KR20220040367A - Substrate position detection method, drawing method, substrate position detection apparatus and drawing apparatus - Google Patents

Abstract

A substrate position detecting method comprises: a process (step S11) of holding a substrate having a plurality of substrate elements, each of which is partitioned in a rectangular shape by a grid-like line to be split; a process (step S12) of capturing each of two or more selected substrate elements selected from the substrate elements and acquiring the two or more captured images; and a process (step S13) of obtaining the positions of the two or more selected substrate elements and detecting the positions of the substrate by performing pattern matching using a reference image for each of the two or more captured images. Each of the substrate elements has a pattern region in which a predetermined pattern is formed inside the outer edge of the substantially rectangular region. The reference image is a set of line segments set on each side of the outer edge of the region except for corner parts. As a result, the detection of the position of the substrate can be performed easily and with good precision.

Description

SUBSTRATE POSITION DETECTION METHOD, DRAWING METHOD, SUBSTRATE POSITION DETECTION APPARATUS AND DRAWING APPARATUS

The present invention relates to a technique for detecting the position of a substrate.

[REFERENCE TO RELATED APPLICATIONS]

This application claims the benefit of priority from Japanese Patent Application JP2020-158301 for which it applied on September 23, 2020, and all indications of this application are taken in here.

Conventionally, a pattern is drawn by irradiating light to a photosensitive material formed on a semiconductor substrate, a printed circuit board, or a glass substrate for an organic EL display device or a liquid crystal display device (hereinafter referred to as a “substrate”). In the drawing apparatus which performs such drawing, the alignment mark formed on the board|substrate is imaged, and the alignment process which adjusts the drawing position of a pattern automatically based on an imaging result is performed.

In recent years, in the board|substrate for semiconductor packages, in order to increase the number of packages which can be extract|collected from one board|substrate, reduction of the space for arrange|positioning an alignment mark is calculated|required. Then, using a part of the pattern on a board|substrate as an alignment mark is implemented without forming the mark exclusively for alignment on a board|substrate. In this case, it is necessary that a certain number of portions of the pattern used as alignment marks have a unique shape and exist on the substrate. However, complicated work is required in order to specify a part in the pattern that satisfies such a condition, and it cannot necessarily be said that there is a part that satisfies the condition.

On the other hand, in Japanese Patent Application Laid-Open No. 2013-520825 (Document 1), when aligning a workpiece such as a substrate on which a plurality of dies are arranged on a main surface in a drawing apparatus, an edge portion or a corner portion of the workpiece, or a reference It has been proposed to use the edges or corners of the die as reference features.

By the way, in the board|substrate for semiconductor packages, the edge part of the rectangular area|region where a package is manufactured may have an irregular shape, such as chamfering obliquely or a small rectangle is cut out. The shape of the said corner part may differ for every board|substrate, and may differ in some rectangular area|region on one board|substrate. Therefore, even if the rectangular area is detected by pattern matching and is intended to be used as an alignment mark, the pattern matching template and the corners of the rectangular area do not match, so that detection cannot be performed or there is a risk of misdetection.

An object of the present invention is a substrate position detection method for detecting the position of the substrate, and an object of the present invention is to perform the position detection of the substrate easily and with high accuracy.

A method for detecting a substrate position according to one preferred aspect of the present invention comprises the steps of: a) holding a substrate having a plurality of substrate elements each rectangularly partitioned by a grid-like division line; b) the plurality of substrates; a step of acquiring two or more captured images by respectively imaging two or more selected substrate elements selected from the elements; c) pattern matching using a reference image for each of the two or more captured images, whereby the two or more and obtaining the positions of the selected substrate elements, respectively, and detecting the positions of the substrates. Each of the plurality of substrate elements has a pattern area in which a predetermined pattern is formed inside an outer edge of the substantially rectangular area. The reference image is a set of line segments set on each side of the outer edge of the region except for the corner portion.

According to the above-mentioned substrate position detection method, the position detection of a board|substrate can be performed easily and with high precision.

Preferably, the reference image includes a longest line segment on each side of the outer edge of the region.

Preferably, in the reference image, a line segment at each side of the outer edge of the region is separated from a virtual intersection point of each side with another side by 10% or more of the length of each side.

Preferably, in the step c), a closing process is performed on the two or more captured images before pattern matching with the reference image.

Preferably, in the step b), a size of an imageable area obtainable by one imaging is smaller than that of each of the selection substrate elements. Each of the two or more captured images is generated by synthesizing a plurality of partial images obtained by capturing a plurality of times in the step b) on a base image. A difference between the pixel value of the base image in the periphery of the plurality of partial images and the average pixel value of all the plurality of partial images is smaller than a difference between pixel values set to distinguish the pattern area from the background area .

Preferably, when the captured image acquired in the step b) contains only a part of the selection substrate element, in the step c), the pattern matching is performed in a state in which a frame-like extended image is added around the captured image This is carried out. The difference between the pixel value of the expanded image in the periphery of the captured image and the average pixel value of the entire captured image is smaller than the difference between the pixel values set in order to distinguish the pattern area from the background area.

Preferably, when the captured image obtained in the step b) contains only a part of the selection substrate element, instead of the step c) or after the step c), a notification that the substrate is an error substrate is notified do.

The present invention also makes an object of the drawing method which draws with respect to a board|substrate. A drawing method according to one preferred aspect of the present invention includes: d) detecting the position of the substrate by the above-described substrate position detecting method; e) based on the position of the substrate detected in the d) step and the process of performing writing by irradiating light with respect to the said some board|substrate element of the said board|substrate, adjusting a drawing position.

The present invention also aims at a substrate position detecting device that detects the position of the substrate. A substrate position detecting apparatus according to one preferred aspect of the present invention comprises: a substrate holding portion for holding a substrate having a plurality of substrate elements each rectangularly partitioned by grid-like division lines; The two or more selection substrate elements by respectively imaging the selected two or more selection substrate elements to obtain two or more captured images, and performing pattern matching using a reference image for each of the two or more captured images A detection unit is provided that obtains the positions of , respectively, and detects the position of the substrate. Each of the plurality of substrate elements has a pattern area in which a predetermined pattern is formed inside an outer edge of the substantially rectangular area. The reference image is a set of line segments set on each side of the outer edge of the region except for the corner portion.

The present invention also makes an object of the drawing apparatus which draws with respect to a board|substrate. The drawing apparatus which concerns on one preferable aspect of this invention includes the above-mentioned board|substrate position detection apparatus, the drawing part which irradiates light with respect to a board|substrate and performs drawing, and the position of the said board|substrate detected by the said board|substrate position detection apparatus. By controlling the drawing unit based on the above, a drawing control unit for performing drawing on the plurality of substrate elements of the substrate while adjusting a drawing position is provided.

