KR101398320B1 - Laser processing method and laser processing apparatus - Google Patents

Abstract

A mark position measuring step of measuring the position of the positioning mark by placing a material substrate 4 to be subjected to laser processing on a processing stage and picking up a positioning mark 11 formed on the material substrate; A distortion information acquiring step of acquiring distortion information on the distortion of the material substrate from the measurement result in the mark position measuring step and a distortion information obtaining step of correcting the position deviation of the laser processing due to the distortion of the material substrate And a position adjusting step of adjusting the traveling direction of the laser light in accordance with the distortion information. In the distortion information obtaining step, distortion is corrected in units of the modified regions (12-1 to 12-4) set by dividing the processing region (10) In the position adjustment step, the progress direction can be adjusted for each reorganization area.

Description

TECHNICAL FIELD [0001] The present invention relates to a laser processing method and a laser processing apparatus,

The present invention relates to a laser processing method and a laser processing apparatus.

In a so-called multilayer printed wiring board in which an interlayer insulating layer made of resin and a conductor circuit layer made of a conductor metal are alternately laminated, an opening hole called a via hole is formed in the interlayer insulating layer. A conductive film for electrical connection between the upper layer and the lower layer is formed on the wall surface of the via hole. Many via holes are formed by laser machining.

Conventionally, in a laser machining apparatus, a material substrate is placed on an XY table, alignment marks provided on four corners of the material substrate are read by a camera, and a deviation amount such as a position, rotation angle, and elongation of the material substrate is measured. The laser machining apparatus prepares machining data for correcting the deviation amount of the material substrate based on the measurement result and drives the galvanometer scanner and the XY table to increase the precision of the machining position of the via hole 1).

[Patent Document 1] Japanese Patent Application Laid-Open No. 2010-162559

The material substrate may have a distortion due to elongation and shrinkage due to deformation due to wiring pattern, lot difference, pressure variation during lamination, and the like. In the conventional machining method, since the distortion is observed by the four alignment marks with respect to the entire material substrate, it is difficult to detect the difference of the distortion in each region. The machining data for correcting the amount of deviation of the material substrate is produced without accurately detecting the difference in the distortion exhibited for each region, so that the accuracy of the machining position is deteriorated. In recent years, the printed wiring board tends to be required to have a high density with the miniaturization of products, and therefore, it is required to improve the precision of the processing position. In addition, the larger the material substrate, the more complicated expansion and contraction occurs in the material substrate. When the material substrate is made large in order to improve the productivity, it is difficult to correct the deviation due to the distortion with respect to the entire material substrate by using the four alignment marks.

SUMMARY OF THE INVENTION The present invention has been made in view of the above, and an object thereof is to obtain a laser processing method and a laser processing apparatus capable of improving the precision of a processing position.

In order to solve the above-described problems, in order to achieve the object, the present invention is characterized in that a material substrate to be subjected to laser processing is placed on a processing stage, and a positioning mark formed on the material substrate is picked up, A distortion information acquiring step of acquiring distortion information on the distortion of the material substrate from a measurement result in the mark position measuring step; And a position adjusting step of adjusting a traveling direction of the laser light incident on the machining area of the material substrate in accordance with the distortion information so as to correct the position deviation of the material substrate by dividing the machining area into a plurality of Acquires the distortion information on the basis of the set reorganization (piece, individual piece) area, The value adjustment process for each of the reorganization region characterized by adjustably to the travel direction.

In the laser processing method according to the present invention, the distortion information is acquired with the reconstruction area as a unit, so that the distortion of each area can be accurately detected and the distortion can be observed with respect to the whole processing area. The processing position can be corrected with high precision by adjusting the traveling direction of the laser light for each reorganization area. As a result, it is possible to improve the accuracy of the machining position.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a diagram showing a schematic configuration of a laser machining apparatus according to Embodiment 1 of the present invention. FIG.
Fig. 2 is a block diagram showing a configuration for correcting the position deviation of laser machining.
Fig. 3 is a view showing an alignment area and an alignment mark set in the machining area of the work. Fig.
Fig. 4 is a view for explaining acquisition of distortion information using only alignment marks formed at the four corners of the machining area as a comparative example of the first embodiment. Fig.
5 is a diagram for explaining acquisition of distortion information according to the first embodiment.
6 is a flowchart for explaining the sequence of laser machining.
Fig. 7 is a diagram showing a modified region and a scan region set in a machining region of a work in the laser machining method according to Embodiment 2 of the present invention. Fig.
8 is a view for explaining an example of setting of a scan area in the comparative example of the second embodiment.
Fig. 9 is a flowchart for explaining the procedure up to the setting of the scan area.
10 is a diagram for explaining table coordinates.
Fig. 11 is a view for explaining galvano coordinates. Fig.
12 is a block diagram showing a structure for correcting positional deviation of laser machining by the laser machining method according to Embodiment 3 of the present invention.
Fig. 13 is a block diagram showing a configuration for carrying out the laser machining method according to the fourth embodiment of the present invention. Fig.
14 is a diagram showing an image of data for laser machining input to the machining control apparatus.

