KR101413832B1 - 레지스트액 공급 장치 및 기판 처리 시스템 - Google Patents

레지스트액 공급 장치 및 기판 처리 시스템 Download PDF

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Publication number
KR101413832B1
KR101413832B1 KR1020070137426A KR20070137426A KR101413832B1 KR 101413832 B1 KR101413832 B1 KR 101413832B1 KR 1020070137426 A KR1020070137426 A KR 1020070137426A KR 20070137426 A KR20070137426 A KR 20070137426A KR 101413832 B1 KR101413832 B1 KR 101413832B1
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KR
South Korea
Prior art keywords
resist
resist solution
concentration
solution
pump
Prior art date
Application number
KR1020070137426A
Other languages
English (en)
Korean (ko)
Other versions
KR20080063119A (ko
Inventor
타카시 테라다
카즈키 모토마츠
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20080063119A publication Critical patent/KR20080063119A/ko
Application granted granted Critical
Publication of KR101413832B1 publication Critical patent/KR101413832B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00—Machines, pumps, or pumping installations having flexible working members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR1020070137426A 2006-12-28 2007-12-26 레지스트액 공급 장치 및 기판 처리 시스템 KR101413832B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006354139A JP4365404B2 (ja) 2006-12-28 2006-12-28 レジスト液供給装置及び基板処理システム
JPJP-P-2006-00354139 2006-12-28

Publications (2)

Publication Number Publication Date
KR20080063119A KR20080063119A (ko) 2008-07-03
KR101413832B1 true KR101413832B1 (ko) 2014-06-30

Family

ID=39695561

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070137426A KR101413832B1 (ko) 2006-12-28 2007-12-26 레지스트액 공급 장치 및 기판 처리 시스템

Country Status (2)

Country Link
JP (1) JP4365404B2 (ja)
KR (1) KR101413832B1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101371912B1 (ko) * 2009-12-28 2014-03-07 다즈모 가부시키가이샤 기판용 도포 장치 및 기판 도포 방법
JP5283714B2 (ja) * 2011-01-12 2013-09-04 東京エレクトロン株式会社 塗布膜除去方法及びその装置
JP2016096284A (ja) * 2014-11-17 2016-05-26 東京エレクトロン株式会社 液処理装置の運用方法、記憶媒体及び液処理装置
JP6407833B2 (ja) * 2015-10-13 2018-10-17 東京エレクトロン株式会社 処理液供給装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980070955A (ko) * 1997-01-31 1998-10-26 히가시데쓰로 도포장치 및 도포방법
JPH11133630A (ja) * 1997-10-27 1999-05-21 Hirama Rika Kenkyusho:Kk レジスト剥離液管理装置
KR20010095105A (ko) * 2000-03-31 2001-11-03 히가시 데쓰로 도포장치 및 혼합장치
JP2004073971A (ja) 2002-08-13 2004-03-11 Toshiba Corp 溶液塗布方法およびその装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980070955A (ko) * 1997-01-31 1998-10-26 히가시데쓰로 도포장치 및 도포방법
JPH11133630A (ja) * 1997-10-27 1999-05-21 Hirama Rika Kenkyusho:Kk レジスト剥離液管理装置
KR20010095105A (ko) * 2000-03-31 2001-11-03 히가시 데쓰로 도포장치 및 혼합장치
JP2004073971A (ja) 2002-08-13 2004-03-11 Toshiba Corp 溶液塗布方法およびその装置

Also Published As

Publication number Publication date
JP4365404B2 (ja) 2009-11-18
JP2008166478A (ja) 2008-07-17
KR20080063119A (ko) 2008-07-03

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