The above-mentioned and other objects, characteristics, aspects, and advantages become clear by the detailed description of this invention implemented below with reference to an accompanying drawing.

BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows the drawing apparatus which concerns on one Embodiment.
Fig. 2 is a plan view showing a substrate.
Fig. 3 is a diagram showing the configuration of a computer included in the control unit.
Fig. 4 is a block diagram showing the function of the control unit.
Fig. 5 is a diagram showing a flow of drawing a pattern on a substrate.
6 is a plan view showing the substrate.
7 : is a figure which shows a captured image.
8 : is a figure which shows the reference image of a comparative example.
9 is a diagram illustrating a reference image.
10A is an enlarged view illustrating a portion of a selection substrate element.
10B is an enlarged view showing a part of the selected substrate element after the closing treatment.
11A is an enlarged view showing a portion of a selection substrate element.
11B is an enlarged view showing a part of the selected substrate element after the closing treatment.
12A is an enlarged view showing a portion of a selection substrate element.
12B is an enlarged view showing a part of the selected substrate element after the closing process.
12C is a diagram illustrating a reference image.
13 is a diagram illustrating another example of a captured image.
14A is a diagram illustrating a captured image and an extended image.
14B is a diagram showing a captured image and an extended image.
15 is a diagram illustrating another example of a captured image.

1 : is a perspective view which shows the drawing apparatus 1 which concerns on one Embodiment of this invention. The writing apparatus 1 is a direct writing apparatus which irradiates the spatially modulated substantially beam-shaped light on the photosensitive material on the board|substrate 9, and writes a pattern by scanning the irradiation area|region of the said light on the board|substrate 9. In Fig. 1, three directions orthogonal to each other are indicated by arrows as the X direction, the Y direction, and the Z direction. In the example shown in FIG. 1, an X direction and a Y direction are mutually perpendicular|vertical horizontal directions, and a Z direction is a vertical direction. The same applies to other drawings.

2 : is a top view which shows the main surface (henceforth "upper surface 91") of the (+Z) side of the board|substrate 9. As shown in FIG. The board|substrate 9 is a substantially rectangular plate-shaped member in planar view, for example. The board|substrate 9 is a board|substrate for semiconductor packages, for example. On the upper surface 91 of the substrate 9, a resist film formed of a photosensitive material is formed on the copper layer. In the drawing apparatus 1, a circuit pattern is drawn (namely, formed) on the said resist film of the board|substrate 9. In addition, the kind, shape, etc. of the board|substrate 9 may be changed variously.

The substrate 9 illustrated in FIG. 2 has a plurality of substrate elements 94 each divided into a substantially rectangular shape by grid-like division lines 93 . In the example shown in FIG. 2, each substrate element 94 has a substantially square shape. The plurality of substrate elements 94 are arranged in a matrix form in the X and Y directions. The plurality of substrate elements 94 are divided along the division scheduled line 93 after each chip component or the like is mounted to form a semiconductor package in a post-process after pattern drawing by the drawing apparatus 1 . In FIG. 2 , each substrate element 94 is drawn larger than the actual number, and the number of the substrate elements 94 is drawn smaller than the actual number. The alignment mark for exclusive use of the position detection process (namely, alignment process) mentioned later is not formed in the board|substrate 9. As shown in FIG.

As shown in FIG. 1 , the drawing apparatus 1 includes a stage 21 , a stage moving mechanism 22 , an imaging unit 3 , a drawing unit 4 , and a control unit 10 . The control unit 10 controls the stage moving mechanism 22 , the imaging unit 3 , the drawing unit 4 , and the like. The stage 21 is a substantially flat substrate holding unit that holds the substrate 9 in a horizontal state from the lower side (ie, (-Z) side) below the imaging unit 3 and the drawing unit 4 . . The stage 21 is, for example, a buffer chuck that sucks and holds the lower surface of the substrate 9 . The stage 21 may have structures other than a holding chuck. The upper surface 91 of the board|substrate 9 mounted on the stage 21 is substantially perpendicular|vertical with respect to the Z direction, and is substantially parallel to an X direction and a Y direction.

The stage moving mechanism 22 relatively moves the stage 21 in a horizontal direction with respect to the imaging unit 3 and the drawing unit 4 (that is, in a direction substantially parallel to the upper surface 91 of the substrate 9 ). It is a moving device that The stage movement mechanism 22 includes a first movement mechanism 23 and a second movement mechanism 24 . The 2nd movement mechanism 24 linearly moves the stage 21 along a guide rail in the X direction. The 1st movement mechanism 23 linearly moves the stage 21 along a guide rail together with the 2nd movement mechanism 24 in a Y direction. The drive source of the 1st movement mechanism 23 and the 2nd movement mechanism 24 is a linear servomotor or the thing with which the motor was attached to the ball screw, for example. The structures of the 1st movement mechanism 23 and the 2nd movement mechanism 24 may be changed variously.

In the drawing apparatus 1, the stage rotation mechanism which rotates the stage 21 centering|focusing on the rotation shaft extended in the Z direction may be provided. In addition, a stage raising/lowering mechanism that moves the stage 21 in the Z direction may be provided in the drawing apparatus 1 . As the stage rotation mechanism, for example, a servo motor is available. As the stage lifting mechanism, for example, a linear servo motor can be used. The structure of the stage rotation mechanism and the stage raising/lowering mechanism may be changed in various ways.

The imaging unit 3 includes a plurality of heads 31 arranged in the X direction (two in the example shown in FIG. 1 ). Each head 31 is supported above the stage 21 and the stage moving mechanism 22 by the head support part 30 formed across the stage 21 and the stage moving mechanism 22 . Of the two heads 31 , one head 31 is fixed to the head support part 30 , and the other head 31 is movable in the X direction on the head support part 30 . Thereby, the distance in the X direction between the two heads 31 can be changed. In addition, 1 may be sufficient as the number of the heads 31 of the imaging part 3, and 3 or more may be sufficient as it.

Each head 31 is a camera provided with an imaging sensor and an optical system (not shown). Each head 31 is an area camera which acquires a two-dimensional image, for example. An imaging sensor is provided with elements, such as a several CCD (Charge Coupled Device) arranged in a matrix, for example. In each head 31, the reflected light of the illumination light guided from the light source (not shown) to the upper surface 91 of the substrate 9 is guided to the image pickup sensor through the optical system. An imaging sensor receives the reflected light from the upper surface 91 of the board|substrate 9, and acquires the image of a substantially rectangular imaging area. As the light source, various light sources such as LED (Light Emitting Diode) can be used. In addition, other types of cameras, such as a line camera, may be sufficient as each head 31. As shown in FIG.