Hereinafter, embodiments of the laser processing method and the laser processing apparatus according to the present invention will be described in detail with reference to the drawings. The present invention is not limited by these embodiments.

Embodiment 1

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a diagram showing a schematic configuration of a laser machining apparatus according to Embodiment 1 of the present invention. FIG. The laser machining apparatus 100 irradiates the work 4 with the laser light L and performs laser drilling of the work 4. The work 4 is a material substrate constituting, for example, a multilayer printed wiring board as an object of laser machining. The work 4 has a three-layer structure in which, for example, an insulating layer made of resin is sandwiched between two conductor layers made of a copper foil.

The laser processing apparatus 100 includes a laser oscillator 1, a processing control unit 2, and a laser processing unit 3. [ The laser oscillator 1 oscillates the beam-like laser light L. The laser processing unit 3 includes galvanometer mirrors 35X and 35Y, galvanometer scanners 36X and 36Y, an f? Lens (condenser lens) 34, an XY table 30 and a camera 39.

The galvanometer scanner 36Y rotates the galvanometer mirror 35Y. The galvanometer mirror 35Y reflects the laser light L from the laser oscillator 1. [ The galvanometer mirror 35Y is rotated to change the traveling direction of the laser light L in the Y direction.

The galvanometer scanner 36X rotates the galvanometer mirror 35X. The galvanometer mirror 35X reflects the laser light L from the galvanometer mirror 35Y. The galvanometer mirror 35X rotates to change the traveling direction of the laser light L in the X direction.

The galvanomirrors 35X and 35Y move the incident position of the laser light L in the X and Y directions on the work 4. The galvanometer scanners 36X and 36Y function as a scan driver for changing the incident position of the laser light L on the machining area of the workpiece 4. [

The f? lens 34 is a condenser lens having telecentricity. The f? lens 34 aligns the direction of the principal ray of the laser light L. The f? lens 34 causes the laser light L to enter the processing position Hx of the workpiece 4. The laser machining apparatus 100 forms a machining hole penetrating the workpiece 4 at the machining position Hx by the laser beam L. [

The XY table 30 is a machining stage on which the workpiece 4 is placed. The XY table 30 moves in the XY plane by driving the X-axis motor and the Y-axis motor (both not shown). The XY table 30 moves the workpiece 4 in the X and Y directions.

A plurality of alignment marks 11 are formed on the work 4. The alignment mark 11 is a positioning mark. Fig. 1 shows a part of a plurality of alignment marks 11. Fig. The shape of the alignment mark 11 is arbitrary.

The camera 39 is an image pickup section for picking up an alignment mark 11 formed on a work 4 placed on the XY table 30. [ The camera 39 measures the position of the alignment mark 11 by taking an image of the alignment mark 11. The camera 39 is, for example, a CCD (Charge Coupled Device) camera. The camera 39 is disposed in the vicinity of a processing head (not shown) for irradiating the work 4 with the laser light L, for example.

The processing control apparatus 2 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like. The machining control device 2 controls the entire laser machining apparatus 100. The machining control apparatus 2 performs NC (Numerical Control) control of the laser oscillator 1, the galvanometer scanners 36X and 36Y, and the XY table 30 in accordance with the machining program.

The laser machining apparatus 100 changes the incident position of the laser light L on the machining area of the workpiece 4 by driving the galvanometer scanners 36X and 36Y and the XY table 30. [ The laser machining apparatus 100 performs laser machining in units of scan areas in accordance with the amplitude of the laser light L by the galvanometer mirrors 35X and 35Y every time the XY table 30 is moved.

Fig. 2 is a block diagram showing a configuration for correcting the position deviation of laser machining. The machining control apparatus 2 has a distortion correction coefficient calculation processing section 21, a galvanometer mirror position correction processing section 22 and an XY table position correction processing section 23. The camera 39 measures the position of the alignment mark 11 and outputs measurement data including the coordinates of the alignment mark 11 as a measurement result.

The machining control apparatus 2 controls the work 4 on the XY table 30 on the basis of the measurement data input from the camera 39 to the machining control apparatus 2 , The rotation angle, and the amount of deviation due to the expansion and contraction of the work 4 are calculated. The machining control apparatus 2 creates machining data for correcting various amounts of deviation of the workpiece 4 based on the calculation results and drives the XY table 30 and the galvanometer scanners 36X and 36Y.

The distortion correction coefficient calculation processing unit 21 acquires the distortion information from the measurement data input from the camera 39 to the processing control apparatus 2. [ The distortion information is information on distortion caused by elongation and contraction of the work 4, and includes, for example, data on the direction and amount of distortion. The distortion correction coefficient calculation processing unit 21 calculates a distortion correction coefficient according to the distortion information. The distortion correction coefficient is a coefficient for correcting the position deviation of the laser processing due to the distortion of the work 4.

