KR101416838B1 - (Al,In,Ga,B)N의 전도도 제어 방법 - Google Patents
(Al,In,Ga,B)N의 전도도 제어 방법 Download PDFInfo
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- KR101416838B1 KR101416838B1 KR1020087021910A KR20087021910A KR101416838B1 KR 101416838 B1 KR101416838 B1 KR 101416838B1 KR 1020087021910 A KR1020087021910 A KR 1020087021910A KR 20087021910 A KR20087021910 A KR 20087021910A KR 101416838 B1 KR101416838 B1 KR 101416838B1
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- nitride semiconductor
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- nitride
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- H10P30/00—Ion implantation into wafers, substrates or parts of devices
- H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
- H10P30/202—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials
- H10P30/206—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group III-V semiconductors
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
- H10D62/405—Orientations of crystalline planes
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- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/81—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation
- H10D62/815—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW]
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- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
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- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/854—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs further characterised by the dopants
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- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
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- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
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- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
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- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2926—Crystal orientations
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- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
- H10P14/3416—Nitrides
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- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3438—Doping during depositing
- H10P14/3441—Conductivity type
- H10P14/3444—P-type
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- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3466—Crystal orientation
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P30/00—Ion implantation into wafers, substrates or parts of devices
- H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
- H10P30/208—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping of electrically inactive species
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US77218406P | 2006-02-10 | 2006-02-10 | |
| US60/772,184 | 2006-02-10 | ||
| PCT/US2007/003607 WO2007095137A2 (en) | 2006-02-10 | 2007-02-09 | Method for conductivity control of (al,in,ga,b)n |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20080108985A KR20080108985A (ko) | 2008-12-16 |
| KR101416838B1 true KR101416838B1 (ko) | 2014-07-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020087021910A Active KR101416838B1 (ko) | 2006-02-10 | 2007-02-09 | (Al,In,Ga,B)N의 전도도 제어 방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US8193079B2 (https=) |
| EP (1) | EP1984940A4 (https=) |
| JP (3) | JP5684455B2 (https=) |
| KR (1) | KR101416838B1 (https=) |
| WO (1) | WO2007095137A2 (https=) |
Families Citing this family (69)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7846757B2 (en) | 2005-06-01 | 2010-12-07 | The Regents Of The University Of California | Technique for the growth and fabrication of semipolar (Ga,A1,In,B)N thin films, heterostructures, and devices |