The drawing unit 4 includes a plurality of heads 41 (in the example shown in FIG. 1 , five) arranged in the X direction and the Y direction. Each head 41 is supported above the stage 21 and the stage movement mechanism 22 by the head support part 40 formed across the stage 21 and the stage movement mechanism 22 . The head support part 40 is arrange|positioned rather than the head support part 30 of the imaging part 3 on the (+Y) side. In addition, one may be sufficient as the number of the heads 41 of the drawing part 4, and plural number may be sufficient as them.

Each head 41 is provided with a light source (not shown), an optical system, and a spatial light modulation element. As the spatial light modulation element, various elements such as DMD (Digital Micro Mirror Device) and GLV (Grating Light Valve) (registered trademark of Silicon Light Machines (Sunnyvale, California)) are used. possible. As a light source, various light sources, such as LD (Laser Diode), can be used. The plurality of heads 41 have substantially the same structure.

In the writing apparatus 1, the light modulated (that is, spatially modulated) from the plurality of heads 41 of the writing unit 4 is irradiated onto the upper surface 91 of the substrate 9, while the stage moving mechanism 22 is This moves the substrate 9 in the Y direction. Thereby, the irradiation area|region of the light from the some head 41 is scanned in the Y direction on the board|substrate 9, and drawing of the circuit pattern with respect to the board|substrate 9 is performed. In the following description, the Y direction is also called a "scanning direction", and the X direction is also called a "width direction". The stage moving mechanism 22 is a scanning mechanism that moves the irradiation area of the light from each head 41 on the substrate 9 in the scanning direction.

In the writing apparatus 1, writing with respect to the board|substrate 9 is performed by what is called a single-pass (one-pass) system. Specifically, by the stage moving mechanism 22 , the stage 21 is relatively moved in the Y direction with respect to the plurality of heads 41 , and the irradiation area of the light from the plurality of heads 41 is the substrate 9 . It is scanned only once in the Y direction (ie, the scanning direction) on the upper surface 91 of Thereby, drawing with respect to the board|substrate 9 is completed. In addition, in the writing apparatus 1, the writing with respect to the board|substrate 9 may be performed by the multipath system in which the movement to the Y direction of the stage 21, and the step movement to the X direction are repeated.

3 : is a figure which shows the structure of the computer 100 with which the control part 10 is equipped. The computer 100 is a normal computer including a processor 101 , a memory 102 , an input/output unit 103 , and a bus 104 . The bus 104 is a signal circuit for connecting the processor 101 , the memory 102 , and the input/output unit 103 . The memory 102 stores programs and various types of information. The processor 101 executes various processes (eg, numerical calculation and image processing) while using the memory 102 or the like according to a program or the like stored in the memory 102 . The input/output unit 103 includes a keyboard 105 and a mouse 106 for receiving input from an operator, and a display 107 for displaying output from the processor 101 and the like. In addition, the control part 10 may be a programmable logic controller (PLC:Programmable Logic Controller), a circuit board, etc., and the combination of these and one or more computers may be sufficient as it.

4 is a block diagram showing the functions of the control unit 10 realized by the computer 100. As shown in FIG. In FIG. 4, the structure other than the control part 10 is also shown together. The control unit 10 includes a storage unit 111 , an imaging control unit 112 , a detection unit 113 , and a drawing control unit 114 . The storage unit 111 is mainly realized by the memory 102 and includes a reference image (i.e., a template) used for pattern matching to be described later, and data of a pattern scheduled to be drawn on the substrate 9 (i.e., for drawing). data) are stored in advance.

The imaging control unit 112 , the detection unit 113 , and the drawing control unit 114 are mainly realized by the processor 101 . The imaging control part 112 controls the imaging part 3 and the stage moving mechanism 22, so that a part of the upper surface 91 of the board|substrate 9 is imaged by the imaging part 3, and an image (hereinafter referred to as "captured image") ') is acquired. The captured image is transferred to and stored in the storage unit 111 . The detection part 113 detects the position of the board|substrate 9 using the said captured image. The detail of the position detection of the board|substrate 9 is mentioned later. The drawing control part 114 is based on the position of the board|substrate 9 detected by the detection part 113, the data for drawing, etc. which are previously memorize|stored in the memory|storage part 111, the drawing part 4 and a stage moving mechanism. By controlling (22), the drawing unit 4 draws on the substrate 9 while adjusting the drawing position.

Next, the flow of the drawing of the pattern to the board|substrate 9 by the drawing apparatus 1 is demonstrated, referring FIG. At the time of drawing with respect to the board|substrate 9, first, the board|substrate 9 is carried in to the drawing apparatus 1, and is hold|maintained by the stage 21 (step S11). At this time, the stage 21 is located on the (-Y) side rather than the imaging unit 3 and the drawing unit 4 . Then, by the stage moving mechanism 22 , the substrate 9 is moved together with the stage 21 in the (+Y) direction, and moves below the imaging unit 3 .

In the drawing apparatus 1, the design position on the board|substrate 9 of the two or more board|substrate elements 94 previously selected among the some board|substrate elements 94 (refer FIG. 2) of the board|substrate 9 on the board|substrate 9 is , are stored in advance in the storage unit 111 (see Fig. 4). The two or more substrate elements 94 are not adjacent to each other in the X direction and the Y direction, but are separated from each other. In the present embodiment, the design of four substrate elements (hereinafter also referred to as “selection substrate element 94a”) positioned at the four corners of the substrate 9 so as to be surrounded by the double-dotted chain line indicated by reference numeral 94a in FIG. 6 . The position is stored in advance in the storage unit 111 . The design position of the selection substrate element 94a is an ideal state in which the selection substrate element 94a is formed on the substrate 9 according to the design information, and deformation such as distortion does not occur in the substrate 9 is the position of the selected substrate element 94a.

In the drawing apparatus 1, the imaging part 3 is controlled by the imaging control part 112 based on the design position of each selection substrate element 94a, whereby imaging of the four selection substrate elements 94a is performed by the imaging part. (3) is performed, respectively, and four captured images are acquired (step S12). For example, after the two selection substrate elements 94a arranged on the (+Y) side on the substrate 9 are imaged, the substrate 9 is moved in the (+Y) direction by the stage moving mechanism 22 . and the two selection substrate elements 94a arranged on the (-Y) side on the substrate 9 are imaged. In addition, the number of the selection board|substrate elements 94a is not limited to 4, It may be 2 or more. In step S12 , two or more captured images are acquired by the imaging unit 3 .

7 : is a figure which shows one captured image 81. As shown in FIG. One selection substrate element 94a is included in the substantially rectangular captured image 81 . In the example shown in FIG. 7, in the captured image 81 of a substantially square shape, on the board|substrate 9, the one selection board|substrate element 94a located in the (-X) side and the (-Y) side corner part of The whole and a portion of the plurality of substrate elements 94 adjacent to the selected substrate element 94a are included. The captured image 81 is, for example, a gray scale image of 256 gradations. In the captured image 81, the pixel value of each pixel is any of the range from 0 (black) which is the minimum pixel value to 255 (white) which is the maximum pixel value. The average pixel value of the entire captured image 81 (that is, the arithmetic average of the pixel values of all the pixels in the captured image 81) is, for example, 90 to 120.