The distortion correction coefficient calculation processing unit 21 converts the calculated distortion correction coefficient into a table correction coefficient and a scanning correction coefficient. The table correction coefficient is a coefficient for adjusting the position of the XY table 30 in order to correct the position deviation of laser machining due to distortion of the workpiece 4. [ The correction coefficient for scanning is a coefficient for adjusting the inclination of the galvanomirrors 35X and 35Y in order to correct the position deviation of the laser machining caused by the distortion of the workpiece 4. [

The galvanometer mirror position correction processing section 22 functions as a position adjustment processing section for adjusting the advancing direction of the laser light L to be incident on the machining area of the workpiece 4 in accordance with the scan correction coefficient obtained from the distortion correction coefficient. The galvanometer mirror position correction processing section 22 corrects the position deviation amount and rotation angle of the workpiece 4 so that the laser light L is incident on the predetermined processing position Hx, The driving of the galvanometer scanners 36X and 36Y is adjusted in accordance with the correction coefficients for the first to third embodiments.

The XY table position correction processing section 23 corrects the position deviation amount and rotation angle of the workpiece 4 so that the laser light L is incident on the predetermined processing position Hx, The position of the XY table 30 is adjusted in accordance with the correction coefficient.

Fig. 3 is a view showing an alignment area and an alignment mark set in the machining area of the work. Fig. The machining area 10 is an area to be subjected to laser machining in the workpiece 4. [ The machining position Hx (see Fig. 1) is set in the machining area 10.

In the machining area 10, for example, four reorganization areas 12-1, 12-2, 12-3 and 12-4 are set. The reorganization regions 12-1 to 12-4 are set by dividing the processing region 10 into two vertically and horizontally into four. The reorganization areas 12-1 to 12-4 are set to be wider than the scan area. In the workpiece 4, nine alignment marks 11 are formed. The alignment marks 11 are arranged at four corners of the reorganization areas 12-1 to 12-4.

The distortion correction coefficient calculation processing unit 21 obtains distortion information on the reconstruction region 12-1 based on the coordinates of the alignment marks 11 arranged at the four corners of the reconstruction region 12-1. The distortion correction coefficient calculation processing unit 21 calculates a distortion correction coefficient to be applied to the modification region 12-1 from the distortion information for the modification region 12-1.

The distortion correction coefficient calculation processing unit 21 calculates the distortion correction coefficients 12-2, 12-3, and 12-4 applied to the modified regions 12-2, 12-3, and 12-4 in the same manner for the modified regions 12-2, Respectively. The distortion correction coefficient calculation processing unit 21 acquires the distortion information on the basis of the reconstruction regions 12-1 to 12-4 as a unit and calculates the distortion correction coefficients for each of the reconstruction regions 12-1 to 12-4 .

The distortion correction coefficient calculation processing unit 21 calculates a table correction coefficient and a scanning correction coefficient for each of the reformed regions 12-1 to 12-4 from the distortion correction coefficient for each of the reformed regions 12-1 to 12-4 do.

The galvanometer mirror position correction processing section 22 corrects the galvanomirrors 36X and 36X in accordance with the scanning correction coefficient calculated for the modified area 12-1 with respect to the processing position Hx in the reconstructed area 12-1. 36Y. The galvanometer mirror position correction processing section 22 also corrects the machining positions Hx in the reorganization regions 12-2, 12-3 and 12-4 in the reorganization regions 12-2, 12-3 and 12-4 , The driving of the galvanometer scanners 36X and 36Y is adjusted in accordance with the scanning correction coefficients thus calculated. The galvanometer mirror position correction processing section 22 adjusts the advancing direction of the laser light L for each of the reorganization regions 12-1 to 12-4.

The XY table position correction processing section 23 corrects the position of the XY table 30 in accordance with the table correction coefficient calculated for the modified area 12-1 with respect to the processing position Hx in the reformed area 12-1 Adjust. The XY table position correction processing section 23 similarly applies the restructuring regions 12-2, 12-3 and 12-4 to the respective processing positions Hx in the reorganization regions 12-2, 12-3 and 12-4, The position of the XY table 30 is adjusted in accordance with the table correction coefficient calculated for each table.

The distortion correction coefficient calculation processing unit 21 is not limited to generating both the table correction coefficient and the scanning correction coefficient in accordance with the distortion correction coefficient. The distortion correction coefficient calculation process 21 may be any one that generates at least the correction coefficient for scanning from the distortion correction coefficient. The machining control apparatus 2 can correct the distortion of the workpiece 4 by adjusting the tilt of at least the galvanometer mirrors 35X and 35Y among the position adjustment of the XY table 30 and the tilt adjustment of the galvanometer mirrors 35X and 35Y It is assumed that the position deviation due to the positional deviation is corrected.