| KR101145755B1 (ko) * | 2005-03-10 | 2012-05-16 | 재팬 사이언스 앤드 테크놀로지 에이젼시 | 평면의 반극성 갈륨 질화물의 성장을 위한 기술 |
| EP1984545A4 (en) * | 2006-02-17 | 2013-05-15 | Univ California | PROCESS FOR THE GROWTH OF SEMIPOLARS (AL, IN, GA, B) N OPTOELECTRONIC COMPONENTS |
| EP2087507A4 (en) * | 2006-11-15 | 2010-07-07 | Univ California | METHOD FOR THE HETEROEPITAXIAL GROWTH OF QUALITATIVELY HIGH-QUALITY N-SIDE-GAN, INN AND AIN AND THEIR ALLOYS THROUGH METALLORGANIC CHEMICAL IMMUNE |
| US8193020B2 (en) | 2006-11-15 | 2012-06-05 | The Regents Of The University Of California | Method for heteroepitaxial growth of high-quality N-face GaN, InN, and AlN and their alloys by metal organic chemical vapor deposition |
| WO2008073469A1 (en) * | 2006-12-11 | 2008-06-19 | Lumenz, Llc | Zinc oxide multi-junction photovoltaic cells and optoelectronic devices |
| US8458262B2 (en) * | 2006-12-22 | 2013-06-04 | At&T Mobility Ii Llc | Filtering spam messages across a communication network |
| JP2010539732A (ja) * | 2007-09-19 | 2010-12-16 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 無極性および半極性の窒化物基板の面積を増加させる方法 |
| JP2011517099A (ja) * | 2008-04-04 | 2011-05-26 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | プレーナー半極性(Al,In,Ga,B)Nベースの発光ダイオード向けMOCVD成長技術 |
| US9157167B1 (en) | 2008-06-05 | 2015-10-13 | Soraa, Inc. | High pressure apparatus and method for nitride crystal growth |
| US8097081B2 (en) * | 2008-06-05 | 2012-01-17 | Soraa, Inc. | High pressure apparatus and method for nitride crystal growth |
| US8871024B2 (en) | 2008-06-05 | 2014-10-28 | Soraa, Inc. | High pressure apparatus and method for nitride crystal growth |
| US8303710B2 (en) * | 2008-06-18 | 2012-11-06 | Soraa, Inc. | High pressure apparatus and method for nitride crystal growth |
| US20100003492A1 (en) * | 2008-07-07 | 2010-01-07 | Soraa, Inc. | High quality large area bulk non-polar or semipolar gallium based substrates and methods |
| WO2011044554A1 (en) | 2009-10-09 | 2011-04-14 | Soraa, Inc. | Method for synthesis of high quality large area bulk gallium based crystals |
| US8805134B1 (en) | 2012-02-17 | 2014-08-12 | Soraa Laser Diode, Inc. | Methods and apparatus for photonic integration in non-polar and semi-polar oriented wave-guided optical devices |
| WO2010017148A1 (en) * | 2008-08-04 | 2010-02-11 | Soraa, Inc. | White light devices using non-polar or semipolar gallium containing materials and phosphors |
| US8284810B1 (en) | 2008-08-04 | 2012-10-09 | Soraa, Inc. | Solid state laser device using a selected crystal orientation in non-polar or semi-polar GaN containing materials and methods |
| US8979999B2 (en) | 2008-08-07 | 2015-03-17 | Soraa, Inc. | Process for large-scale ammonothermal manufacturing of gallium nitride boules |
| US8323405B2 (en) * | 2008-08-07 | 2012-12-04 | Soraa, Inc. | Process and apparatus for growing a crystalline gallium-containing nitride using an azide mineralizer |
| US8430958B2 (en) | 2008-08-07 | 2013-04-30 | Soraa, Inc. | Apparatus and method for seed crystal utilization in large-scale manufacturing of gallium nitride |
| US10036099B2 (en) | 2008-08-07 | 2018-07-31 | Slt Technologies, Inc. | Process for large-scale ammonothermal manufacturing of gallium nitride boules |
| US8021481B2 (en) | 2008-08-07 | 2011-09-20 | Soraa, Inc. | Process and apparatus for large-scale manufacturing of bulk monocrystalline gallium-containing nitride |
| US8148801B2 (en) | 2008-08-25 | 2012-04-03 | Soraa, Inc. | Nitride crystal with removable surface layer and methods of manufacture |
| US20100117070A1 (en) * | 2008-09-18 | 2010-05-13 | Lumenz Llc | Textured semiconductor light-emitting devices |
| EP2253988A1 (en) * | 2008-09-19 | 2010-11-24 | Christie Digital Systems USA, Inc. | A light integrator for more than one lamp |
| US8354679B1 (en) | 2008-10-02 | 2013-01-15 | Soraa, Inc. | Microcavity light emitting diode method of manufacture |
