KR101366754B1 - 고속의 기판 정렬기 장치 - Google Patents

고속의 기판 정렬기 장치 Download PDF

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Publication number
KR101366754B1
KR101366754B1 KR1020077025002A KR20077025002A KR101366754B1 KR 101366754 B1 KR101366754 B1 KR 101366754B1 KR 1020077025002 A KR1020077025002 A KR 1020077025002A KR 20077025002 A KR20077025002 A KR 20077025002A KR 101366754 B1 KR101366754 B1 KR 101366754B1
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KR
South Korea
Prior art keywords
substrate
chuck
frame
sensor head
aligner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020077025002A
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English (en)
Korean (ko)
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KR20070119058A (ko
Inventor
테라 모우라 자이로
호섹 마틴
바텀리 토드
길크리스트 율리시스
Original Assignee
브룩스 오토메이션 인코퍼레이티드
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Publication of KR20070119058A publication Critical patent/KR20070119058A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37608—Center and diameter of hole, wafer, object
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020077025002A 2005-03-30 2006-03-29 고속의 기판 정렬기 장치 Expired - Fee Related KR101366754B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/093,479 US7891936B2 (en) 2005-03-30 2005-03-30 High speed substrate aligner apparatus
US11/093,479 2005-03-30
PCT/US2006/011400 WO2006105156A2 (en) 2005-03-30 2006-03-29 High speed substrate aligner apparatus

Publications (2)

Publication Number Publication Date
KR20070119058A KR20070119058A (ko) 2007-12-18
KR101366754B1 true KR101366754B1 (ko) 2014-02-24

Family

ID=37054057

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077025002A Expired - Fee Related KR101366754B1 (ko) 2005-03-30 2006-03-29 고속의 기판 정렬기 장치

Country Status (7)

Country Link
US (2) US7891936B2 (enExample)
EP (1) EP1866958B1 (enExample)
JP (2) JP5820559B2 (enExample)
KR (1) KR101366754B1 (enExample)
CN (2) CN102024735B (enExample)
TW (1) TWI429013B (enExample)
WO (1) WO2006105156A2 (enExample)

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* Cited by examiner, † Cited by third party
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US7891936B2 (en) 2005-03-30 2011-02-22 Brooks Automation, Inc. High speed substrate aligner apparatus
US8545165B2 (en) 2005-03-30 2013-10-01 Brooks Automation, Inc. High speed substrate aligner apparatus
JP2008103544A (ja) * 2006-10-19 2008-05-01 Yaskawa Electric Corp アライナー装置
CN103192463A (zh) * 2012-01-05 2013-07-10 沈阳新松机器人自动化股份有限公司 透光夹持式预对准机
KR102308221B1 (ko) * 2013-06-05 2021-10-01 퍼시몬 테크놀로지스 코포레이션 로봇 및 적응형 배치 시스템 및 방법
US9062968B2 (en) 2013-07-23 2015-06-23 Avago Technologies General Ip (Singapore) Pte. Ltd. PCB loading apparatus for measuring thickness of printed circuit board stack
US20150090295A1 (en) * 2013-09-28 2015-04-02 Applied Materials, Inc. Apparatus and methods for a mask inverter
JP6420852B2 (ja) * 2015-01-28 2018-11-07 堺ディスプレイプロダクト株式会社 反転装置、及び液晶表示パネルの製造方法
KR102587203B1 (ko) 2015-07-13 2023-10-10 브룩스 오토메이션 인코퍼레이티드 온 더 플라이 자동 웨이퍼 센터링 방법 및 장치
KR102576705B1 (ko) * 2018-08-30 2023-09-08 삼성전자주식회사 기판 본딩 장치 및 기판의 본딩 방법
US12002696B2 (en) * 2020-06-30 2024-06-04 Brooks Automation Us, Llc Substrate mapping apparatus and method therefor
KR102501318B1 (ko) * 2022-04-07 2023-02-16 양희찬 웨이퍼 이동암

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US20030053904A1 (en) * 2001-09-14 2003-03-20 Naofumi Kirihata Wafer aligner
US20050016818A1 (en) * 2003-06-03 2005-01-27 Tokyo Electron Limited Substrate processing apparatus and method for adjusting a substrate transfer position
US7019817B2 (en) * 2003-07-14 2006-03-28 Kawasaki Jukogyo Kabuishiki Kaisha Edge-holding aligner

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US5102280A (en) * 1989-03-07 1992-04-07 Ade Corporation Robot prealigner
JPH06151566A (ja) * 1992-11-04 1994-05-31 Matsushita Electric Ind Co Ltd オリフラ位置検出装置およびオリフラ位置合わせ装置
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US8545165B2 (en) 2005-03-30 2013-10-01 Brooks Automation, Inc. High speed substrate aligner apparatus
US7891936B2 (en) 2005-03-30 2011-02-22 Brooks Automation, Inc. High speed substrate aligner apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5339027A (en) * 1991-08-30 1994-08-16 Hughes Aircraft Company Rigid-flex circuits with raised features as IC test probes
US20030053904A1 (en) * 2001-09-14 2003-03-20 Naofumi Kirihata Wafer aligner
US20050016818A1 (en) * 2003-06-03 2005-01-27 Tokyo Electron Limited Substrate processing apparatus and method for adjusting a substrate transfer position
US7019817B2 (en) * 2003-07-14 2006-03-28 Kawasaki Jukogyo Kabuishiki Kaisha Edge-holding aligner

Also Published As

Publication number Publication date
JP2014013925A (ja) 2014-01-23
CN101379604B (zh) 2010-12-15
EP1866958A4 (en) 2010-04-21
WO2006105156A8 (en) 2007-11-29
EP1866958A2 (en) 2007-12-19
WO2006105156A2 (en) 2006-10-05
US8403619B2 (en) 2013-03-26
TWI429013B (zh) 2014-03-01
JP2008538258A (ja) 2008-10-16
CN102024735A (zh) 2011-04-20
US20120045300A1 (en) 2012-02-23
CN101379604A (zh) 2009-03-04
CN102024735B (zh) 2012-12-26
WO2006105156A3 (en) 2008-10-30
US7891936B2 (en) 2011-02-22
KR20070119058A (ko) 2007-12-18
JP5820559B2 (ja) 2015-11-24
EP1866958B1 (en) 2014-06-25
TW200703542A (en) 2007-01-16
JP5976612B2 (ja) 2016-08-23
US20060245846A1 (en) 2006-11-02

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