Fig. 4 is a view for explaining acquisition of distortion information using only alignment marks formed at the four corners of the machining area as a comparative example of the first embodiment. Fig. For example, as shown in Fig. 4, it is assumed that the workpiece 4 is distorted so as to protrude leftward in the left-right direction, and contracts in the up-and-down direction. In this case, the amount of information is insufficient to observe the distortion of the entire machining area 13 only at the coordinates of the alignment marks 11 at the four corners of the machining area 13, and the accurate detection of the distortion and the machining position Hx, So that it is difficult to make high-precision adjustment.

5 is a diagram for explaining acquisition of distortion information according to the first embodiment. In the laser machining method according to the present embodiment, the distortion information is obtained by using the modified regions 12-1 to 12-4 as a unit, so that the distortion for each of the modified regions 12-1 to 12-4 is accurately detected, So that distortion can be observed with respect to the entire region 10. The machining position can be corrected with high precision with respect to the entire machining region 10 by adjusting the advancing direction of the laser light L and the position of the XY table 30 for each of the reorganization regions 12-1 to 12-4 . As a result, the laser machining apparatus 100 can improve the accuracy of the machining position.

6 is a flowchart for explaining the sequence of laser machining. When the workpiece 4 is placed on the XY table 30, the camera 39 picks up the alignment marks 11 of the workpiece 4 and measures the position of each alignment mark 11 Step S11).

The distortion correction coefficient calculation processing unit 21 acquires the distortion information from the measurement result in step S11 (distortion information acquisition step). The distortion correction coefficient calculation processing unit 21 acquires the distortion information using the reorganization areas 12-1 to 12-4 as a unit. The distortion correction coefficient calculation processing unit 21 calculates a distortion correction coefficient for each of the reorganization areas 12-1 to 12-4 from the obtained distortion information (step S12). The distortion correction coefficient calculation processing unit 21 converts the calculated distortion correction coefficient into a table correction coefficient and a scanning correction coefficient.

The XY table position correction processing section 23 moves the XY table 30 to the initial position for making the laser light L enter the processing position Hx at which the laser processing is first performed. At this time, the XY table position correcting processing section 23 corrects the position of the XY table (i.e., the XY table position) by using the position after correction by the correction coefficient for table obtained for the reorganization region including the processing position Hx, 30) (step S13).

The galvanometer mirror position correction processing section 22 drives the galvanometer mirrors 35X and 35Y until it becomes a slope for causing the laser light L to enter the processing position Hx. At this time, the galvanometer mirror position correction processing section 22 drives the galvanometer mirrors 35X and 35Y to the angle after correction by the scanning correction coefficient obtained for the reconstruction area 12-1 (step S14).

In step S14, the galvanometer mirror position correction processing section 22 adjusts the advancing direction of the laser light L incident on the machining area 10 in accordance with the distortion information for each of the machining areas 12-1 to 12-4 (Position adjustment process). The XY table position correction processing section 23 and the galvanometer mirror position correction processing section 22 correct the deviation of the processing position Hx due to the distortion of the workpiece 4 in steps S13 and S14. The laser machining apparatus 100 drives the galvanometer mirrors 35X and 35Y in step S14 and then laser light L is incident on the machining position Hx to perform laser machining of the workpiece 4 Step S15).

The machining control apparatus 2 determines whether or not laser machining in the current scan area has been completed by laser machining in step S15 (step S16). The galvanomirror position correction processing section 22 determines whether or not the laser beam L is incident on the next machining position Hx in step S14 Drive the galvanometer mirrors (35X and 35Y) to an angle.

When the laser machining in the current scan area is completed (step S16, YES), the machining control device 2 determines whether or not laser machining of the entire machining area 10 has been completed (step S17). The XY table position correction processing section 23 determines whether or not the laser processing is performed on the entire machining area 10 (step S17, No) L to be incident on the XY table 30.

When the laser machining of the entire machining area 10 is completed (step S17, YES), the laser machining apparatus 100 finishes the laser machining of the workpiece 4 placed on the XY table 30.

In the laser machining method according to the first embodiment, it is assumed that the method of setting the reformation region in the machining region 10 can be appropriately changed. The reorganization area may be set by dividing the machining area 10 into a plurality of parts, and the number or the arrangement may be appropriately changed. The alignment marks 11 may be formed so as to correspond to the respective reorganization areas, and the positions and the numbers may be appropriately changed.

Embodiment 2 Fig.

Fig. 7 is a diagram showing a modified region and a scan region set in a machining region of a work in the laser machining method according to Embodiment 2 of the present invention. Fig. The same reference numerals are given to the same parts as those in the first embodiment, and redundant explanations are appropriately omitted.

The scan region 14 is set in accordance with the amplitude of the laser light L by the galvano mirrors 35X and 35Y. In the machining area 10, for example, 35 scan areas 14 are set. In the illustrated example, the scan areas 14 are set so as not to overlap each other.