| US8455894B1 (en) | 2008-10-17 | 2013-06-04 | Soraa, Inc. | Photonic-crystal light emitting diode and method of manufacture |
| US8461071B2 (en) | 2008-12-12 | 2013-06-11 | Soraa, Inc. | Polycrystalline group III metal nitride with getter and method of making |
| USRE47114E1 (en) | 2008-12-12 | 2018-11-06 | Slt Technologies, Inc. | Polycrystalline group III metal nitride with getter and method of making |
| US8987156B2 (en) | 2008-12-12 | 2015-03-24 | Soraa, Inc. | Polycrystalline group III metal nitride with getter and method of making |
| US9543392B1 (en) | 2008-12-12 | 2017-01-10 | Soraa, Inc. | Transparent group III metal nitride and method of manufacture |
| US8878230B2 (en) | 2010-03-11 | 2014-11-04 | Soraa, Inc. | Semi-insulating group III metal nitride and method of manufacture |
| US8795430B2 (en) * | 2009-03-02 | 2014-08-05 | The Regents Of The University Of California | Method of improving surface morphology of (Ga,Al,In,B)N thin films and devices grown on nonpolar or semipolar (Ga,Al,In,B)N substrates |
| WO2010113238A1 (ja) * | 2009-04-03 | 2010-10-07 | パナソニック株式会社 | 窒化物系半導体素子およびその製造方法 |
| US8299473B1 (en) | 2009-04-07 | 2012-10-30 | Soraa, Inc. | Polarized white light devices using non-polar or semipolar gallium containing materials and transparent phosphors |
| US8306081B1 (en) | 2009-05-27 | 2012-11-06 | Soraa, Inc. | High indium containing InGaN substrates for long wavelength optical devices |
| US8427590B2 (en) | 2009-05-29 | 2013-04-23 | Soraa, Inc. | Laser based display method and system |
| US9829780B2 (en) | 2009-05-29 | 2017-11-28 | Soraa Laser Diode, Inc. | Laser light source for a vehicle |
| US10108079B2 (en) | 2009-05-29 | 2018-10-23 | Soraa Laser Diode, Inc. | Laser light source for a vehicle |
| US9250044B1 (en) | 2009-05-29 | 2016-02-02 | Soraa Laser Diode, Inc. | Gallium and nitrogen containing laser diode dazzling devices and methods of use |
| WO2010138923A1 (en) * | 2009-05-29 | 2010-12-02 | Soraa, Inc. | Laser based display method and system |
| CN102460739A (zh) * | 2009-06-05 | 2012-05-16 | 加利福尼亚大学董事会 | 长波长非极性及半极性(Al,Ga,In)N基激光二极管 |
| RU2563809C2 (ru) | 2009-09-04 | 2015-09-20 | Мпекс Фармасьютикалс, Инк. | Применение левофлоксацина в форме аэрозоля для лечения муковисцидоза |
| US20150004435A1 (en) * | 2009-09-17 | 2015-01-01 | National Chiao Tung University | Method for growing non-polar m-plane epitaxial layer of wurtzite semiconductors on single crystal oxide substrates |
| US8435347B2 (en) | 2009-09-29 | 2013-05-07 | Soraa, Inc. | High pressure apparatus with stackable rings |
| US9564320B2 (en) | 2010-06-18 | 2017-02-07 | Soraa, Inc. | Large area nitride crystal and method for making it |
| US9358200B2 (en) | 2010-09-23 | 2016-06-07 | Gelest Technologies, Inc. | Alkoxysilane derivatives of N-acyl amino acids, N-acyl dipeptides, and N-acyl tripeptides, and particles and stable oil-in-water formulations using the same |
| US8729559B2 (en) | 2010-10-13 | 2014-05-20 | Soraa, Inc. | Method of making bulk InGaN substrates and devices thereon |
| US8786053B2 (en) | 2011-01-24 | 2014-07-22 | Soraa, Inc. | Gallium-nitride-on-handle substrate materials and devices and method of manufacture |
| US8399367B2 (en) * | 2011-06-28 | 2013-03-19 | Nitride Solutions, Inc. | Process for high-pressure nitrogen annealing of metal nitrides |
| US8482104B2 (en) | 2012-01-09 | 2013-07-09 | Soraa, Inc. | Method for growth of indium-containing nitride films |
| WO2013141617A1 (en) * | 2012-03-21 | 2013-09-26 | Seoul Opto Device Co., Ltd. | Method of fabricating non-polar gallium nitride-based semiconductor layer, nonpolar semiconductor device, and method of fabricating the same |
| JP5699983B2 (ja) * | 2012-04-27 | 2015-04-15 | 住友電気工業株式会社 | 窒化ガリウム系半導体を作製する方法、iii族窒化物半導体デバイスを作製する方法、及びiii族窒化物半導体デバイス |