As shown in FIG. 7 , the selection substrate element 94a includes a pattern region 95 . The pattern region 95 (also referred to as a die) is a region in which a chip component or the like is mounted in a post-process from the writing process in the writing apparatus 1 . In the pattern area 95, a predetermined pattern is previously formed in the stage before being carried into the drawing apparatus 1. 7, illustration of the pattern previously formed in the pattern area 95 is abbreviate|omitted, and the parallel diagonal line is provided to the pattern area 95. As shown in FIG. The pattern region 95 has a substantially rectangular outer edge (hereinafter also referred to as "region outer edge 951"). In other words, the region inside the region outer edge 951 is the pattern region 95 . In the example shown in FIG. 7, the area|region outer edge 951 has a substantially square shape. The same is true for the other substrate elements 94 .

In the example shown in FIG. 7, the area|region outer edge 951 of the pattern area|region 95 of the selection substrate element 94a has a pair of substantially parallel sides in an X direction, and a pair of sides substantially parallel to a Y direction. It is approximately rectangular with However, in the four corners of the pattern region 95, the shape of the region outer edge 951 is not a part of a rectangle. For example, the (-X) side and (+Y) side corner portions of the pattern region 95 are chamfered obliquely with respect to the X and Y directions, and the region outer edge 951 is chamfered with respect to the X and Y directions. is inclined It is the same also in the (-X) side and the (-Y) side edge part of the pattern area|region 95, and the (+X) side and the (+Y) side edge part. Further, the corner portions on the (+X) side and the (-Y) side of the pattern region 95 have a shape in which a small rectangular region is cut out, and the region outer edge 951 is bent in a crank shape. That is, in the example shown in FIG. 7, the area|region outer edge 951 has the substantially rectangular shape in which the corner|angular part was missing.

The shape of the region outer edge 951 in the corner portion of the pattern region 95 and the figures such as small triangles and rectangles positioned outside the region outer edge 951 are determined in the drawing apparatus 1 . It is used for positioning, etc. of chip components or finished packages in the mounting process of chip components, etc., which are scheduled to be performed after the drawing process, or the mounting process of the electric device after becoming a package finished product (that is, a semiconductor package). The missing corner portion of the area outer edge 951 (that is, the difference between the minimum rectangle circumscribed on the four sides of the area outer edge 951 and the area outer edge 951, hereinafter also referred to as a “missing corner portion”) The size of is, in each side of the minimum rectangle, 5% or less of the length of each side, for example. In addition, in the pattern area 95, it is not necessary that the corner|angular part of the area|region outer edge 951 is missing in all four corner|angular parts. However, in one or more corners of the pattern region 95, usually, the corners of the region outer edge 951 are missing.

The captured image 81 acquired by the imaging unit 3 is transferred to the control unit 10 shown in FIG. 4 , and is stored in the storage unit 111 . In the storage unit 111, as described above, a reference image used for pattern matching is stored in advance. In the drawing apparatus 1, the figure corresponding to the area|region outer edge 951 of the pattern area|region 95 of the selection substrate element 94a is used as a reference image.

In the control unit 10, the detection unit 113 performs pattern matching using a reference image to the captured image 81, whereby the position of the region outer edge 951 in the captured image 81 is obtained, The position of the selection substrate element 94a is determined based on the position of the region outer edge 951 . The pattern matching is performed by a known pattern matching method (eg, geometric pattern matching, normalized correlation search, etc.). Calculation of the position of the selection substrate element 94a by pattern matching is performed with respect to each captured image 81.

Then, based on the position of the selection substrate element 94a in each captured image 81 and the relative position of the substrate 9 and the imaging unit 3 when each captured image 81 is acquired, etc., The position of the substrate 9 on the stage 21 is detected by the detection unit 113 (step S13). The position of the substrate 9 detected by the detection unit 113 in step S13 is the coordinates in the X and Y directions of the substrate 9 on the stage 21, the direction of the substrate 9, And information indicating deformation due to distortion or the like of the substrate 9 is included. The information indicating the deformation of the substrate 9 is information such as the deformed shape of the substrate 9 and the positions of the plurality of substrate elements 94 on the substrate 9 .

Here, if, in the pattern matching of step S13, a reference image of a rectangle having four corners as shown in Fig. 8 is used (hereinafter referred to as "reference image 701 of a comparative example"), the above-mentioned As shown, since the area outer edge 951 (see Fig. 7) has a substantially rectangular shape with missing corners, the position of the area outer edge 951 cannot be detected, or the position of the area outer edge 951 is erroneously detected. there is a risk of becoming That is, in pattern matching using the reference image 701 of the comparative example, it is difficult to accurately detect the position of the substrate 9 .

Therefore, in the drawing apparatus 1, as shown in FIG. 9, a figure (that is, substantially parallel to the X direction or the Y direction of the area outer edge 951) excluding the corner portion from the area outer edge 951 (refer to FIG. 7) In each side, a set of line segments 72 set except for the corner portion) is used as the reference image 71 . Thereby, in each captured image 81, the position of the rectangular area|region outer edge 951 in which the corner|angular part was missing can be calculated|required with high precision by pattern matching. As a result, the position detection of the board|substrate 9 on the stage 21 is performed with high precision. In addition, the reference image 71 may be generated by extracting the region outer edge 951 from an image obtained by imaging the normal substrate element 94 excluding the corner portion, and is formed in advance in the substrate element 94 . The pattern may be generated from design data (eg, CAD data) by a known method.

It is preferable that each line segment 72 which comprises the reference image 71 mentioned above is 10% or more of the length of each side from the virtual vertex 73 which is a virtual intersection point of the said each side with the other side. Each line segment 72 of the reference image 71 is a line segment on a side corresponding to each side of the region outer edge 951 in the reference image 71, hereinafter simply referred to as "the region outer edge 951" The line segment 72 at each side" is also called. The virtual vertex 73 is the intersection of the extension lines of the two adjacent sides of the area|region outer edge 951 (illustrated by the dashed-dotted line in FIG. 9). In addition, the length of each side is the distance between the two virtual vertices 73 sandwiching the said each side, and corresponds to the length of each side of the minimum rectangle circumscribed to the 4 sides of the area|region outer edge 951 mentioned above. . In the following description, the shortest distance between the virtual vertex 73 and the end point of the line segment 72 is called "edge distance D1".