In this example, among the 35 scan areas 14, 11 scan areas 14 are set to extend over two or more reorganization areas 12-1 to 12-4. A scan region 14 located at the center among the 35 scan regions 14 extends over four reorganization regions 12-1 to 12-4. Six scan regions 14 parallel to the central scan region 14 and four scan regions 14 vertically parallel to each other are arranged in two of the reorganization regions 12-1 to 12-4 It wears.

8 is a view for explaining an example of setting of a scan area in the comparative example of the second embodiment. In this comparative example, as an application of the conventional laser machining method, it is assumed that the deviation amount of the work 4 is corrected independently for each of the reorganization regions 12-1 to 12-4.

For example, it is assumed that the scan area 15 in the comparative example is the same size as the scan area 14 in the second embodiment shown in Fig. In the comparative example, since it is necessary to completely switch the distortion correction coefficient for each of the reorganization areas 12-1 to 12-4, the scan area 15 is provided with a plurality of reorganization areas 12-1 to 12-4 But is set so as to enter each of the reorganization areas 12-1 to 12-4.

By adopting such a setting method of the scan area 15, portions where the scan areas 15 overlap each other are generated in the individual reorganization areas 12-1 to 12-4 as indicated by slashes in the figure. When the scan regions 15 overlapping each other are also counted, twelve scan regions 15 are set in each of the reorganization regions 12-1 to 12-4. In the entire machining area 10, 48 scan areas 15 are set. There are scan regions 15 that overlap with each other, so that the number of scan regions 15 is larger than in the case of Embodiment 2 shown in Fig.

The laser machining apparatus 100 moves the XY table 30 much more as the number of the scan areas 15 increases. During the movement of the XY table 30, the irradiation of the laser light L is stopped, so that the progress of laser machining is stopped. As the number of scan areas 15 increases, the processing time per workpiece 4 increases. Further, the more the movement of the XY table 30 is, the more the number of times of measurement work required for positioning the XY table 30 is increased. Therefore, the greater the number of the scan regions 15, the lower the efficiency of processing and the productivity of the product.

Applying the scan area setting method according to the second embodiment shown in Fig. 8 appropriately places the scan area 14 in the plurality of reorganization areas 12-1 to 12-4 irrespective of the arrangement of the alignment marks 11 It is possible to minimize the number of the scan areas 14 in the entire machining area 10. In the example shown in Fig. 8, the number of scan areas 14 in the entire machining area 10 is at least 35.

According to the second embodiment, the laser machining apparatus 100 can shorten the machining time per workpiece 4 by minimizing the number of scan areas 14 set in the workpiece 4. [ In addition, the laser machining apparatus 100 can reduce the number of times of measurement work required for positioning the XY table 30. As a result, the laser machining apparatus 100 can improve machining efficiency and product productivity.

In the second embodiment, it is assumed that the setting of the reorganization area and the setting of the scan area 14 can be appropriately changed. It is assumed that the reorganization region and the scan region 14 are not related to the arrangement of the alignment marks 11 and that at least one of the scan regions 14 can be set to extend over a plurality of reorganization regions.

Fig. 9 is a flowchart for explaining the procedure up to the setting of the scan area. The machining control apparatus 2 reads out the coordinates of the position for forming the machining hole from the design data, for example, for each diameter of the machining hole.

The machining control device 2 determines a reorganization area including the coordinates of the machining hole among the reorganization areas 12-1 to 12-4. The machining control apparatus 2 associates the corresponding reorganization area number with the coordinates of the machining hole (step S21). The reorganization area number is set in advance for each of the reorganization areas 12-1 to 12-4 for identification of the reorganization areas 12-1 to 12-4.

The machining control apparatus 2 divides the machining area 10 so that the number of the scan areas 15 with respect to the machining area 10 is minimized (step S22). The machining control device 2 has a smaller number of overlapping portions of the scan regions 15 as possible on the basis of the predetermined size of the scan region 15 and the size of the machining region 10, A method of arranging the scan area 15 for preventing a gap from being formed in the entire area is obtained. The number of scan areas 15 in the machining area 10 is minimized when the overlapping areas of the scan areas 15 are the smallest.

The machining control device 2 is provided with five scan areas 14 vertically and horizontally seven scan lines 14 from the both sides of the scan area 14 and the machining area 10 shown in Fig. It is determined that the number of the scan regions 14 becomes a minimum of 35 in the case where all of the scan regions 14 are arranged without being overlapped.

The machining control apparatus 2 converts coordinates of the machining hole read out from the design data into table coordinates and galvano coordinates for laser machining. The table coordinates indicate positions at which the XY table 30 is moved for forming the machining holes. The table coordinates indicate the position of the scan area 14. The table coordinates are denoted as XY coordinates, for example, as shown in Fig. 10, which are inherent coordinates of the XY table 30.

The Galvano coordinates indicate the positions at which the laser light L is incident in the scan region 14 by the galvanometer mirrors 35X and 35Y. The galvano coordinates are intrinsic coordinates of the galvanometer mirrors 35X and 35Y, and are represented, for example, as XY coordinates as shown in Fig. The coordinates of the machining hole are represented by adding the table coordinate and the galvano coordinate.

