JPH0336381U - - Google Patents

Info

Publication number
JPH0336381U
JPH0336381U JP1989096296U JP9629689U JPH0336381U JP H0336381 U JPH0336381 U JP H0336381U JP 1989096296 U JP1989096296 U JP 1989096296U JP 9629689 U JP9629689 U JP 9629689U JP H0336381 U JPH0336381 U JP H0336381U
Authority
JP
Japan
Prior art keywords
workpiece
light
irradiation light
irradiation
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989096296U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989096296U priority Critical patent/JPH0336381U/ja
Publication of JPH0336381U publication Critical patent/JPH0336381U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示す構成図、第2
図は本考案の一実施例によるワークの位置ずれ量
の測定方法を示す図、第3図は本考案の一実施例
を用いた近接センサ用トリミング装置を示す概念
図、第4図は本考案の一実施例を用いたレーザマ
ーカを示す概念図である。 主要部分の符号の説明、1……He−Neレー
ザ、2,6……キヤリア、3,7……ワーク、4
……受光部。
Fig. 1 is a configuration diagram showing one embodiment of the present invention;
The figure shows a method for measuring the amount of positional deviation of a workpiece according to an embodiment of the present invention, FIG. 3 is a conceptual diagram showing a trimming device for a proximity sensor using an embodiment of the present invention, and FIG. 4 shows a method according to the present invention. FIG. 2 is a conceptual diagram showing a laser marker using one embodiment of the present invention. Explanation of symbols of main parts, 1...He-Ne laser, 2, 6...Carrier, 3, 7...Work, 4
……Light receiving section.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 載物台上に載置され、前記載物台の移動により
加工位置に搬送された被加工物をレーザ光により
加工するレーザ加工装置であつて、前記加工位置
直前で前記被加工物に対して所定角度から照射光
を照射する照射手段と、前記被加工物から反射さ
れた前記照射光の光路上に設けられ、前記照射光
を受光する受光手段とを有し、前記受光手段にお
ける前記照射光の受光位置により予め設定された
基準位置に対する前記被加工物の位置ずれ量を算
出するようにしたことを特徴とするレーザ加工装
置。
A laser processing device that processes a workpiece placed on a stage and transported to a processing position by movement of the stage using a laser beam, wherein the workpiece is The irradiation light in the light reception means includes an irradiation means that irradiates the irradiation light from a predetermined angle, and a light reception means that is provided on the optical path of the irradiation light reflected from the workpiece and receives the irradiation light. A laser processing apparatus characterized in that a positional shift amount of the workpiece with respect to a preset reference position is calculated based on a light receiving position of the workpiece.
JP1989096296U 1989-08-17 1989-08-17 Pending JPH0336381U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989096296U JPH0336381U (en) 1989-08-17 1989-08-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989096296U JPH0336381U (en) 1989-08-17 1989-08-17

Publications (1)

Publication Number Publication Date
JPH0336381U true JPH0336381U (en) 1991-04-09

Family

ID=31645508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989096296U Pending JPH0336381U (en) 1989-08-17 1989-08-17

Country Status (1)

Country Link
JP (1) JPH0336381U (en)

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