As described above, the size of the missing corner portion of the region outer edge 951 is 5% or less of the length of the side of the smallest rectangle circumscribed on the four sides of the region outer edge 951 . Accordingly, when the corner separation distance D1 is 10% or more of the length of the side, the line segment 72 of the reference image 71 is adjusted to the captured image 81 at the time of pattern matching in the captured image 81 . It can be prevented from matching with the missing corner of the outer edge 951 of the area. In addition, from the viewpoint of improving the precision of pattern matching, it is preferable that the line segment 72 is long. In particular, from the viewpoint of ensuring stability (ie, rigidity) of position detection of the substrate 9, it is preferable that the distance D1 between the corners be 25% or less of the length of the side.

In the drawing apparatus 1, the drawing part 4 and the stage moving mechanism 22 are controlled by the drawing control part 114 based on the position of the board|substrate 9 detected by the detection part 113, whereby the substrate ( Drawing of the pattern with respect to each board|substrate element 94 of 9) is performed with high precision, adjusting a drawing position (step S14). In step S14, based on the position of the substrate 9, the modulation interval and modulation timing of the light beam irradiated from the drawing unit 4 to the substrate 9, and the light beam on the substrate 9 The scanning position and the like are mechanically and automatically corrected by a known correction method in the drawing unit 4 and the stage moving mechanism 22 .

In the above-mentioned FIG. 7, in the site|part except the edge part of each side of the pattern area|region 95. WHEREIN: Although the area|region outer edge 951 is made into one straight line, it is not limited to one straight line in fact. For example, as shown in the enlarged view of FIG. 10A , when the land 96 is present at the outer edge of the pattern area 95, the (+Y) side of the area outer edge 951 is the land ( 96) becomes two straight lines divided to the left and right in FIG. 10A. In this case, in the reference image 71 (see Fig. 9), the line segment 72 on the (+Y) side also needs to be divided at the position corresponding to the land 96, but as described above, From the viewpoint of improving the precision, it is preferable that the line segment 72 is long.

Then, in step S13, it is preferable that a closing process is performed with respect to each captured image 81 before the pattern matching of each captured image 81 and the reference image 71. As a result, as shown in FIG. 10B , the land 96 and the voids (that is, the background) in the vicinity of the land 96 are absorbed by the surrounding region (that is, a part of the pattern region 95), and the region outer edge ( 951), the side on the (+Y) side becomes one straight line. As a result, the line segment 72 corresponding to the side of the reference image 71 is not divided, and one long straight line can be used as the line segment 72 . Therefore, the precision of the pattern matching in step S13 improves, and the precision of the position detection of the board|substrate 9 improves. In addition, in FIG. 10B, the position of the land 96 which existed before a closing process is shown by the double-dotted line (it is the same also in FIG. 12B).

The closing process of step S13 is advantageous in the position detection of the board|substrate 9 other than division|segmentation of the line segment 72 of the reference image 71 by the land 96 etc. as mentioned above as mentioned above. For example, as shown in FIG. 11A , when a straight line 97 extending substantially parallel to the region outer edge 951 is present in the outer edge portion of the pattern region 95, the pattern matching in step S13 In this case, there is a possibility that the straight line 97 is mistaken for the region outer edge 951 , and the accuracy of detecting the position of the substrate 9 may decrease. In this case, since the closing process is performed before pattern matching, as shown in FIG. 11B, the straight line 97 is absorbed by the surrounding site|part (ie, a part of pattern area 95) and it is erased. Thereby, the straight line 97 is prevented from being mistaken for the region outer edge 951 , and a decrease in the accuracy of position detection of the substrate 9 is prevented. In addition, in FIG. 11B, the position of the straight line 97 which existed before a closing process is shown by the double-dotted line.

On the other hand, as shown in FIG. 12A , when a land pattern in which a plurality of lands 96 are adjacent to each other and arranged in the X direction exists on the outer edge portion of the pattern region 95 on the (+Y) side, the above-described closing Even when processing is performed, as shown in FIG. 12B, the (+Y) side of the area|region outer edge 951 turns into two straight lines divided to the left and right in FIG. 12B. Therefore, also in the reference image 71, as shown in FIG. 12C, the line segment 72 on the (+Y) side is divided into two line segments 72a and 72b at positions corresponding to the plurality of lands 96. . In this case, in the pattern matching of step S13, both of the two line segments 72a, 72b are used as the (+Y) side side of the reference image 71.

In the pattern matching, only one of the two line segments 72a and 72b may be used as the (+Y) side of the reference image 71 . However, as described above, since it is preferable to use a long line segment from the viewpoint of improving the accuracy of pattern matching, in the example shown in Fig. 12C, at least the longest line segment 72a among the two line segments 72a and 72b. ) is preferably used as the side on the (+Y) side of the reference image 71 . In other words, when one side of the reference image 71 is divided into two or more line segments, from the viewpoint of improving the accuracy of pattern matching, at least the longest line segment in the one side is divided into the reference image 71 . It is preferable to include

In the drawing apparatus 1, when the positional shift of the substrate 9 on the stage 21 or the deformation of the substrate 9 is large, as shown in FIG. 13, in the captured image 81 acquired in step S12, There is a case where only a part of one selection substrate element 94a is included. In the example shown in FIG. 13, the (+X) side site|part of the selection board|substrate element 94a protrudes outward from the outer edge of the (+X) side of the captured image 81. As shown in FIG. In FIG. 13, the drawing area|region outer edge 951 of the part which protrudes from the captured image 81 among the pattern area|region 95 is drawn with a broken line (also in FIGS. 14A and 14B).

The partial inclusion of the selection substrate element 94a in the captured image 81 is, for example, in the pattern matching of step S13, the detected shape of the selection substrate element 94a and the shape of the reference image 71 It is judged based on whether or not the coincidence degree satisfies a predetermined value or the like. In this case, in the drawing apparatus 1, for example, instead of the position detection of the board|substrate 9 of step S13, the effect that the board|substrate 9 on the stage 21 is an error board|substrate is an operator of the drawing apparatus 1 etc. are notified, and the drawing process (step S14) with respect to the board|substrate 9 is stopped. Alternatively, the partial inclusion of the selected substrate element 94a in the captured image 81 is, for example, a substrate detected based on the position of the selected substrate element 94a obtained by pattern matching from the captured image 81 . The position of (9) is determined based on whether or not it is within a predetermined range or the like. In this case, in the drawing apparatus 1, for example, after the position detection of the board|substrate 9 in step S13, the effect that the board|substrate 9 on the stage 21 is an error board|substrate of the drawing apparatus 1 The operator etc. are notified, and the drawing process with respect to the board|substrate 9 (step S14) is stopped.

