異方性導電フィルム及び電極付き基板の接着方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11279424A (ja) * 1998-03-26 1999-10-12 Asahi Glass Co Ltd 硬化性組成物
KR100642445B1 (ko) * 2004-12-29 2006-11-02 제일모직주식회사 이방 도전성 접착제용 수지 조성물
KR20100017828A (ko) * 2008-03-27 2010-02-16 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 이방성 도전 필름, 그리고 접합체 및 그 제조방법

Also Published As

Publication number Publication date
TWI498410B (zh) 2015-09-01
JP2010186752A (ja) 2010-08-26
JP5558184B2 (ja) 2014-07-23
KR20130029770A (ko) 2013-03-25
TW201144405A (en) 2011-12-16
WO2011132578A1 (ja) 2011-10-27

Similar Documents

Publication Publication Date Title
TWI855294B (zh) 接著劑組成物
KR101344965B1 (ko) 이방성 도전 필름, 접합체, 및 접합체의 제조 방법
WO2010073885A1 (ja) フィルム状接着剤及び異方導電性接着剤
KR101456396B1 (ko) 이방 도전성 접착 필름 및 경화제
JP7347576B2 (ja) 接着剤フィルム
WO2012137754A1 (ja) 異方性導電フィルム、接合体の製造方法、及び接合体
WO2013094543A1 (ja) 導電性接着剤
JP5268260B2 (ja) 異方導電性接着剤及び電気装置
KR102732406B1 (ko) 접속 구조체 및 그의 제조 방법
CN112566995A (zh) 粘接剂组合物
KR20130067779A (ko) 이방성 도전 필름용 조성물 및 이를 이용한 이방성 도전 필름
KR101437256B1 (ko) 이방성 도전 필름, 접합체 및 접속 방법
KR20140019380A (ko) 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 구조의 제조 방법
KR102207300B1 (ko) 이방성 도전 필름, 그의 경화물 및 그의 제조 방법
JP2016072239A (ja) 異方性導電フィルム、及び接続方法
JP6123411B2 (ja) 異方性導電フィルム
CN101993575B (zh) 用于各向异性导电膜的组合物
KR20220107095A (ko) 접속 구조체, 회로 접속 부재 및 접착제 조성물
JP2002241722A (ja) 異方導電性接着剤
KR20140042808A (ko) 접착제 조성물, 그것을 이용한 필름상 접착제 및 회로 접속 재료, 회로 부재의 접속 구조 및 그의 제조 방법
CN108350320B (zh) 粘接剂组合物和结构体
JP2014086252A (ja) 導電粒子及び異方導電性接着剤
TWI814761B (zh) 接著劑膜
KR20230135612A (ko) 필름상 접착제 및 접속 구조체의 제조 방법
WO2017078157A1 (ja) 接着剤組成物及び構造体

Legal Events

Date Code Title Description
A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20170828

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20170828

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000