KR101385032B1 - 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름 - Google Patents

이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름 Download PDF

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Publication number
KR101385032B1
KR101385032B1 KR1020100140042A KR20100140042A KR101385032B1 KR 101385032 B1 KR101385032 B1 KR 101385032B1 KR 1020100140042 A KR1020100140042 A KR 1020100140042A KR 20100140042 A KR20100140042 A KR 20100140042A KR 101385032 B1 KR101385032 B1 KR 101385032B1
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KR
South Korea
Prior art keywords
acrylate
meth
conductive film
anisotropic conductive
polyurethane
Prior art date
Application number
KR1020100140042A
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English (en)
Korean (ko)
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KR20120077912A (ko
Inventor
배상식
어동선
신경훈
조장현
김진규
고연조
황자영
박경수
윤강배
박진성
Original Assignee
제일모직주식회사
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Publication date
Application filed by 제일모직주식회사 filed Critical 제일모직주식회사
Priority to KR1020100140042A priority Critical patent/KR101385032B1/ko
Priority to CN201110343870.5A priority patent/CN102533139B/zh
Priority to JP2011251728A priority patent/JP5837804B2/ja
Priority to TW100143115A priority patent/TWI577727B/zh
Publication of KR20120077912A publication Critical patent/KR20120077912A/ko
Application granted granted Critical
Publication of KR101385032B1 publication Critical patent/KR101385032B1/ko

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR1020100140042A 2010-12-31 2010-12-31 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름 KR101385032B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020100140042A KR101385032B1 (ko) 2010-12-31 2010-12-31 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름
CN201110343870.5A CN102533139B (zh) 2010-12-31 2011-11-03 各向异性导电膜、其中包含的组合物和包括该膜的装置
JP2011251728A JP5837804B2 (ja) 2010-12-31 2011-11-17 異方導電性フィルム組成物、これから製造された異方導電性フィルム、及び該異方導電性フィルムを含む装置
TW100143115A TWI577727B (zh) 2010-12-31 2011-11-24 各向異性導電膜、其中包含的組合物和包括該膜的裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100140042A KR101385032B1 (ko) 2010-12-31 2010-12-31 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름

Publications (2)

Publication Number Publication Date
KR20120077912A KR20120077912A (ko) 2012-07-10
KR101385032B1 true KR101385032B1 (ko) 2014-04-14

Family

ID=46341218

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100140042A KR101385032B1 (ko) 2010-12-31 2010-12-31 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름

Country Status (4)

Country Link
JP (1) JP5837804B2 (zh)
KR (1) KR101385032B1 (zh)
CN (1) CN102533139B (zh)
TW (1) TWI577727B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103378236B (zh) * 2012-04-25 2017-04-05 清华大学 具有微构造的外延结构体
KR101702718B1 (ko) 2014-11-20 2017-02-06 삼성에스디아이 주식회사 이방성 도전 필름, 이의 조성물 및 이를 이용한 반도체 장치
KR101716551B1 (ko) 2014-11-27 2017-03-14 삼성에스디아이 주식회사 이방 도전성 필름 및 이를 이용한 반도체 장치
TWI689573B (zh) * 2016-05-23 2020-04-01 日商拓自達電線股份有限公司 導電性接著劑組成物
KR102097773B1 (ko) * 2016-09-27 2020-04-06 (주)엘지하우시스 전도성 필름 및 이의 제조방법
JP7172991B2 (ja) * 2017-03-29 2022-11-16 昭和電工マテリアルズ株式会社 接着剤組成物及び構造体
WO2024070436A1 (ja) * 2022-09-28 2024-04-04 綜研化学株式会社 異方導電性材料、異方導電性シートおよび異方導電性ペースト並びに接続構造体および接続構造体の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100402154B1 (ko) * 1999-04-01 2003-10-17 미쯔이카가쿠 가부시기가이샤 이방 도전성 페이스트
KR20100060173A (ko) * 2008-11-27 2010-06-07 제일모직주식회사 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성 필름
KR20100125164A (ko) * 2008-03-21 2010-11-30 키모토 컴파니 리미티드 광학용 필름, 적층체 및 터치패널
KR20120076185A (ko) * 2010-12-29 2012-07-09 제일모직주식회사 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002285135A (ja) * 2001-03-27 2002-10-03 Shin Etsu Polymer Co Ltd 異方導電性接着剤及びこれを用いた接続構造
JP2003249287A (ja) * 2002-02-25 2003-09-05 Shin Etsu Polymer Co Ltd 異方導電性接着剤、ヒートシールコネクター及び接続構造
US7338710B2 (en) * 2002-06-06 2008-03-04 Sony Chemicals & Information Device Corporation Resin particle, conductive particle and anisotropic conductive adhesive containing the same
JP2006143800A (ja) * 2004-11-17 2006-06-08 Kyowa Sangyo Kk 塗料および塗装物品
JPWO2006109556A1 (ja) * 2005-03-31 2008-10-30 日清紡績株式会社 球状ポリマー微粒子およびその製造方法
CN101154470B (zh) * 2006-09-29 2010-12-29 深圳富泰宏精密工业有限公司 外壳
RU2482140C2 (ru) * 2007-01-22 2013-05-20 Мобиус Текнолоджиз, Инк. Композитная панель, содержащая полиуретановое связующее, и способ ее изготовления

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100402154B1 (ko) * 1999-04-01 2003-10-17 미쯔이카가쿠 가부시기가이샤 이방 도전성 페이스트
KR20100125164A (ko) * 2008-03-21 2010-11-30 키모토 컴파니 리미티드 광학용 필름, 적층체 및 터치패널
KR20100060173A (ko) * 2008-11-27 2010-06-07 제일모직주식회사 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성 필름
KR20120076185A (ko) * 2010-12-29 2012-07-09 제일모직주식회사 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름

Also Published As

Publication number Publication date
KR20120077912A (ko) 2012-07-10
TW201229115A (en) 2012-07-16
JP5837804B2 (ja) 2015-12-24
TWI577727B (zh) 2017-04-11
CN102533139A (zh) 2012-07-04
JP2012140594A (ja) 2012-07-26
CN102533139B (zh) 2015-01-14

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