The reason for using the substrate 9 as an error substrate when the selection substrate element 94a protrudes from the captured image 81 is that the portion overlapping the selection substrate element 94a among the outer edges of the captured image 81 ( In the example shown in FIG. 13 , since the (+X) side outer edge part) is a straight line extending in the Y direction in the same way as the region outer edge 951 of the selection substrate element 94a, a part of the outer edge is This is to prevent misidentification as the area outer edge 951 . The notification to the operator or the like is implemented, for example, by displaying a warning on the display 107 (refer to FIG. 3 ) or the like. Accordingly, in the pattern matching of step S13, the part of the outer edge of the captured image 81 is mistaken for the region outer edge 951, and the drawing process is performed in a state where the position of the substrate 9 is detected incorrectly. can be prevented

Or, in the drawing apparatus 1, as above-mentioned, when only a part of the selection substrate element 94a is included in the captured image 81, as shown to FIG. 14A, in step S13, the captured image 81 An expanded image 82 on a substantially rectangular frame is added around , and pattern matching is performed in this state. The inner edge of the expanded image 82 coincides with the outer edge of the captured image 81 over the entire perimeter. The width of the extended image 82 (that is, the shortest distance between the outer edge of the captured image 81 and the outer edge of the extended image 82 ) is, for example, 100 to 300 pixels. The width of the expanded image 82 may be variously changed according to the size of the selection substrate element 94a or the like. In the example shown to FIG. 14A, the extended image 82 is an image which has a fixed pixel value (ie, density|concentration). The pixel value of the expanded image 82 is, for example, 128, which is an intermediate value between the maximum pixel value and the minimum pixel value. In FIG. 14A, the drawing area|region outer edge 951 of the part which protrudes from the captured image 81 among the pattern areas 95 is drawn with a broken line (it is the same also in FIG. 14B).

In this way, by adding the extended image 82 to the captured image 81 , at the time of pattern matching, as shown in FIG. 14B , a part of the reference image 71 is positioned outside the outer edge of the captured image 81 . can do it For this reason, even when a part of the selection substrate element 94a protrudes outward from the outer edge of the captured image 81, the region outer edge 951 of the selection substrate element 94a in the captured image 81 and The line segment 72 of the reference image 71 can be matched with high precision. As a result, the position of the board|substrate 9 can be detected with high precision.

In the drawing apparatus 1 , the difference between the pixel value of the extended image 82 and the average pixel value of the entire captured image 81 is the pattern area 95 of the selection substrate element 94a outside the pattern area 95 . It is preferable to be smaller than the difference between the pixel values set in advance (hereinafter also referred to as "pattern area threshold") in order to distinguish it from the area (that is, the background area). Accordingly, in the pattern matching of step S13, the boundary between the captured image 81 and the extended image 82, which are straight as the region outer edge 951 of the selection substrate element 94a, is defined as the region outer edge 951. It can prevent misunderstanding. As a result, the position of the substrate 9 can be detected more accurately. In addition, the said pattern area|region threshold value is memorize|stored in advance in the memory|storage part 111 of the control part 10 before the process of the board|substrate 9 by the drawing apparatus 1 .

The density of the expanded image 82 mentioned above does not necessarily need to be constant. When the density of the extended image 82 is not constant, at least the pixel values of the extended image 82 in the vicinity of the captured image 81 (that is, the vicinity of the captured image 81) and the captured image 81 It is preferable that the difference of all average pixel values is smaller than a pattern area|region threshold value. Thereby, substantially the same as above, the boundary between the captured image 81 and the expanded image 82 is prevented from being mistaken for the region outer edge 951, and as a result, the position of the substrate 9 is detected with greater precision. can do.

In the drawing apparatus 1, in step S12, when the size of the imageable area obtainable by one imaging by the imaging unit 3 is smaller than the selection substrate element 94a, in the vicinity of the selection substrate element 94a A plurality of times of imaging are performed while shifting the imaging position little by little. And, as shown in Fig. 15, a plurality of images obtained by the plurality of times of imaging (that is, an image including a part of the selection substrate element 94a, hereinafter also referred to as a "partial image 83"), By synthesizing on the base image 84 larger than the partial image 83 , the captured image 81 is generated. The region on the substrate 9 corresponding to each partial image 83 partially overlaps with the region on the substrate 9 corresponding to the other partial image 83 . The base image 84 is a substantially rectangular image larger than the plurality of partial images 83 arranged partially overlapping each other, and the entirety of the plurality of partial images 83 is disposed on the base image 84 . The entire selection substrate element 94a is included in the plurality of partial images 83 . In the example shown in FIG. 15 , the base image 84 is an image having constant pixel values (that is, density) except for regions overlapping the plurality of partial images 83 . The pixel value of the base image 84 is, for example, 128, which is an intermediate value between the maximum pixel value and the minimum pixel value, except for regions overlapping the plurality of partial images 83 .

In the drawing apparatus 1, it is preferable that the difference between the pixel value of the base image 84 and the average pixel value of the some partial image 83 whole is smaller than the above-mentioned pattern area threshold value. Accordingly, in the pattern matching of step S13, the boundary between the partial image 83 and the base image 84, which is straight as the region outer edge 951 of the selection substrate element 94a, is defined as the region outer edge 951. It can prevent misunderstanding. As a result, the position of the substrate 9 can be detected more accurately.

The density of the above-described base image 84 is not necessarily constant in the entire region that does not overlap the plurality of partial images 83 . When the density of the base image 84 is not constant, at least the pixel values of the base image 84 in the vicinity of the plurality of partial images 83 (ie, the vicinity of the plurality of partial images 83 ) It is preferable that the difference of the average pixel values of the whole partial image 83 of is smaller than the pattern area threshold value. Thereby, substantially the same as above, the boundary between the partial image 83 and the base image 84 is prevented from being mistaken for the region outer edge 951, and as a result, the position of the substrate 9 is detected with better precision. can do.

As described above, the substrate position detection method for detecting the position of the substrate 9 is a substrate 9 having a plurality of substrate elements 94 each rectangularly partitioned by a grid-like division line 93 . ) (step S11), and acquiring two or more captured images 81 by imaging two or more selected substrate elements 94a selected from the plurality of substrate elements 94, respectively (step S12); , by performing pattern matching using the reference image 71 for each of the two or more captured images 81 , the positions of the two or more selected substrate elements 94a are respectively obtained, and the positions of the substrate 9 are determined A step of detecting (step S13) is provided. Each of the plurality of substrate elements 94 has a pattern region 95 in which a predetermined pattern is formed inside the substantially rectangular region outer edge 951 . The reference image 71 is a set of line segments 72 set on each side of the region outer edge 951 except for the corner portion.

As a result, as described above, even when the corners of the substantially rectangular region outer edges 951 are missing, the position of the region outer edges 951 in each captured image 81 is accurately determined by pattern matching. can be saved Further, by using a line segment 72 corresponding to a part of the region outer edge 951 of the substrate element 94 as the reference image 71, a portion having a unique shape from the pattern in the pattern region 95, etc. Compared with the case of extracting and setting as a reference image, the setting of the reference image 71 can be facilitated. As a result, the number of substrate elements 94 that can be disposed on the substrate 9 is increased as compared to the case where marks dedicated to the position detection processing (ie, alignment processing) of the substrate 9 are formed on the substrate 9 . The position detection of the board|substrate 9 can be performed easily and with high precision while making it.

