JP2014013925A - 高速基板配置装置 - Google Patents
高速基板配置装置 Download PDFInfo
- Publication number
- JP2014013925A JP2014013925A JP2013181312A JP2013181312A JP2014013925A JP 2014013925 A JP2014013925 A JP 2014013925A JP 2013181312 A JP2013181312 A JP 2013181312A JP 2013181312 A JP2013181312 A JP 2013181312A JP 2014013925 A JP2014013925 A JP 2014013925A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- frame
- handle
- placement
- reverse handle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37608—Center and diameter of hole, wafer, object
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】基板配置装置105はフレーム205に接続された逆把部206を有しており、フレーム205には、基板を回転して再配置することなく、逆把部206から基板搬送装置へ基板を搬送する基板搬送システムが備えられている。逆把部206は、基板を配置する際の基板の基準マークの障害を排除し、基板搬送システムと伴に、基板配置中に基板搬送装置がフレーム205内に留まることができる。
【選択図】図2A
Description
102 多基板処理チャンバー
103 基板搬送装置
104 搬送チャンバー
105 基板配置装置
106 エンドエフェクター
205 フレーム
205A 最高部
205B 底面
206 逆把部
206A スパン部材
206B 下降伸張部
206C 静止パッド
207 駆動システム
208 汚染遮蔽体
209 検出装置
210 基板搬送機構
210A リフター
210B リフター
210C 上昇伸張部
211 搬送機構駆動部
212 基板
213 スロット
216 逆把部駆動部
219 静止パッド
222 駆動システム
316A 基板支持体
316B 基板支持体
317 検出装置
317A 検出装置
317B 検出装置
318 センサーヘッド
318A 基盤部材
318B 基盤拡張部材
318C スパン部材
318D 下方拡張部材
319 基板支持体
319A スパン部材
319B 上方拡張部材
320A 基板支持静止パッド
320B 基板支持静止パッド
321 駆動部
423A 基盤部
423B 腕部
423C 腕部
423D 上方拡張部材
423E カンチレバー部材
424 検出装置
425 把部
425A 基盤部材
425B 腕部
425C 腕部
425D 静止パッドシステム
425E 静止パッド拡張部材
425F 静止パッド拡張部材
425G 静止パッド
425H 静止パッド
430 回転軸
431 回転軸
440 基板緩和装置
1105 基板配置装置
1205 フレーム
1206 把部
1206C 基板静止パット
1207 駆動システム
1207T 搬送部材
1209 検出装置
1210 基板搬送システム
1210A 部材
1216 駆動部
1219 基板静止パット
1222 直線駆動部
Claims (12)
- 基板配置装置であって、
基板搬送装置が前記基板配置装置に対して基板を搬送するように許容されたフレームと、
前記基板を保持することができ、把部駆動軸によって前記フレームに可動的に接続され、前記把部駆動軸と連動して前記フレームに対して移動し且つ前記基板を配置する逆把部と、
前記逆把部と前記把部駆動軸の間に位置し、前記基板の特徴を決定づける位置を検出するための検出装置と、
前記フレームに可動的に接続され、前記逆把部の下方に位置する前記フレーム内に位置し、前記基板を前記逆把部から前記基板搬送装置に搬送する基板搬送機構と、を含むことを特徴とする基板配置装置。 - 前記逆把部は、前記基板の配置中に前記基板搬送装置が前記フレーム内に留まることができるように構成さていることを特徴とする請求項1に記載の基板配置装置。
- 前記逆把部と前記把部駆動軸の間に位置する汚染遮蔽体を更に含むことを特徴とする請求項1に記載の基板配置装置。
- 前記逆把部は、前記逆把部の中心から放射状に広がる第1及び第2端部を含み且つ前記基板の反対面をつかむ保持装置を有することを特徴とする請求項1に記載の基板配置装置。
- 前記逆把部の前記保持装置の前記第1及び第2端部の各々はつかみパッドを有し、前記つかみパッドのうち1以上が前記基板をつかみ且つ離すように可動であることを特徴とする請求項4に記載の基板配置装置。
- 前記保持装置は、前記基板の端部をつかむように許容されていることを特徴とする請求項4に記載の基板配置装置。
- 前記検出装置は前記フレームに対して固定されていること特徴とする請求項1記載の基板配置装置。
- 前記検出装置は反射光学検出器を含むことを特徴とする請求項1記載の基板配置装置。
- 前記基板搬送機構は独立して可動なリフティングパッドを含み、前記リフティングパッドの各々が独立して前記逆把部から前記基板搬送装置に前記基板を搬送することができることを特徴とする請求項1記載の基板配置装置。
- 前記リフティングパッドの各々は前記基板の端部をつかむように許容されていることを特徴とする請求項9に記載の基板配置装置。
- 前記リフティングパッドは前記フレーム内の前記基板搬送装置の位置とは独立して配置され、前記リフティングパッドの少なくとも一つ前記逆把部にアクセスし前記基板を前記逆把部から基板搬送装置に搬送することができることを特徴とする請求項9記載の基板配置装置。
- 基板配置装置であって、
基板搬送装置が基板を前記基板配置装置に対して搬送するように許容されたフレームと、
前記フレームに接続された駆動部と、
可動するように前記フレームに接続され、前記基板と直接的に連動し、前記駆動部に動作可能となるように接続され、前記駆動部によって前記フレームに対して移動することができる第1基板連動部と、
可動するように前記フレームに接続され、前記基板と直接的に連動し、前記駆動部に動作可能となるように接続され、前記駆動部によって前記フレームに対して移動することができる第2基板連動部と、を含み、
前記第1基板連動部は前記基板の特徴を決定づける位置を検知するように動き、前記第2基板連動部は前記基板の再配置するように動くことを特徴とする基板配置装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/093,479 | 2005-03-30 | ||
US11/093,479 US7891936B2 (en) | 2005-03-30 | 2005-03-30 | High speed substrate aligner apparatus |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008504279A Division JP5820559B2 (ja) | 2005-03-30 | 2006-03-29 | 高速基板配置装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014013925A true JP2014013925A (ja) | 2014-01-23 |
