JPH026183U - - Google Patents
Info
- Publication number
- JPH026183U JPH026183U JP1988084431U JP8443188U JPH026183U JP H026183 U JPH026183 U JP H026183U JP 1988084431 U JP1988084431 U JP 1988084431U JP 8443188 U JP8443188 U JP 8443188U JP H026183 U JPH026183 U JP H026183U
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- laser beam
- laser
- alignment
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 2
- 230000003287 optical effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は本考案の一実施例に係るレーザトリミ
ング装置の構成図、第２図は載物台部分の詳細図
である。
記号の説明：１はアライメント用レーザ発振器
、２はガルバノメータ、３は半透鏡、４は全反射
鏡、５は載物台、６はレーザ光受光部、７は被加
工物（トリミング基板）、８は識別回路、９は切
り欠きをそれぞれあらわしている。
FIG. 1 is a configuration diagram of a laser trimming apparatus according to an embodiment of the present invention, and FIG. 2 is a detailed diagram of a stage portion. Explanation of symbols: 1 is a laser oscillator for alignment, 2 is a galvanometer, 3 is a semi-transparent mirror, 4 is a total reflection mirror, 5 is a stage, 6 is a laser beam receiver, 7 is a workpiece (trimming substrate), 8 9 represents an identification circuit, and 9 represents a notch.
Claims (1)
用のレーザ光をビームポジシヨナで走査させて該
被加工物を加工するレーザ加工装置において、前
記被加工物の加工を施さない部分に近接して一連
の複数の位置のうちの該被加工物の種類によつて
決まる特定の位置に切欠を設けて置き、前記加工
用レーザ光と同一の光軸上にアラインメント用レ
ーザ光を発するレーザ発振器と、前記載物台の前
記被加工物が前記所定の位置に置かれたときの前
記一連の複数の位置に対応する全位置に前記アラ
イメント用レーザ光を検出できる一連のセンサを
配置した受光部と、前記所定の位置に置かれた被
加工物を前記アラインメント用レーザ光で前記全
位置走査したときに該レーザ光を検出したセンサ
の位置から該被加工物の種類を識別する識別回路
とを設けて成ることを特徴とするレーザ加工装置
。 In a laser processing device that places a workpiece at a predetermined location on a stage and processes the workpiece by scanning the workpiece with a laser beam for processing using a beam positioner, the workpiece is placed in a predetermined place on a stage, and a beam positioner scans the workpiece to process the workpiece. a laser oscillator that emits an alignment laser beam on the same optical axis as the processing laser beam; and a light-receiving unit including a series of sensors capable of detecting the alignment laser beam at all positions corresponding to the series of plural positions when the workpiece is placed at the predetermined position of the object table. and an identification circuit that identifies the type of the workpiece from the position of a sensor that detects the laser beam when the workpiece placed at the predetermined position is scanned over the entire position of the workpiece by the alignment laser beam. A laser processing device characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988084431U JPH026183U (en) | 1988-06-28 | 1988-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988084431U JPH026183U (en) | 1988-06-28 | 1988-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH026183U true JPH026183U (en) | 1990-01-16 |
Family
ID=31309120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988084431U Pending JPH026183U (en) | 1988-06-28 | 1988-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH026183U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0458203U (en) * | 1990-09-21 | 1992-05-19 | ||
| JP5089827B1 (en) * | 2012-02-01 | 2012-12-05 | 三菱電機株式会社 | Laser processing method and laser processing apparatus |
-
1988
- 1988-06-28 JP JP1988084431U patent/JPH026183U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0458203U (en) * | 1990-09-21 | 1992-05-19 | ||
| JP5089827B1 (en) * | 2012-02-01 | 2012-12-05 | 三菱電機株式会社 | Laser processing method and laser processing apparatus |
| WO2013114593A1 (en) * | 2012-02-01 | 2013-08-08 | 三菱電機株式会社 | Laser processing method and laser processing device |
| CN103354770A (en) * | 2012-02-01 | 2013-10-16 | 三菱电机株式会社 | Laser processing method and laser processing device |
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