KR101433273B1 - 비휘발성 메모리 소자 및 그 제조 방법 - Google Patents
비휘발성 메모리 소자 및 그 제조 방법 Download PDFInfo
- Publication number
- KR101433273B1 KR101433273B1 KR1020090042370A KR20090042370A KR101433273B1 KR 101433273 B1 KR101433273 B1 KR 101433273B1 KR 1020090042370 A KR1020090042370 A KR 1020090042370A KR 20090042370 A KR20090042370 A KR 20090042370A KR 101433273 B1 KR101433273 B1 KR 101433273B1
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- organic
- nanocrystal
- memory device
- electrode
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- 238000000034 method Methods 0.000 title claims description 31
- 238000004519 manufacturing process Methods 0.000 title abstract description 19
- 239000002159 nanocrystal Substances 0.000 claims abstract description 82
- 239000000463 material Substances 0.000 claims abstract description 76
- 239000011368 organic material Substances 0.000 claims abstract description 42
- 239000010410 layer Substances 0.000 claims description 94
- 239000012044 organic layer Substances 0.000 claims description 42
- 230000004888 barrier function Effects 0.000 claims description 19
- MCEWYIDBDVPMES-UHFFFAOYSA-N [60]pcbm Chemical compound C123C(C4=C5C6=C7C8=C9C%10=C%11C%12=C%13C%14=C%15C%16=C%17C%18=C(C=%19C=%20C%18=C%18C%16=C%13C%13=C%11C9=C9C7=C(C=%20C9=C%13%18)C(C7=%19)=C96)C6=C%11C%17=C%15C%13=C%15C%14=C%12C%12=C%10C%10=C85)=C9C7=C6C2=C%11C%13=C2C%15=C%12C%10=C4C23C1(CCCC(=O)OC)C1=CC=CC=C1 MCEWYIDBDVPMES-UHFFFAOYSA-N 0.000 claims description 9
- 229920000301 poly(3-hexylthiophene-2,5-diyl) polymer Polymers 0.000 claims description 9
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 229910052745 lead Inorganic materials 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 229910052593 corundum Inorganic materials 0.000 claims description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 2
- 125000003396 thiol group Chemical class [H]S* 0.000 claims 1
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- 229920002981 polyvinylidene fluoride Polymers 0.000 description 4
- 230000005641 tunneling Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 239000000969 carrier Substances 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
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- 238000012360 testing method Methods 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical compound C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000002178 crystalline material Substances 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 229910003472 fullerene Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920000767 polyaniline Polymers 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 150000003573 thiols Chemical class 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229910010199 LiAl Inorganic materials 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PZOUSPYUWWUPPK-UHFFFAOYSA-N indole Natural products CC1=CC=CC2=C1C=CN2 PZOUSPYUWWUPPK-UHFFFAOYSA-N 0.000 description 1
- RKJUIXBNRJVNHR-UHFFFAOYSA-N indolenine Natural products C1=CC=C2CC=NC2=C1 RKJUIXBNRJVNHR-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002707 nanocrystalline material Substances 0.000 description 1
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- 238000000059 patterning Methods 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 229920002717 polyvinylpyridine Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- 238000004544 sputter deposition Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0009—RRAM elements whose operation depends upon chemical change
- G11C13/0014—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