The machining control apparatus 2 adds reorganized area numbers "N1", "N2", "N3",... To table coordinates and galvano coordinates, for example, as shown in FIG. 10 and FIG. The reorganization area numbers "N1", "N2", "N3", etc. correspond to, for example, the reorganization areas 12-1, 12-2, 12-3.

Next, the calculation of the table correction coefficient and the scanning correction coefficient for the scan area 14 over a plurality of reorganization areas will be described. The coordinates (X ', Y') of the machining position Hx after correction are represented by the following formula. (X, Y) is the coordinates of the machining hole before correction read from the design data, f is a correction function using a table correction coefficient, and q is a correction function using a correction coefficient for scanning.

X '= f (X, Y)

Y '= q (X, Y)

Here, examples of correction for the machining holes in the scan region 14 that do not overlap the other reorganization regions 12-2, 12-3, and 12-4 among the reorganization regions 12-1 are exemplified. In this case, a table correction coefficient and a scanning correction coefficient for the modified area 12-1 are applied to correct the position of the machining hole.

(X ', Y') are divided by the correction by the movement of the XY table 30 and the correction by the driving of the galvanometer mirrors 35X and 35Y.

X '= Ft (Xt, Yt) + fg (Xg, Yg)

Y '= Qt (Xt, Yt) + qg (Xg, Yg)

Here, (Xt, Yt) is the table coordinate before correction, and (Xg, Yg) is the Galvano coordinate before correction, and X = Xt + Xg and Y = Yt + Yg. ft and Qt are correction functions indicating the correction for moving the XY table 30 in accordance with the table correction coefficient for the reformed area 12-1. Ft (Xt, Yt) represents the table coordinates after correction by Ft. Qt (Xt, Yt) represents the table coordinates after correction by Qt.

fg and qg are correction functions indicating the correction for driving the galvanometer mirrors 35X and 35Y in accordance with the scanning correction coefficient for the regrown region 12-1. fg (Xg, Yg) represents the Galvano coordinates after correction by fg. qg (Xg, Yg) represents the Galvano coordinates after correction by qg.

Next, correction for the machining hole in the scan area 14 across the modified areas 12-1 and 12-2 will be described. The machining control apparatus 2 identifies, from the coordinate of the machining hole read out from the design data, whether the machining hole is included in the modified regions 12-1 and 12-2. In the case where the machining hole is included in the disposition region 12-1, the table correction coefficient and the scan correction coefficient for the disposition region 12-1 are applied to correct the position of the machining hole.

In the case where the processing hole is included in the reforming region 12-2, for example, the table correction coefficient for the reforming region 12-1 and the table correction coefficient for the reforming region 12-2 A scan correction coefficient is applied. The galvanomirror position correction processing section 22 (see FIG. 2) changes the difference obtained by subtracting the table correction coefficient for the reformed region 12-1 from the table correction coefficient for the reformed region 12-2 from the modified region 12- 2) to the scan correction coefficient.

(X ', Y') are divided by the correction by the movement of the XY table 30 and the correction by the driving of the galvanometer mirrors 35X and 35Y.

(Xt, Yt) + ug (Xg, Yg) + ut (Xt, Yt)

Yt = Qt (Xt, Yt) + vg (Xg, Yg) + vt (Xt, Yt)

Here, (Xt, Yt) is the table coordinate before correction, and (Xg, Yg) is the Galvano coordinate before correction, and X = Xt + Xg and Y = Yt + Yg. Ft and Qt are correction functions indicating the correction for moving the XY table 30 in accordance with the table correction coefficient for the reformed area 12-1. Ft (Xt, Yt) represents the table coordinates after correction by Ft. Qt (Xt, Yt) represents the table coordinates after correction by Qt.

and ug and vg are correction functions indicating the correction for driving the galvanometer mirrors 35X and 35Y in accordance with the scanning correction coefficient for the reorganization region 12-2. ug (Xg, Yg) represents the Galvano coordinates after correction by ug. vg (Xg, Yg) represents the Galvano coordinates after correction by vg.

ut and vt are correction functions indicating the correction for driving the galvanomirrors 35X and 35Y in accordance with the table correction coefficient for the reorganization region 12-2. ft and qt are correction functions indicating correction for driving the galvanometer mirrors 35X and 35Y in accordance with the correction coefficient for the table for the modified region 12-1.

each term of ut (Xt, Yt) and vt (Xt, Yt) means that the correction amount corresponding to the table correction coefficient for the regrown region 12-2 is added to the driving by the galvanomirrors 35X and 35Y do. -ft (Xg, Yg) and -qt (Xg, Yg) are subtracted from the driving by the galvanometer mirrors 35X and 35Y in accordance with the table correction coefficient for the modified region 12-1 .