| US9196709B2 (en) * | 2013-02-01 | 2015-11-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods for forming semiconductor regions in trenches |
| JP6098259B2 (ja) * | 2013-03-19 | 2017-03-22 | 豊田合成株式会社 | 半導体装置の製造方法 |
| KR102061696B1 (ko) | 2013-11-05 | 2020-01-03 | 삼성전자주식회사 | 반극성 질화물 반도체 구조체 및 이의 제조 방법 |
| US11437774B2 (en) | 2015-08-19 | 2022-09-06 | Kyocera Sld Laser, Inc. | High-luminous flux laser-based white light source |
| US9787963B2 (en) | 2015-10-08 | 2017-10-10 | Soraa Laser Diode, Inc. | Laser lighting having selective resolution |
| US10771155B2 (en) | 2017-09-28 | 2020-09-08 | Soraa Laser Diode, Inc. | Intelligent visible light with a gallium and nitrogen containing laser source |
| US10222474B1 (en) | 2017-12-13 | 2019-03-05 | Soraa Laser Diode, Inc. | Lidar systems including a gallium and nitrogen containing laser light source |
| US10551728B1 (en) | 2018-04-10 | 2020-02-04 | Soraa Laser Diode, Inc. | Structured phosphors for dynamic lighting |
| WO2020018709A1 (en) * | 2018-07-18 | 2020-01-23 | The Regents Of The University Of California | Method for the fabrication of electrically-conductive semiconductor layers |
| US11421843B2 (en) | 2018-12-21 | 2022-08-23 | Kyocera Sld Laser, Inc. | Fiber-delivered laser-induced dynamic light system |
| US11239637B2 (en) | 2018-12-21 | 2022-02-01 | Kyocera Sld Laser, Inc. | Fiber delivered laser induced white light system |
| US12000552B2 (en) | 2019-01-18 | 2024-06-04 | Kyocera Sld Laser, Inc. | Laser-based fiber-coupled white light system for a vehicle |
| US12152742B2 (en) | 2019-01-18 | 2024-11-26 | Kyocera Sld Laser, Inc. | Laser-based light guide-coupled wide-spectrum light system |
| US11884202B2 (en) | 2019-01-18 | 2024-01-30 | Kyocera Sld Laser, Inc. | Laser-based fiber-coupled white light system |
| CN117178369A (zh) * | 2021-04-20 | 2023-12-05 | 华为技术有限公司 | 半导体器件、电子设备及形成半导体器件的方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000114596A (ja) | 1998-10-09 | 2000-04-21 | Japan Science & Technology Corp | p型III族窒化物半導体の製造方法 |
| JP2001119013A (ja) | 1999-10-19 | 2001-04-27 | Nippon Telegr & Teleph Corp <Ntt> | 窒化物半導体およびその作製方法 |
| JP2004111514A (ja) | 2002-09-17 | 2004-04-08 | Sanyo Electric Co Ltd | 窒化物系半導体発光素子およびその製造方法 |
| KR20050088437A (ko) * | 2002-12-16 | 2005-09-06 | 더 리전트 오브 더 유니버시티 오브 캘리포니아 | 수소화합물 기상 성장법에 의한 평면, 비극성 a면 질화갈륨의 성장 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5306662A (en) * | 1991-11-08 | 1994-04-26 | Nichia Chemical Industries, Ltd. | Method of manufacturing P-type compound semiconductor |
| CN1159750C (zh) * | 1997-04-11 | 2004-07-28 | 日亚化学工业株式会社 | 氮化物半导体的生长方法 |
| US6849472B2 (en) * | 1997-09-30 | 2005-02-01 | Lumileds Lighting U.S., Llc | Nitride semiconductor device with reduced polarization fields |
| US6218280B1 (en) * | 1998-06-18 | 2001-04-17 | University Of Florida | Method and apparatus for producing group-III nitrides |
| JP3592553B2 (ja) * | 1998-10-15 | 2004-11-24 | 株式会社東芝 | 窒化ガリウム系半導体装置 |
| WO2000033388A1 (en) * | 1998-11-24 | 2000-06-08 | Massachusetts Institute Of Technology | METHOD OF PRODUCING DEVICE QUALITY (Al)InGaP ALLOYS ON LATTICE-MISMATCHED SUBSTRATES |
| JP2001308017A (ja) * | 2000-04-24 | 2001-11-02 | Sony Corp | p型窒化物系III−V族化合物半導体の製造方法および半導体素子の製造方法 |
| JP3882539B2 (ja) * | 2000-07-18 | 2007-02-21 | ソニー株式会社 | 半導体発光素子およびその製造方法、並びに画像表示装置 |
| US6599362B2 (en) * | 2001-01-03 | 2003-07-29 | Sandia Corporation | Cantilever epitaxial process |
| US6635904B2 (en) * | 2001-03-29 | 2003-10-21 | Lumileds Lighting U.S., Llc | Indium gallium nitride smoothing structures for III-nitride devices |
| US6479313B1 (en) * | 2001-05-25 | 2002-11-12 | Kopin Corporation | Method of manufacturing GaN-based p-type compound semiconductors and light emitting diodes |
