KR101385032B1 - 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름 - Google Patents
이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름 Download PDFInfo
- Publication number
- KR101385032B1 KR101385032B1 KR1020100140042A KR20100140042A KR101385032B1 KR 101385032 B1 KR101385032 B1 KR 101385032B1 KR 1020100140042 A KR1020100140042 A KR 1020100140042A KR 20100140042 A KR20100140042 A KR 20100140042A KR 101385032 B1 KR101385032 B1 KR 101385032B1
- Authority
- KR
- South Korea
- Prior art keywords
- acrylate
- meth
- conductive film
- anisotropic conductive
- polyurethane
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100140042A KR101385032B1 (ko) | 2010-12-31 | 2010-12-31 | 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름 |
CN201110343870.5A CN102533139B (zh) | 2010-12-31 | 2011-11-03 | 各向异性导电膜、其中包含的组合物和包括该膜的装置 |
JP2011251728A JP5837804B2 (ja) | 2010-12-31 | 2011-11-17 | 異方導電性フィルム組成物、これから製造された異方導電性フィルム、及び該異方導電性フィルムを含む装置 |
TW100143115A TWI577727B (zh) | 2010-12-31 | 2011-11-24 | 各向異性導電膜、其中包含的組合物和包括該膜的裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100140042A KR101385032B1 (ko) | 2010-12-31 | 2010-12-31 | 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20120077912A KR20120077912A (ko) | 2012-07-10 |
KR101385032B1 true KR101385032B1 (ko) | 2014-04-14 |
Family
ID=46341218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020100140042A KR101385032B1 (ko) | 2010-12-31 | 2010-12-31 | 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5837804B2 (zh) |
KR (1) | KR101385032B1 (zh) |
CN (1) | CN102533139B (zh) |
TW (1) | TWI577727B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103378236B (zh) * | 2012-04-25 | 2017-04-05 | 清华大学 | 具有微构造的外延结构体 |
KR101702718B1 (ko) | 2014-11-20 | 2017-02-06 | 삼성에스디아이 주식회사 | 이방성 도전 필름, 이의 조성물 및 이를 이용한 반도체 장치 |
KR101716551B1 (ko) | 2014-11-27 | 2017-03-14 | 삼성에스디아이 주식회사 | 이방 도전성 필름 및 이를 이용한 반도체 장치 |
TWI689573B (zh) * | 2016-05-23 | 2020-04-01 | 日商拓自達電線股份有限公司 | 導電性接著劑組成物 |
KR102097773B1 (ko) * | 2016-09-27 | 2020-04-06 | (주)엘지하우시스 | 전도성 필름 및 이의 제조방법 |
JP7172991B2 (ja) * | 2017-03-29 | 2022-11-16 | 昭和電工マテリアルズ株式会社 | 接着剤組成物及び構造体 |
WO2024070436A1 (ja) * | 2022-09-28 | 2024-04-04 | 綜研化学株式会社 | 異方導電性材料、異方導電性シートおよび異方導電性ペースト並びに接続構造体および接続構造体の製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100402154B1 (ko) * | 1999-04-01 | 2003-10-17 | 미쯔이카가쿠 가부시기가이샤 | 이방 도전성 페이스트 |
KR20100060173A (ko) * | 2008-11-27 | 2010-06-07 | 제일모직주식회사 | 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성 필름 |
KR20100125164A (ko) * | 2008-03-21 | 2010-11-30 | 키모토 컴파니 리미티드 | 광학용 필름, 적층체 및 터치패널 |
KR20120076185A (ko) * | 2010-12-29 | 2012-07-09 | 제일모직주식회사 | 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002285135A (ja) * | 2001-03-27 | 2002-10-03 | Shin Etsu Polymer Co Ltd | 異方導電性接着剤及びこれを用いた接続構造 |
JP2003249287A (ja) * | 2002-02-25 | 2003-09-05 | Shin Etsu Polymer Co Ltd | 異方導電性接着剤、ヒートシールコネクター及び接続構造 |
US7338710B2 (en) * | 2002-06-06 | 2008-03-04 | Sony Chemicals & Information Device Corporation | Resin particle, conductive particle and anisotropic conductive adhesive containing the same |
JP2006143800A (ja) * | 2004-11-17 | 2006-06-08 | Kyowa Sangyo Kk | 塗料および塗装物品 |
JPWO2006109556A1 (ja) * | 2005-03-31 | 2008-10-30 | 日清紡績株式会社 | 球状ポリマー微粒子およびその製造方法 |
CN101154470B (zh) * | 2006-09-29 | 2010-12-29 | 深圳富泰宏精密工业有限公司 | 外壳 |
RU2482140C2 (ru) * | 2007-01-22 | 2013-05-20 | Мобиус Текнолоджиз, Инк. | Композитная панель, содержащая полиуретановое связующее, и способ ее изготовления |
-
2010
- 2010-12-31 KR KR1020100140042A patent/KR101385032B1/ko active IP Right Grant
-
2011
- 2011-11-03 CN CN201110343870.5A patent/CN102533139B/zh active Active
- 2011-11-17 JP JP2011251728A patent/JP5837804B2/ja active Active
- 2011-11-24 TW TW100143115A patent/TWI577727B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100402154B1 (ko) * | 1999-04-01 | 2003-10-17 | 미쯔이카가쿠 가부시기가이샤 | 이방 도전성 페이스트 |
KR20100125164A (ko) * | 2008-03-21 | 2010-11-30 | 키모토 컴파니 리미티드 | 광학용 필름, 적층체 및 터치패널 |
KR20100060173A (ko) * | 2008-11-27 | 2010-06-07 | 제일모직주식회사 | 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성 필름 |
KR20120076185A (ko) * | 2010-12-29 | 2012-07-09 | 제일모직주식회사 | 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름 |
Also Published As
Publication number | Publication date |
---|---|
KR20120077912A (ko) | 2012-07-10 |
TW201229115A (en) | 2012-07-16 |
JP5837804B2 (ja) | 2015-12-24 |
TWI577727B (zh) | 2017-04-11 |
CN102533139A (zh) | 2012-07-04 |
JP2012140594A (ja) | 2012-07-26 |
CN102533139B (zh) | 2015-01-14 |
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