The machining control apparatus 2 corrects the position of the machining hole with respect to the scan region 14 extending over the reorganization regions 12-1 and 12-2 in this manner. The processing control apparatus 2 controls the entire scan area 14 extending over the plurality of reorganization areas 12-1 to 12-4 such that the movement of the XY table 30 is a reorganization area And the correction amount corresponding to the table correction coefficient is adjusted in driving the galvanometer mirrors 35X and 35Y.

Further, the laser machining apparatus 100 may appropriately change the position of the machining hole included in the scan region 14 extending over the plurality of machining regions. For example, the XY table position correction processing section 23 (see FIG. 2) can also apply the average value of the table correction coefficient for each reorganization area covered by the scan area 14 to the correction by movement of the XY table 30 do. The position of the XY table 30 can be adjusted based on at least any one of the distortion information acquired for the plurality of reorganization areas across the scan area 14 for the scan area 14 set over the plurality of reorganization areas .

The laser machining apparatus 100 can perform laser machining that minimizes the number of scan areas 14 set in the work 4 by including the above procedure in the laser machining so that the machining efficiency and the productivity of the product Can be improved.

Embodiment 3:

12 is a block diagram showing a structure for correcting positional deviation of laser machining by the laser machining method according to Embodiment 3 of the present invention. The same reference numerals are given to the same parts as those in the first embodiment, and redundant explanations are appropriately omitted.

The processing control apparatus 40 has a distortion correction coefficient calculation processing section 41, a galvanometer mirror position correction processing section 22, an XY table position correction processing section 23 and a lot determination processing section 42. [ The lot judgment processing section 42 identifies the lot of the work 4 placed on the XY table 30. [ The lot judgment processing section 42 counts the number of workpieces 4 of the same lot placed on the XY table 30 successively.

The distortion correction coefficient calculation processing section 41 calculates the distortion correction coefficient for the second and subsequent workpieces 4 among the workpieces 4 of the same lot to be continuously placed on the XY table 30 with respect to the case of the first workpiece 4 Thereby simplifying processing for calculating information.

In the third embodiment, the laser machining apparatus 100 acquires the distortion information for the first work 4 of the same lot as in the first and second embodiments, and corrects the position deviation of the laser machining. The first workpiece 4 is the first material substrate.

The laser machining apparatus 100 uses the distortion information acquired for the first workpiece 4 with respect to the second workpiece 4 of the same lot so as to obtain a part of the distortion information of the second workpiece 4 (Distortion information prediction step). The second workpiece 4 is a second material substrate for performing laser machining subsequent to the first material substrate.

When the second workpiece 4 is placed on the XY table 30, the camera 39 detects the alignment marks 11 located at the four corners of the machining area 10 among the alignment marks 11, for example, ). ≪ / RTI > The machining control device 40 calculates the positional deviation amount and the rotation angle of the workpiece 4 based on the measurement data for the alignment mark 11.

The distortion correction coefficient calculation processing section 41 regards that all the work 4 of the same lot is distorted with the same tendency. The distortion correction coefficient calculation processing section 41 calculates the distortion correction coefficient from the distortion data for the first work 4 and the measurement data for the alignment marks 11 located at the four corners of the processing region 10, The position of the alignment mark 11 at a position other than the corner is predicted.

The distortion correction coefficient calculation processing section 41 calculates coordinates (X ', Y') of the respective alignment marks 11 by, for example, a minimum-multiplying method using the following equations.

Here, (X, Y) is the coordinates of the measured alignment mark 11, and P11, P12, P13, P21, P22 and P23 are predetermined coefficients. These coefficients are calculated for each alignment mark 11, for example, in accordance with the distortion information for the first work 4. The distortion correction coefficient calculation processing section 41 predicts distortion information from the coordinates (X ', Y') of each alignment mark 11. The distortion correction coefficient calculation processing unit 41 predicts the distortion information for the third and subsequent works 4 of the same lot as well as for the second work 4. [

According to the third embodiment, the laser machining apparatus 100 can predict the distortion information for the second and subsequent workpieces 4 of the same lot, thereby simplifying the processing for correcting position deviation of the laser machining. As a result, the laser machining apparatus 100 can improve machining efficiency and product productivity.

Embodiment 4.

Fig. 13 is a block diagram showing a configuration for carrying out the laser machining method according to the fourth embodiment of the present invention. Fig. The same reference numerals are given to the same parts as those in the first embodiment, and redundant explanations are appropriately omitted.

The inspection apparatus 200 acquires the measurement data of the alignment mark 11 in advance with respect to the workpiece 4 to be subjected to the laser processing in the laser processing apparatus 100. In the laser processing method according to the fourth embodiment, in place of the laser machining apparatus 100, the inspection apparatus 200 different from the laser machining apparatus 100 is used in the mark position measuring process, Measure the position. The inspection apparatus 200 measures the position of the alignment mark 11 by, for example, picking up the alignment mark 11.