As mentioned above, in the board|substrate for semiconductor packages, the pattern area 95 of each board|substrate element 94 may be utilized for positioning etc. of the board|substrate element 94 in the mounting process of a chip component etc. which are performed after step S14. In many cases, the corner portion of the region outer edge 951 is missing. In the substrate position detection method, even when the edge portion of the region outer edge 951 is missing, the position detection of the substrate 9 can be easily and accurately performed. It is particularly suitable for detecting the position of a substrate for a package.

As described above, the reference image 71 preferably includes the longest line segment 72 on each side of the region outer edge 951 . Thereby, the precision of the pattern matching in step S13 can be improved. As a result, the precision of the position detection of the board|substrate 9 can be improved.

As described above, in the reference image 71, the line segment 72 on each side of the region outer edge 951 is a virtual intersection point with the other side of each side (that is, the virtual vertex 73). It is preferable to be separated from each other by 10% or more of the length of each side. Thereby, in the pattern matching of step S13, the influence by the missing edge part of the area|region outer edge 951 can be reduced or prevented. As a result, the precision of the position detection of the board|substrate 9 can be improved.

As described above, in step S13 , it is preferable that the closing processing be performed on the two or more captured images 81 before pattern matching with the reference image 71 . Thereby, the influence on pattern matching by the land 96 of the outer edge part of the pattern area 95 as mentioned above, the straight line 97 adjacent to the area outer edge 951, etc. can be reduced or prevented by this. As a result, the precision of the position detection of the board|substrate 9 can be improved.

As mentioned above, in the example shown in FIG. 15, the magnitude|size of the imageable area which can be acquired by one imaging in step S12 is smaller than each selection board|substrate element 94a. In addition, the two or more captured images 81 are respectively generated by synthesizing the plurality of partial images 83 obtained by capturing multiple times in step S12 on the base image 84 . In this case, the difference between the pixel value of the base image 84 in the periphery of the plurality of partial images 83 and the average pixel value of the plurality of partial images 83 as a whole is the difference between the pattern area 95 and the background area. It is preferable to be smaller than the set difference of pixel values (that is, the pattern area threshold value) in order to distinguish. Thereby, in the pattern matching of step S13, it can suppress that the boundary of the partial image 83 and the base image 84 is mistakenly detected as the area|region outer edge 951. As a result, the precision of the position detection of the board|substrate 9 can be improved.

As described above, in the example shown in FIGS. 14A and 14B , when only a part of the selection substrate element 94a is included in the captured image 81 acquired in Step S12, in Step S13, the captured image 81 ), pattern matching is performed in a state in which the extended image 82 on the frame is added around the . Thereby, even when the selection substrate element 94a deviate|deviates from the imaging possible area|region of the imaging part 3, the position detection of the board|substrate 9 can be performed. In this case, the difference between the pixel value of the extended image 82 in the periphery of the captured image 81 and the average pixel value of the entire captured image 81 is set to distinguish the pattern area 95 from the background area, It is preferably smaller than the difference in pixel values (ie, the pattern area threshold). Thereby, in the pattern matching of step S13, it can suppress that the boundary of the captured image 81 and the expanded image 82 is mistakenly detected as the area|region outer edge 951. As a result, the precision of the position detection of the board|substrate 9 can be improved.

As mentioned above, in the example shown in FIG. 13, only a part of the selection board|substrate element 94a is contained in the captured image acquired in step S12. In this case, it is also preferable that the fact that the board|substrate 9 is an error board is notified instead of step S13 or after step S13. Thereby, unlike the example shown in FIGS. 14A and 14B, although the position detection of the board|substrate 9 cannot be performed, the outer edge of the captured image 81 is mistaken for the area|region outer edge 951, and the board|substrate 9 It is possible to prevent the writing process from being performed in a state in which the position of is erroneously detected.

The drawing method of performing drawing with respect to the board|substrate 9 is the process (steps S11-S13) of detecting the position of the board|substrate 9 by the board|substrate position detection method mentioned above, The board|substrate 9 detected in the said process. The process (step S14) of irradiating light with respect to the some board|substrate element 94 of the board|substrate 9, and performing drawing, adjusting a drawing position based on the position of ) is provided. Thereby, with respect to each board|substrate element 94 of the board|substrate 9, drawing can be performed with favorable precision.

In the drawing apparatus 1 illustrated in FIG. 1, some structures function as the board|substrate position detection apparatus 5 which detects the position of the board|substrate 9. As shown in FIG. The substrate position detection apparatus 5 includes a substrate holding unit (ie, stage 21 ), an imaging unit 3 , and a detection unit 113 . The stage 21 holds a substrate 9 having a plurality of substrate elements 94 each rectangularly partitioned by grid-like division lines 93 . The imaging unit 3 acquires two or more captured images 81 by respectively imaging two or more selected substrate elements 94a selected from the plurality of substrate elements 94 . The detection unit 113 performs pattern matching using the reference image 71 on each of the two or more captured images 81 to obtain the positions of the two or more selected substrate elements 94a, respectively, and 9) Detect the position of Each of the plurality of substrate elements 94 has a pattern region 95 in which a predetermined pattern is formed inside the substantially rectangular region outer edge 951 . The reference image 71 is a set of line segments 72 set on each side of the region outer edge 951 except for the corner portion. In the substrate position detecting apparatus 5, in the same manner as above, the substrate element 94 formed on the substrate 9 compared to the case where a mark for exclusive use of the position detection processing (ie, alignment processing) is formed on the substrate 9. ), the position detection of the substrate 9 can be performed easily and with good precision.

The drawing apparatus 1 is equipped with the board|substrate position detection apparatus 5 mentioned above, the drawing part 4, and the drawing control part 114. The drawing part 4 irradiates light with respect to the board|substrate 9, and draws. The drawing control part 114 controls the drawing part 4 based on the position of the board|substrate 9 detected by the board|substrate position detection apparatus 5, thereby adjusting the drawing position of the some substrate element of the board|substrate 9. For (94), drawing is performed. Thereby, similarly to the above, with respect to each board|substrate element 94 of the board|substrate 9, drawing can be performed with high precision.

Various changes are possible in the above-mentioned drawing apparatus 1, the board|substrate position detection apparatus 5, the drawing method, and the board|substrate position detection method.

For example, if the reference image 71 includes a line segment corresponding to each side of the region outer edge 951 , the longest line segment 72 on each side of the region outer edge 951 must be There is no need to include In addition, in the reference image 71, the number of line segments 72 included in each of the four sides of the (+X) side, the (-X) side, the (+Y) side, and the (-Y) side (that is, the outer edge of the region) The number of line segments 72 included in each side corresponding to the four sides of (951) may be 1 or 2 or more.

