KR101435239B1 - 액체 토출 헤드 기재를 제조하는 프로세스 - Google Patents
액체 토출 헤드 기재를 제조하는 프로세스 Download PDFInfo
- Publication number
- KR101435239B1 KR101435239B1 KR1020100083346A KR20100083346A KR101435239B1 KR 101435239 B1 KR101435239 B1 KR 101435239B1 KR 1020100083346 A KR1020100083346 A KR 1020100083346A KR 20100083346 A KR20100083346 A KR 20100083346A KR 101435239 B1 KR101435239 B1 KR 101435239B1
- Authority
- KR
- South Korea
- Prior art keywords
- electrode layer
- insulating film
- laser beam
- substrate
- hollow portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/18—Electrical connection established using vias
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009204640 | 2009-09-04 | ||
| JPJP-P-2009-204640 | 2009-09-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20110025605A KR20110025605A (ko) | 2011-03-10 |
| KR101435239B1 true KR101435239B1 (ko) | 2014-08-28 |
Family
ID=43648097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020100083346A Expired - Fee Related KR101435239B1 (ko) | 2009-09-04 | 2010-08-27 | 액체 토출 헤드 기재를 제조하는 프로세스 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8445298B2 (enExample) |
| JP (1) | JP5606213B2 (enExample) |
| KR (1) | KR101435239B1 (enExample) |
| CN (1) | CN102009527B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5701014B2 (ja) * | 2010-11-05 | 2015-04-15 | キヤノン株式会社 | 吐出素子基板の製造方法 |
| JP5769560B2 (ja) * | 2011-09-09 | 2015-08-26 | キヤノン株式会社 | 液体吐出ヘッド用基体及びその製造方法 |
| US10035346B2 (en) | 2015-01-27 | 2018-07-31 | Canon Kabushiki Kaisha | Element substrate and liquid ejection head |
| JP6598658B2 (ja) * | 2015-01-27 | 2019-10-30 | キヤノン株式会社 | 液体吐出ヘッドの素子基板及び液体吐出ヘッド |
| EP3231007B1 (en) * | 2015-01-30 | 2021-04-14 | Hewlett-Packard Development Company, L.P. | Atomic layer deposition passivation for via |
| JP6881967B2 (ja) * | 2016-12-22 | 2021-06-02 | キヤノン株式会社 | 基板の製造方法 |
| JP7224782B2 (ja) * | 2018-05-30 | 2023-02-20 | キヤノン株式会社 | 液体吐出ヘッドおよびその製造方法 |
| JP7237480B2 (ja) * | 2018-06-29 | 2023-03-13 | キヤノン株式会社 | 液体吐出ヘッドおよびその製造方法 |
| US11161351B2 (en) * | 2018-09-28 | 2021-11-02 | Canon Kabushiki Kaisha | Liquid ejection head |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05147223A (ja) * | 1991-12-02 | 1993-06-15 | Matsushita Electric Ind Co Ltd | インクジエツトヘツド |
| JPH09314607A (ja) * | 1996-05-24 | 1997-12-09 | Ricoh Co Ltd | 射出成形用金型の調整方法ならびに金型調整用フィルムおよびその製造方法 |
| JP2004153269A (ja) * | 2002-10-31 | 2004-05-27 | Hewlett-Packard Development Co Lp | 基板貫通の相互接続部を形成する方法 |
| JP2009132133A (ja) * | 2007-01-09 | 2009-06-18 | Canon Inc | インクジェット記録ヘッドおよびその製造方法、半導体デバイス |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06312509A (ja) | 1993-04-30 | 1994-11-08 | Canon Inc | インクジェット記録ヘッド、インクジェット記録ヘッドの製造方法および前記インクジェット記録ヘッドを備えたインクジェット記録装置 |
| US5694684A (en) * | 1994-06-10 | 1997-12-09 | Canon Kabushiki Kaisha | Manufacturing method for ink jet recording head |
| EP1768847B1 (en) | 2004-06-28 | 2009-08-12 | Canon Kabushiki Kaisha | Liquid discharge head manufacturing method, and liquid discharge head obtained using this method |
-
2010
- 2010-08-18 JP JP2010183153A patent/JP5606213B2/ja active Active
- 2010-08-27 KR KR1020100083346A patent/KR101435239B1/ko not_active Expired - Fee Related
- 2010-08-30 US US12/871,233 patent/US8445298B2/en not_active Expired - Fee Related
- 2010-08-31 CN CN201010269391.9A patent/CN102009527B/zh not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05147223A (ja) * | 1991-12-02 | 1993-06-15 | Matsushita Electric Ind Co Ltd | インクジエツトヘツド |
| JPH09314607A (ja) * | 1996-05-24 | 1997-12-09 | Ricoh Co Ltd | 射出成形用金型の調整方法ならびに金型調整用フィルムおよびその製造方法 |
| JP2004153269A (ja) * | 2002-10-31 | 2004-05-27 | Hewlett-Packard Development Co Lp | 基板貫通の相互接続部を形成する方法 |
| JP2009132133A (ja) * | 2007-01-09 | 2009-06-18 | Canon Inc | インクジェット記録ヘッドおよびその製造方法、半導体デバイス |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102009527B (zh) | 2014-03-19 |
| US8445298B2 (en) | 2013-05-21 |
| JP2011073440A (ja) | 2011-04-14 |
| KR20110025605A (ko) | 2011-03-10 |
| US20110059558A1 (en) | 2011-03-10 |
| CN102009527A (zh) | 2011-04-13 |
| JP5606213B2 (ja) | 2014-10-15 |
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