JPS6153083U - - Google Patents
Info
- Publication number
- JPS6153083U JPS6153083U JP1984137227U JP13722784U JPS6153083U JP S6153083 U JPS6153083 U JP S6153083U JP 1984137227 U JP1984137227 U JP 1984137227U JP 13722784 U JP13722784 U JP 13722784U JP S6153083 U JPS6153083 U JP S6153083U
- Authority
- JP
- Japan
- Prior art keywords
- processing
- machining
- laser
- laser beam
- detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 claims description 5
- 238000003754 machining Methods 0.000 claims 5
- 230000003287 optical effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案の一実施例を示す構成図、第２
図は第１図における検出装置の構成を示す平面図
、第３図は上記実施例におけるプログラムの一例
である。
１…移動テーブル装置、２…保持装置、７…検
出装置、１２…制御装置、１３…レーザ発振器。
Fig. 1 is a configuration diagram showing one embodiment of the present invention;
This figure is a plan view showing the configuration of the detection device in FIG. 1, and FIG. 3 is an example of a program in the above embodiment. DESCRIPTION OF SYMBOLS 1...Moving table device, 2...Holding device, 7...Detection device, 12...Control device, 13...Laser oscillator.
Claims (1)
加工物の形状もしくは加工位置を検出する検出装
置と、上記加工用レーザの上記加工位置への照射
を相対的に走査する手段と、上記走査において上
記加工用レーザ光による加工開始前に先行して上
記検出を指令し所定時間経過後に上記検出開始点
を上記加工用レーザ光の加工開始点として加工指
令を出す制御装置とを備え、上記検出装置は加工
中における加工部からの光ノイズが及ばない位置
に設けられたことを特徴とするレーザ加工装置。 a laser oscillator that emits a processing laser beam; a detection device that detects the shape or processing position of the workpiece; a means for relatively scanning the irradiation of the processing laser to the processing position; a control device which commands the detection in advance before the start of machining with the machining laser beam, and issues a machining command after a predetermined time has elapsed by setting the detection start point as the machining start point of the machining laser beam; A laser processing device characterized in that it is installed at a position where optical noise from a processing section does not reach during processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984137227U JPH0225594Y2 (en) | 1984-09-12 | 1984-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984137227U JPH0225594Y2 (en) | 1984-09-12 | 1984-09-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6153083U true JPS6153083U (en) | 1986-04-10 |
| JPH0225594Y2 JPH0225594Y2 (en) | 1990-07-13 |
Family
ID=30695641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984137227U Expired JPH0225594Y2 (en) | 1984-09-12 | 1984-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0225594Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009195955A (en) * | 2008-02-21 | 2009-09-03 | National Institute Of Advanced Industrial & Technology | High-accuracy laser beam processing and laser beam-electrolysis composite processing apparatus |
| JP2010064106A (en) * | 2008-09-10 | 2010-03-25 | Disco Abrasive Syst Ltd | Laser beam machining apparatus |
-
1984
- 1984-09-12 JP JP1984137227U patent/JPH0225594Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009195955A (en) * | 2008-02-21 | 2009-09-03 | National Institute Of Advanced Industrial & Technology | High-accuracy laser beam processing and laser beam-electrolysis composite processing apparatus |
| JP2010064106A (en) * | 2008-09-10 | 2010-03-25 | Disco Abrasive Syst Ltd | Laser beam machining apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0225594Y2 (en) | 1990-07-13 |