CN102009527B - 制造液体排出头基材的方法 - Google Patents
制造液体排出头基材的方法 Download PDFInfo
- Publication number
- CN102009527B CN102009527B CN201010269391.9A CN201010269391A CN102009527B CN 102009527 B CN102009527 B CN 102009527B CN 201010269391 A CN201010269391 A CN 201010269391A CN 102009527 B CN102009527 B CN 102009527B
- Authority
- CN
- China
- Prior art keywords
- base material
- electrode layer
- dielectric film
- laser
- parylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 44
- 239000007788 liquid Substances 0.000 title claims abstract description 15
- 238000007599 discharging Methods 0.000 claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 claims description 26
- 239000010703 silicon Substances 0.000 claims description 15
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229920002396 Polyurea Polymers 0.000 claims description 3
- 229910000676 Si alloy Inorganic materials 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000002223 garnet Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 229910052743 krypton Inorganic materials 0.000 claims 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 238000000465 moulding Methods 0.000 description 18
- 239000000976 ink Substances 0.000 description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 13
- 229910052710 silicon Inorganic materials 0.000 description 12
- 239000000758 substrate Substances 0.000 description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 229910018125 Al-Si Inorganic materials 0.000 description 3
- 229910018520 Al—Si Inorganic materials 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 239000011093 chipboard Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000009429 electrical wiring Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 108010022579 ATP dependent 26S protease Proteins 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008485 antagonism Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- -1 polyparaxylylene Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/18—Electrical connection established using vias
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009204640 | 2009-09-04 | ||
| JP2009-204640 | 2009-09-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102009527A CN102009527A (zh) | 2011-04-13 |
| CN102009527B true CN102009527B (zh) | 2014-03-19 |
Family
ID=43648097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010269391.9A Expired - Fee Related CN102009527B (zh) | 2009-09-04 | 2010-08-31 | 制造液体排出头基材的方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8445298B2 (enExample) |
| JP (1) | JP5606213B2 (enExample) |
| KR (1) | KR101435239B1 (enExample) |
| CN (1) | CN102009527B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5701014B2 (ja) * | 2010-11-05 | 2015-04-15 | キヤノン株式会社 | 吐出素子基板の製造方法 |
| JP5769560B2 (ja) * | 2011-09-09 | 2015-08-26 | キヤノン株式会社 | 液体吐出ヘッド用基体及びその製造方法 |
| JP6598658B2 (ja) * | 2015-01-27 | 2019-10-30 | キヤノン株式会社 | 液体吐出ヘッドの素子基板及び液体吐出ヘッド |
| US10035346B2 (en) | 2015-01-27 | 2018-07-31 | Canon Kabushiki Kaisha | Element substrate and liquid ejection head |
| EP3231007B1 (en) * | 2015-01-30 | 2021-04-14 | Hewlett-Packard Development Company, L.P. | Atomic layer deposition passivation for via |
| JP6881967B2 (ja) | 2016-12-22 | 2021-06-02 | キヤノン株式会社 | 基板の製造方法 |
| JP7224782B2 (ja) * | 2018-05-30 | 2023-02-20 | キヤノン株式会社 | 液体吐出ヘッドおよびその製造方法 |
| JP7237480B2 (ja) * | 2018-06-29 | 2023-03-13 | キヤノン株式会社 | 液体吐出ヘッドおよびその製造方法 |
| US11161351B2 (en) * | 2018-09-28 | 2021-11-02 | Canon Kabushiki Kaisha | Liquid ejection head |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5694684A (en) * | 1994-06-10 | 1997-12-09 | Canon Kabushiki Kaisha | Manufacturing method for ink jet recording head |
| CN1976811A (zh) * | 2004-06-28 | 2007-06-06 | 佳能株式会社 | 排液头的制造方法和使用这一方法获得的排液头 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05147223A (ja) * | 1991-12-02 | 1993-06-15 | Matsushita Electric Ind Co Ltd | インクジエツトヘツド |
| JPH06312509A (ja) | 1993-04-30 | 1994-11-08 | Canon Inc | インクジェット記録ヘッド、インクジェット記録ヘッドの製造方法および前記インクジェット記録ヘッドを備えたインクジェット記録装置 |
| JPH09314607A (ja) * | 1996-05-24 | 1997-12-09 | Ricoh Co Ltd | 射出成形用金型の調整方法ならびに金型調整用フィルムおよびその製造方法 |
| US6790775B2 (en) * | 2002-10-31 | 2004-09-14 | Hewlett-Packard Development Company, L.P. | Method of forming a through-substrate interconnect |
| US7926909B2 (en) * | 2007-01-09 | 2011-04-19 | Canon Kabushiki Kaisha | Ink-jet recording head, method for manufacturing ink-jet recording head, and semiconductor device |
-
2010
- 2010-08-18 JP JP2010183153A patent/JP5606213B2/ja active Active
- 2010-08-27 KR KR1020100083346A patent/KR101435239B1/ko not_active Expired - Fee Related
- 2010-08-30 US US12/871,233 patent/US8445298B2/en not_active Expired - Fee Related
- 2010-08-31 CN CN201010269391.9A patent/CN102009527B/zh not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5694684A (en) * | 1994-06-10 | 1997-12-09 | Canon Kabushiki Kaisha | Manufacturing method for ink jet recording head |
| CN1976811A (zh) * | 2004-06-28 | 2007-06-06 | 佳能株式会社 | 排液头的制造方法和使用这一方法获得的排液头 |
Non-Patent Citations (1)
| Title |
|---|
| JP特开平6-312509A 1994.11.08 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20110025605A (ko) | 2011-03-10 |
| US8445298B2 (en) | 2013-05-21 |
| JP5606213B2 (ja) | 2014-10-15 |
| JP2011073440A (ja) | 2011-04-14 |
| KR101435239B1 (ko) | 2014-08-28 |
| CN102009527A (zh) | 2011-04-13 |
| US20110059558A1 (en) | 2011-03-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140319 Termination date: 20210831 |
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| CF01 | Termination of patent right due to non-payment of annual fee |