| US7501023B2 (en) * | 2001-07-06 | 2009-03-10 | Technologies And Devices, International, Inc. | Method and apparatus for fabricating crack-free Group III nitride semiconductor materials |
| US7105865B2 (en) * | 2001-09-19 | 2006-09-12 | Sumitomo Electric Industries, Ltd. | AlxInyGa1−x−yN mixture crystal substrate |
| US7186302B2 (en) * | 2002-12-16 | 2007-03-06 | The Regents Of The University Of California | Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition |
| JP2006521984A (ja) * | 2003-03-18 | 2006-09-28 | クリスタル フォトニクス,インコーポレイテッド | Iii族の窒化物装置を製作する方法およびそのように製作された装置 |
| US6847057B1 (en) * | 2003-08-01 | 2005-01-25 | Lumileds Lighting U.S., Llc | Semiconductor light emitting devices |
| US7009215B2 (en) * | 2003-10-24 | 2006-03-07 | General Electric Company | Group III-nitride based resonant cavity light emitting devices fabricated on single crystal gallium nitride substrates |
| US20050218414A1 (en) * | 2004-03-30 | 2005-10-06 | Tetsuzo Ueda | 4H-polytype gallium nitride-based semiconductor device on a 4H-polytype substrate |
| KR101365604B1 (ko) | 2004-05-10 | 2014-02-20 | 더 리전트 오브 더 유니버시티 오브 캘리포니아 | 유기금속 화학기상증착법을 이용한 비극성 질화인듐갈륨 박막들, 이중 구조들 및 소자들의 제조 |
| US7846757B2 (en) * | 2005-06-01 | 2010-12-07 | The Regents Of The University Of California | Technique for the growth and fabrication of semipolar (Ga,A1,In,B)N thin films, heterostructures, and devices |
| US7432142B2 (en) * | 2004-05-20 | 2008-10-07 | Cree, Inc. | Methods of fabricating nitride-based transistors having regrown ohmic contact regions |
| WO2006110163A2 (en) * | 2004-08-20 | 2006-10-19 | Yale University | Epitaxial growth of aligned algainn nanowires by metal-organic chemical vapor deposition |
| JP4548117B2 (ja) * | 2004-12-28 | 2010-09-22 | ソニー株式会社 | 半導体発光素子の製造方法、集積型半導体発光装置の製造方法、画像表示装置の製造方法および照明装置の製造方法 |
| KR101145755B1 (ko) * | 2005-03-10 | 2012-05-16 | 재팬 사이언스 앤드 테크놀로지 에이젼시 | 평면의 반극성 갈륨 질화물의 성장을 위한 기술 |
| TWI390633B (zh) * | 2005-07-13 | 2013-03-21 | 獨立行政法人科學技術振興機構 | 半極性氮化物膜缺陷減少之側向成長方法 |
-
2007
- 2007-02-09 JP JP2008554403A patent/JP5684455B2/ja active Active
- 2007-02-09 KR KR1020087021910A patent/KR101416838B1/ko active Active
- 2007-02-09 WO PCT/US2007/003607 patent/WO2007095137A2/en not_active Ceased
- 2007-02-09 US US11/673,426 patent/US8193079B2/en active Active
- 2007-02-09 EP EP07750442A patent/EP1984940A4/en not_active Withdrawn
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2012
- 2012-04-05 US US13/440,234 patent/US8709925B2/en active Active
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2013
- 2013-04-10 JP JP2013081851A patent/JP2013191851A/ja active Pending
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2014
- 2014-03-12 US US14/205,947 patent/US20140191244A1/en not_active Abandoned
- 2014-12-04 JP JP2014245563A patent/JP2015046640A/ja not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000114596A (ja) | 1998-10-09 | 2000-04-21 | Japan Science & Technology Corp | p型III族窒化物半導体の製造方法 |
| JP2001119013A (ja) | 1999-10-19 | 2001-04-27 | Nippon Telegr & Teleph Corp <Ntt> | 窒化物半導体およびその作製方法 |
| JP2004111514A (ja) | 2002-09-17 | 2004-04-08 | Sanyo Electric Co Ltd | 窒化物系半導体発光素子およびその製造方法 |
| KR20050088437A (ko) * | 2002-12-16 | 2005-09-06 | 더 리전트 오브 더 유니버시티 오브 캘리포니아 | 수소화합물 기상 성장법에 의한 평면, 비극성 a면 질화갈륨의 성장 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5684455B2 (ja) | 2015-03-11 |
| US8709925B2 (en) | 2014-04-29 |
| WO2007095137A8 (en) | 2008-09-18 |
| US8193079B2 (en) | 2012-06-05 |
| EP1984940A4 (en) | 2010-11-10 |
| US20120187415A1 (en) | 2012-07-26 |
| US20070190758A1 (en) | 2007-08-16 |
| US20140191244A1 (en) | 2014-07-10 |
| EP1984940A2 (en) | 2008-10-29 |
| WO2007095137A3 (en) | 2008-11-20 |
| JP2015046640A (ja) | 2015-03-12 |
| JP2009526405A (ja) | 2009-07-16 |
| WO2007095137A2 (en) | 2007-08-23 |
| JP2013191851A (ja) | 2013-09-26 |
| KR20080108985A (ko) | 2008-12-16 |
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