The inspection apparatus 200 outputs the measurement data of the alignment mark 11 to the machining control apparatus 2. [ The processing control apparatus 2 acquires the distortion information using the measurement data from the inspection apparatus 200 in the distortion information acquisition step.

14 is a diagram showing an image of data for laser machining input to the machining control apparatus. The "Sample1.txt", "Sample2.txt", "Sample3.txt" and "Sample4.txt" The first, second, third and fourth work pieces 4 of the workpiece 4 shown in FIG.

The alignment measurement data 51 is measurement data input from the inspection apparatus 200 to the machining control apparatus 2. [ The alignment measurement data 51 is expressed as XY coordinates. The machining hole data 52 is data including the coordinates of the machining hole read by the machining control device 2 from the design data. The machining hole data 52 is represented, for example, as XY coordinates for each of the tool codes "T01" and "T02".

The machining control apparatus 2 reflects the positional accuracy at the time of loading the workpiece 4 into the XY table 30 from the inspection apparatus 200 and adjusts the deviation amount of the position of the workpiece 4 in the XY table 30 And a rotation angle. According to the fourth embodiment, the laser machining apparatus 100 makes it possible to acquire the alignment measurement data 51 in advance by using the dedicated inspection apparatus 200, thereby reducing the work process on the XY table 30. [ The laser machining apparatus 100 can suppress a decrease in productivity even when it is necessary to measure the position with respect to many alignment marks 11. [

1 laser oscillator 2, 40 processing control device
3 laser processing part 4 work
10, 13 Machining area 11 Alignment mark
12-1, 12-2, 12-3, 12-4 Reorganization area 14, 15 Scan area
21, 41 Distortion correction coefficient calculation processor 22 Galvanometer mirror position correction processor
23 XY table position correction processing unit 30 XY table
34 f? Lens 35X, 35Y Galvano mirror
36X, 36Y Galvano Scanner 39 Camera
42 Lot judgment processing section 51 Alignment measurement data
52 Processing hole data 100 Laser processing apparatus
200 Inspection Device

Claims (7)

A mark position measuring step of measuring the position of the positioning mark by placing a material substrate to be subjected to laser processing on a processing stage and picking up a positioning mark formed on the material substrate;
A distortion information acquiring step of acquiring distortion information relating to distortion of the material substrate from a measurement result in the mark position measuring step,
And a position adjusting step of adjusting a traveling direction of the laser light incident on the processing region of the material substrate in accordance with the distortion information so as to correct the position deviation of the laser processing due to the distortion of the material substrate,
In the distortion information acquisition step, the distortion information is acquired in units of a set region set by dividing the processing region into a plurality of regions,
In the position adjustment step, the advancing direction can be adjusted for each of the reorganization areas,
Changing the incident position of the laser light on the machining area and performing the laser machining in units of a scan area corresponding to the amplitude of the laser light as the machining stage is moved,
The reorganization area is set wider than the scan area,
So that at least one of the scan areas can be set over a plurality of the reorganization areas. delete The method according to claim 1,
The position adjustment step may further cause the position of the processing stage to be adjustable for each of the reorganization areas in accordance with the distortion information,
And adjusts the position of the processing stage based on at least any one of the distortion information acquired for a plurality of reorganization areas over the scan area for the scan area set over the plurality of reorganization areas Laser processing method. The method according to claim 1 or 3,
The first material substrate is subjected to the laser processing through the position adjustment step,
In the case where the laser processing is performed on the second material substrate through the position adjustment process subsequent to the first material substrate,
Further comprising a distortion information predicting step of predicting the distortion information on the second material substrate using the distortion information acquired for the first material substrate. The method according to claim 1 or 3,
In the mark position measuring step, an inspection apparatus for measuring the position of the positioning mark is used,
Wherein in the distortion information acquisition step, the distortion information is acquired from the inspection apparatus using the measurement result input to the laser processing apparatus for laser processing. A processing stage on which a material substrate to be subjected to laser processing is placed,
An image pickup unit for picking up a positioning mark formed on the material substrate placed on the processing stage to measure a position of the positioning mark;
A distortion correction unit that obtains distortion information related to distortion of the material substrate from a measurement result using the imaging unit and calculates a distortion correction coefficient for correcting a position deviation of the laser processing due to distortion of the material substrate, A coefficient calculation processing unit,
And a position adjustment processing section for adjusting the direction of the laser light to be incident on the processing region of the material substrate in accordance with the distortion correction coefficient,
Wherein the distortion correction coefficient calculation processing section obtains the distortion information by using the modified region as a unit by dividing the processing region into a plurality of regions,
Wherein the position adjustment processing unit makes the progress direction adjustable for each of the reorganization areas,
And a scan driver for changing an incident position of the laser beam on the machining area,
Wherein the scan driver changes the incident position of the laser light in units of scan areas corresponding to the amplitude of the laser light each time the processing stage moves in the laser processing,
Wherein the reorganization region is wider than the scan region and at least one of the scan regions is set over a plurality of the reorganization regions. delete

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