In the reference image 71 , the distance between the line segment 72 and the virtual vertex 73 on each side of the region outer edge 951 may be less than 10% of the length of each side.

In step S13, image processing other than a closing process may be performed with respect to each captured image 81 before pattern matching. Alternatively, pattern matching may be performed without performing image processing on each captured image 81 .

In the substrate position detection apparatus 5, as shown in FIG. 11A, even when a straight line 97 close to the region outer edge 951 exists in the selection substrate element 94a, the closing process is always performed in step S13. does not need to be carried out. For example, image processing is performed on the captured image 81 prior to pattern matching, and a straight line adjacent to one side of the area outer edge 951 (eg, the distance between the area outer edge 951 ) The presence or absence of a straight line in which is equal to or less than a predetermined threshold value) is checked. And when a straight line adjacent to the one side exists, the region between the one side and the straight line is completely filled with the same pixel value as the straight line. In other words, the pixel value equal to the pixel value of the said straight line is provided to the pixel group of the area|region between the said one side and the said straight line. In the substrate position detection apparatus 5, after the same process is performed with respect to the other three sides of the area|region outer edge 951, the above-mentioned pattern matching is performed. Thereby, it is suppressed or prevented from mistaking a straight line approaching the area outer edge 951 as the area outer edge 951 . As a result, the precision of the position detection of the board|substrate 9 can be improved.

In addition, when the above-mentioned adjacent straight line is located inside the area outer edge 951 (that is, within the pattern area 95), in the pattern matching, the above-mentioned filled area (ie, outside the thickened area) An edge outside the edge 951 ) is detected as a line segment corresponding to the line segment 72 of the reference image 71 . In addition, when the above-mentioned adjacent straight line is located outside the area outer edge 951, in the pattern matching, the edge inside the above-described tightly filled area (that is, the thickened area outer edge 951) is , is detected as a line segment corresponding to the line segment 72 of the reference image 71 .

The board|substrate 9 mentioned above is not necessarily limited to the board|substrate for semiconductor packages. In the substrate position detection device 5, for example, a semiconductor substrate, a glass substrate for flat panel display devices such as a liquid crystal display device and an organic EL display device, a glass substrate for a photomask, a substrate for solar cell panels, etc. Position detection may be performed.

The substrate position detection apparatus 5 is not necessarily used in the drawing apparatus 1, and may be used in various apparatuses other than the drawing apparatus 1 (for example, a stepper type exposure apparatus or a chip mounter). . In addition, the board|substrate position detection apparatus 5 may be used independently, without being inserted into another apparatus.

The configurations in the above-described embodiment and each modification may be appropriately combined as long as they do not contradict each other.

Although the invention has been described and described in detail, the description of the technology is illustrative and not restrictive. Therefore, it can be said that many modifications and aspects are possible without departing from the scope of the present invention.

One ; drawing device
3 ; imaging unit
4 ; drawing department
5 ; substrate position detection device
9 ; Board
21 ; stage
71; reference image
72, 72a, 72b; line segment
73; virtual vertex
81; captured image
82; extended burn
83 ; partial burn
84 ; base burn
93 ; line to be split
94 ; substrate element
94a; selection board element
95 ; pattern area
113 ; detection unit
114; drawing control
951 ; outer edge of the area
S11 to S14; step

Claims (10)

A substrate position detection method for detecting a position of a substrate, comprising:
a) holding a substrate having a plurality of substrate elements each rectangularly partitioned by grid-like divisional lines;
b) acquiring two or more captured images by respectively imaging two or more selected substrate elements selected from the plurality of substrate elements;
c) obtaining the positions of the two or more selected substrate elements, respectively, and detecting the positions of the substrates by performing pattern matching using a reference image for each of the two or more captured images;
to provide
each of the plurality of substrate elements has a pattern region in which a predetermined pattern is formed inside an outer edge of the substantially rectangular region;
wherein the reference image is a set of line segments set on each side of an outer edge of the region except for a corner portion. The method of claim 1,
The method for detecting a substrate position, wherein the reference image includes a longest line segment on each side of an outer edge of the region. The method of claim 1,
In the reference image, a line segment on each side of the outer edge of the region is separated from a virtual intersection point with another side of each side by 10% or more of a length of each side. The method of claim 1,
In the step c), a closing process is performed on the two or more captured images before pattern matching with the reference image. The method of claim 1,
In step b), a size of an imageable area obtainable by one imaging is smaller than each of the selection substrate elements;
Each of the two or more captured images is generated by synthesizing a plurality of partial images obtained by capturing a plurality of times in the step b) on a base image,
A difference between the pixel values of the base image in the periphery of the plurality of partial images and the average pixel values of all the plurality of partial images is smaller than a difference between pixel values set to distinguish the pattern area from the background area , substrate position detection method. The method of claim 1,
When the captured image acquired in the step b) contains only a part of the selection substrate element, in the step c), the pattern matching is performed in a state in which a frame-like extended image is added around the captured image,
Substrate position detection, wherein a difference between a pixel value of the extended image in the periphery of the captured image and an average pixel value of the entire captured image is smaller than a difference between pixel values set to distinguish the pattern area from a background area; method. The method of claim 1,
Substrate position, wherein when the captured image acquired in step b) contains only a part of the selected substrate element, instead of step c) or after step c), the fact that the substrate is an error substrate is notified detection method. A writing method for performing writing on a substrate, the writing method comprising:
d) detecting the position of the substrate by the method for detecting the position of the substrate according to any one of claims 1 to 7;
e) a step of performing writing by irradiating light to the plurality of substrate elements of the substrate while adjusting the writing position based on the position of the substrate detected in the step d). A substrate position detection device for detecting a position of a substrate, comprising:
a substrate holding portion for holding a substrate having a plurality of substrate elements each rectangularly partitioned by grid-like division lines;
an imaging unit configured to acquire two or more captured images by respectively imaging two or more selected substrate elements selected from the plurality of substrate elements;
a detection unit configured to obtain the positions of the two or more selected substrate elements, respectively, and detect the positions of the substrates by performing pattern matching using a reference image for each of the two or more captured images;
each of the plurality of substrate elements has a pattern region in which a predetermined pattern is formed inside an outer edge of the substantially rectangular region;
and the reference image is a set of line segments set on each side of an outer edge of the region except for a corner portion. A drawing apparatus for drawing on a substrate, comprising:
The substrate position detection device according to claim 9;
A writing unit for writing by irradiating light with respect to the substrate;
and a writing control unit configured to perform writing on the plurality of substrate elements of the substrate while controlling the writing position by controlling the writing unit based on the position of the substrate detected by the substrate position detection device; .

Images