JP2599968Y2 - Laser processing machine - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION This invention relates to a laser beam machine.

[0002]

2. Description of the Related Art Conventionally, when positioning a work when performing cutting and welding in a laser beam machine, means for positioning the work by a work clamp or a positioning jig prepared on a processing table has been employed. .

However, during three-dimensional cutting and welding of a three-dimensional work by a three-dimensional laser beam machine, positioning by the above-described means is difficult, and positioning accuracy is deteriorated.
This is because it is difficult to manufacture a clamp or jig for positioning a three-dimensional work at a three-dimensional position.

[0004] In this case, the positioning is basically performed by visual observation using a weak visible light laser (usually referred to as a He-Ne laser) for positioning, which is applied to the same position as the processing laser beam in principle. It is a target.

[0005]

By the way, when the above-mentioned conventional means is used to cut or weld a workpiece which has been subjected to bending or the like in a previous process, or to cut or weld a three-dimensional shape to the workpiece. In this case, it is often necessary to use a dedicated clamp or positioning jig. However, it is difficult to design the clamps and jigs, resulting in poor positioning accuracy.

[0006] The work positioned by such means is sometimes shifted by 2 to 3 mm from the position of the work to be cut and welded, so that the desired cutting and welding cannot be performed. there were.

In the positioning means using a weak visible light laser for positioning, since the weak visible light laser for positioning is mounted on the head of the laser beam machine, the mounting position cannot be confirmed at the time of work setting. For this reason, the program trajectory and the position deviation of the work can be confirmed only after the program is executed after the setting, and if it is deviated, the setting must be reset.

The object of the present invention is to improve the above problem by cutting the starting point and the ending point of the program by precisely positioning the workpiece in accordance with the starting point and the ending point of the workpiece to be machined. Another object of the present invention is to provide a laser beam machine with improved welding accuracy.

[0009]

In order to achieve the above object, the present invention is directed to a plurality of semiconductor lasers for detecting at least the processing start and end positions of a workpiece shape to be subjected to laser cutting or welding. Is set, and the processing start point and the processing end point are set at the detection positions of the detector to adjust the processing locus to the processing program locus.

[0010]

By adopting the laser processing machine of the present invention, the processing start point and the processing end point are located at the detection positions of the work starting point and the processing end point of the workpiece by, for example, a weak visible light laser as a semiconductor laser detector. By setting, the machining locus can be adjusted to the machining program. In this state, cutting or welding is performed by a machining program along a cutting line or a welding line of the work.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings. Since the laser processing machine has a known configuration, illustration and description are omitted.

Referring to FIG. 1, although not shown, a plurality of jigs provided on a processing table or a processing table provided in a laser processing machine can be finely adjusted by a known mechanism such as a screw mechanism. A base is provided, and detectors 3a and 3b, for example, a semiconductor laser detector which is a small weak visible light laser (He-Ne laser) are attached and fixed as the work positioning device 1 to the base.

The detector 3a detects the processing start point of the three-dimensional workpiece W, and the detector 3b detects the processing end point. The visible light laser is 0.3 to 0.5.
This is a small circular laser beam having a diameter of mm.

With the above configuration, the operation is such that the processing start point of the laser beam is detected by the detector 3a which is, for example, a semiconductor laser, and the processing end point is detected by the detector 3b.
Therefore, by setting the processing start point and the processing end point at the detection positions of the detectors 3a and 3b, the processing locus can be adjusted to the processing program, and the laser processing according to the processing program is performed accurately.

Thus, the positioning of the work W can be easily performed with high precision, and by performing the setting in accordance with the locus of the program, the precision of cutting and welding can be improved.

FIG. 2 shows another embodiment, which is different from the above-described embodiment in that four detectors 3a, 3b, 3c, 3d are provided to position the workpiece W. That is,
The detectors 3a and 3c are for positioning two light beams at the processing start point of the three-dimensional workpiece W.
In d, positioning is performed by applying two light beams to the processing end point.

For this reason, the positioning accuracy of the work W is further improved, and the effect is the same as that of the first embodiment.

The present invention is not limited to the embodiments described above, but can be implemented in other modes by making appropriate changes. For example, detector 3
The semiconductor lasers a to 3d can be positioned not only by a circular laser beam but also by a linear laser beam passed through a slit or the like. In addition to detecting the end point, it is also possible to provide a detector at the intermediate point, which is a point, to perform detection.

[0019]

As will be understood from the above description of the embodiment, according to the present invention, since the configuration is as described in the claims of the utility model registration, it is attempted to process using a detector. By setting the machining start point and the machining end point of the shape to be set in accordance with the detection positions of the respective detectors, the workpiece can be easily positioned with high accuracy, and the machining locus is set in a state that matches the program locus. be able to. Thus, the accuracy of cutting and welding can be improved.

[Brief description of the drawings]

FIG. 1 is an explanatory perspective view showing a work positioning device which is a main part of the present invention.

FIG. 2 is a perspective explanatory view showing another embodiment of the present invention.

[Explanation of symbols]

 1 Work positioning device 3a, 3b, 3c, 3d Detector W Work

Claims (1)

(57) [Scope of request for utility model registration] 1. A plurality of semiconductor laser detectors for detecting at least processing start and processing end positions of a workpiece shape to be subjected to laser cutting or welding,
A laser processing machine having a configuration in which a processing locus is adjusted to a processing program trajectory by setting the processing start point and the processing end point at detection positions of the detector.