JPH0225594Y2 - - Google Patents

Description

[Detailed explanation of the idea] [Purpose of invention] (Industrial application field) The present invention relates to a laser processing device.

(Prior technology) In laser machining using the so-called copying method, various sensors that detect the shape of the workpiece and the position of the machined part are not affected by the optical noise of the plasma emitted from the machined part during processing. A point slightly distant from the irradiation position is detected in advance.

(Problem that the invention aims to solve) However, when the laser beam is separated like this, there is a lag between the laser beam irradiation and the detection, and the changes at the distant distance are ignored, resulting in a decrease in tracing accuracy. . Furthermore, the teaching method, in which the overall shape and processing position are detected and stored in advance, and processing is performed by controlling the stored signals, requires a large capacity memory and poses a problem of time loss.

The object of the present invention is to provide a laser processing device that is not affected by external factors during processing and can perform high-speed copy processing with high precision.

[Structure of the invention] (Means and effects for solving the problem) A laser that holds one end of a cylindrical workpiece relatively to another disc-shaped workpiece and laser-welds the two. In the processing device, a laser oscillator that emits a laser beam for processing, a rotation drive device that holds and rotates one of the workpieces, and a reference diameter of at least one of the one workpiece or the other workpiece. a detection device for detecting an amount of eccentricity during the rotation; a means for relatively scanning the irradiation of the processing laser beam based on the amount of eccentricity; After the above-mentioned rotation has passed half a rotation, a processing command is issued with the detection start point as the processing start point of the processing laser beam, and from this processing command, 1
It is equipped with a control device that issues a processing stop command after rotation, and detects the amount of eccentricity, which is a control amount, in advance before starting laser processing at a location that is not affected by external factors that occur during laser processing.

(Example) Hereinafter, the present invention will be explained based on drawings showing examples.

In FIG. 1, 1 is a moving table device, and 2 is a holding device installed on this moving table device 1. In FIG. The holding device 2 consists of an angle setting jig 3 directly fixed on the movable table device 1, a rotation drive device 4 fixed to this jig, and a grip body 5 rotated by this device. One cylindrical workpiece 6 is gripped by the gripper 5 with the opening side facing upward. On the other hand, apart from the holding device 2, a detection device 7 is provided on the movable table device 1 by a support 8. As shown in FIG. 2, the detection device 7 includes a semiconductor laser oscillator 9, a lens 10a that focuses the detection laser beam La onto the detection section, and a condenser provided on the optical path of the reflected light Lb from the detection section. The main components include an optical lens 10b and a position sensor 11 that receives the light collected by the lens 10b. Position sensor 11
The photoelectrically converted signal is amplified and sent to the control device 12.
It is now possible to input . This control device 12
is the processing laser beam 14 in the laser oscillator 13
It has a function of controlling the start of emission of the moving table device 1 and the driving of the movable table device 1 in the direction shown by the arrow A so that the processing laser beam 14 is incident on the processing portion of the workpiece 6 by the detection device 7. . By the way, in the above-mentioned apparatus, the detection device 7 is disposed at a position where the detection laser beam La irradiates a position exactly opposite, that is, 180 degrees, from the incident point of the processing laser beam 14 on the workpiece 6. Note that the processing laser beam 14 is transmitted through the reflecting mirror 1.
The beam is deflected by the beam 5 and condensed through a condensing lens 16 onto the light incident point on the workpiece.

In the above configuration, the process of welding the lid 20, which is the other workpiece, to the opening of the workpiece 6 will be explained based on FIGS. 1 to 3. After setting the angle of incidence with the processing laser beam 14 using the angle setting jig 3, the rotation drive device 4 is activated and measurement by the detection device 7 is started. That is, since the dimensional accuracy of the outer periphery of the workpiece 6 is generally poor, the device detects the amount of eccentricity of the outer periphery of the lid body 20 inserted into the opening of the workpiece 8, which has relatively good dimensional accuracy, with respect to the reference diameter. 7 to detect. In the control device 12,
From the starting point of this detection, the rotation angle of the workpiece 6 is calculated, for example, every degree by an encoder, and the amount of eccentricity for each rotation angle is stored for 360 degrees. Based on this stored eccentricity data, the moving table device 1
is scanned by the amount of eccentricity mentioned above. However, the processing laser beam 14 is irradiated at a position symmetrical to the measurement point, that is,
It is set to irradiate when it comes to a location that is 180 degrees off. Therefore, in the control sequence 180
Since the degree data measurement precedes the start of irradiation with the processing laser beam 14, the workpiece 6 is rotated one and a half rotations (540 degrees) together with the lid body 20 from the start of measurement until the end of laser irradiation.

[Effect of the invention] In the above embodiment, the amount of displacement (amount of deflection) of the workpiece 6
The maximum diameter was 0.22μm. Although the measurement accuracy by the detection device 7 is approximately 10 μm, processing could be performed with a position correction accuracy of approximately 50 μm based on the overall accuracy of the movable table device 1 and the like.

In addition, the detection device detects the machining position, etc. by half a rotation in advance, and then starts laser processing by correcting the preceding portion, so that high-precision measurement can be performed without the influence of disturbance on the detection device. In addition, the processing time is added only by the difference between the start of detection and the start of laser irradiation, which has the effect of reducing time loss compared to the teaching method.

[Brief explanation of the drawing]

Fig. 1 is a configuration diagram showing one embodiment of the present invention;
This figure is a plan view showing the configuration of the detection device in FIG. 1, and FIG. 3 is an example of a program in the above embodiment. 1...Moving table device, 2...Holding device, 7
...Detection device, 12...Control device, 13...Laser oscillator.

Claims (1)

[Scope of utility model registration request] A laser processing device for relatively holding one end of a cylindrical workpiece and another disc-shaped workpiece and laser welding the two, a laser oscillator that emits a laser beam for processing; a rotation drive device that holds and rotates one workpiece; a detection device that detects an amount of eccentricity with respect to a reference diameter of at least one of the one workpiece or the other workpiece during the rotation; means for relatively scanning the irradiation of the processing laser light based on the amount; A processing command is issued as the processing start point of the processing laser beam, and 1
A laser processing device characterized by comprising a control device that issues a processing stop command after rotation.