- G11C13/0016—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material comprising polymers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5664—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using organic memory material storage elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0009—RRAM elements whose operation depends upon chemical change
- G11C13/0014—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/50—Bistable switching devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
- H10K19/202—Integrated devices comprising a common active layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Semiconductor Memories (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090042370A KR101433273B1 (ko) | 2009-05-15 | 2009-05-15 | 비휘발성 메모리 소자 및 그 제조 방법 |
PCT/KR2010/003000 WO2010131901A2 (fr) | 2009-05-15 | 2010-05-12 | Dispositif mémoire non volatile |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090042370A KR101433273B1 (ko) | 2009-05-15 | 2009-05-15 | 비휘발성 메모리 소자 및 그 제조 방법 |
Related Child Applications (1)
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KR20140026928A Division KR101482723B1 (ko) | 2014-03-07 | 2014-03-07 | 비휘발성 메모리 소자 및 그 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100123250A KR20100123250A (ko) | 2010-11-24 |
KR101433273B1 true KR101433273B1 (ko) | 2014-08-27 |
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KR1020090042370A KR101433273B1 (ko) | 2009-05-15 | 2009-05-15 | 비휘발성 메모리 소자 및 그 제조 방법 |
Country Status (2)
Country | Link |
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KR (1) | KR101433273B1 (fr) |
WO (1) | WO2010131901A2 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101460165B1 (ko) * | 2011-02-18 | 2014-11-11 | 한양대학교 산학협력단 | 비휘발성 메모리 소자 |
WO2014017683A1 (fr) * | 2012-07-27 | 2014-01-30 | Iucf-Hyu | Dispositif de mémoire non volatile |
KR101485507B1 (ko) * | 2014-09-25 | 2015-01-26 | 한양대학교 산학협력단 | 비휘발성 메모리 소자 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050025088A (ko) * | 2003-09-03 | 2005-03-11 | 더 리전트 오브 더 유니버시티 오브 캘리포니아 | 전계 프로그래밍가능 막에 기초한 메모리 디바이스 |
KR100666760B1 (ko) * | 2004-12-20 | 2007-01-09 | 한국화학연구원 | 비휘발성 메모리 유기 박막 트랜지스터 소자 및 그 제조방법 |
KR20080067857A (ko) * | 2007-01-17 | 2008-07-22 | 한양대학교 산학협력단 | 유기 쌍안정성 기억 소자 및 그 제조 방법 |
KR20080095761A (ko) * | 2007-04-25 | 2008-10-29 | 주식회사 하이닉스반도체 | 비휘발성 메모리 소자 및 그 제조 방법 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060134763A (ko) * | 2005-06-23 | 2006-12-28 | 서동학 | 나노 입자와 고분자 소재로 구성된 비휘발성 메모리 소자 |
DE102005035445B4 (de) * | 2005-07-28 | 2007-09-27 | Qimonda Ag | Nichtflüchtige, resistive Speicherzelle auf der Basis von Metalloxid-Nanopartikeln sowie Verfahren zu deren Herstellung und entsprechende Speicherzellenanordnung |
KR100868096B1 (ko) * | 2007-04-25 | 2008-11-11 | 삼성전자주식회사 | 전도성 고분자 유기물내 나노크리스탈층이 장착된 비휘발성메모리 소자 및 이의 제조 방법 |
KR101432151B1 (ko) * | 2007-07-16 | 2014-08-21 | 한국세라믹기술원 | 나노입자막 및 이를 포함하는 나노입자 전하저장 장치,나노입자 플래쉬 메모리 및 그 제조 방법 |
-
2009
- 2009-05-15 KR KR1020090042370A patent/KR101433273B1/ko active IP Right Grant
-
2010
- 2010-05-12 WO PCT/KR2010/003000 patent/WO2010131901A2/fr active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050025088A (ko) * | 2003-09-03 | 2005-03-11 | 더 리전트 오브 더 유니버시티 오브 캘리포니아 | 전계 프로그래밍가능 막에 기초한 메모리 디바이스 |
KR100666760B1 (ko) * | 2004-12-20 | 2007-01-09 | 한국화학연구원 | 비휘발성 메모리 유기 박막 트랜지스터 소자 및 그 제조방법 |
KR20080067857A (ko) * | 2007-01-17 | 2008-07-22 | 한양대학교 산학협력단 | 유기 쌍안정성 기억 소자 및 그 제조 방법 |
KR20080095761A (ko) * | 2007-04-25 | 2008-10-29 | 주식회사 하이닉스반도체 | 비휘발성 메모리 소자 및 그 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
KR20100123250A (ko) | 2010-11-24 |
WO2010131901A3 (fr) | 2011-02-17 |
WO2010131901A2 (fr) | 2010-11-18 |
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