JP5976612B2 JP5976612B2 (ja) | 2016-08-23 |
Family
ID=37054057
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008504279A Active JP5820559B2 (ja) | 2005-03-30 | 2006-03-29 | 高速基板配置装置 |
JP2013181312A Active JP5976612B2 (ja) | 2005-03-30 | 2013-09-02 | 高速基板配置装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008504279A Active JP5820559B2 (ja) | 2005-03-30 | 2006-03-29 | 高速基板配置装置 |
Country Status (7)
Country | Link |
---|---|
US (2) | US7891936B2 (ja) |
EP (1) | EP1866958B1 (ja) |
JP (2) | JP5820559B2 (ja) |
KR (1) | KR101366754B1 (ja) |
CN (2) | CN101379604B (ja) |
TW (1) | TWI429013B (ja) |
WO (1) | WO2006105156A2 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8545165B2 (en) | 2005-03-30 | 2013-10-01 | Brooks Automation, Inc. | High speed substrate aligner apparatus |
US7891936B2 (en) | 2005-03-30 | 2011-02-22 | Brooks Automation, Inc. | High speed substrate aligner apparatus |
JP2008103544A (ja) * | 2006-10-19 | 2008-05-01 | Yaskawa Electric Corp | アライナー装置 |
CN103192463A (zh) * | 2012-01-05 | 2013-07-10 | 沈阳新松机器人自动化股份有限公司 | 透光夹持式预对准机 |
WO2014197537A1 (en) * | 2013-06-05 | 2014-12-11 | Persimmon Technologies, Corp. | Robot and adaptive placement system and method |
US9062968B2 (en) | 2013-07-23 | 2015-06-23 | Avago Technologies General Ip (Singapore) Pte. Ltd. | PCB loading apparatus for measuring thickness of printed circuit board stack |
US20150090295A1 (en) * | 2013-09-28 | 2015-04-02 | Applied Materials, Inc. | Apparatus and methods for a mask inverter |
CN107407830B (zh) * | 2015-01-28 | 2020-11-06 | 堺显示器制品株式会社 | 翻转装置和液晶显示面板的制造方法 |
WO2017011581A1 (en) * | 2015-07-13 | 2017-01-19 | Brooks Automation, Inc. | On the fly automatic wafer centering method and apparatus |
KR102501318B1 (ko) * | 2022-04-07 | 2023-02-16 | 양희찬 | 웨이퍼 이동암 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000021956A (ja) * | 1998-07-02 | 2000-01-21 | Mecs Corp | ノッチ合わせ機 |
JP2000208592A (ja) * | 1999-01-17 | 2000-07-28 | Nova Measuring Instruments Ltd | ウェハハンドリング・システム用のバッファステ―ション |
JP2003163258A (ja) * | 2001-09-14 | 2003-06-06 | Assist Japan Kk | ウェハのアライナー装置 |
JP2003282678A (ja) * | 2002-03-25 | 2003-10-03 | Tokyo Electron Ltd | 位置決め機能を有する基板処理装置及び位置決め機能を有する基板処理方法 |
JP2004259845A (ja) * | 2003-02-25 | 2004-09-16 | Nikon Corp | パラメータ調整方法、物体搬送方法、露光装置、及びプログラム |
JP2004303796A (ja) * | 2003-03-28 | 2004-10-28 | Assist Japan Kk | ウェハのアライナー装置 |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4915564A (en) | 1986-04-04 | 1990-04-10 | Materials Research Corporation | Method and apparatus for handling and processing wafer-like materials |
US5102280A (en) * | 1989-03-07 | 1992-04-07 | Ade Corporation | Robot prealigner |
US5264787A (en) * | 1991-08-30 | 1993-11-23 | Hughes Aircraft Company | Rigid-flex circuits with raised features as IC test probes |
JPH06151566A (ja) * | 1992-11-04 | 1994-05-31 | Matsushita Electric Ind Co Ltd | オリフラ位置検出装置およびオリフラ位置合わせ装置 |
US5491618A (en) | 1993-08-20 | 1996-02-13 | Lights Of America, Inc. | Light fixture |
JPH07260455A (ja) * | 1994-03-23 | 1995-10-13 | Kokusai Electric Co Ltd | 基板位置決め方法及び装置 |
US5568969A (en) | 1996-03-22 | 1996-10-29 | Yu; Jack | Convertible light assembly |
JP3439607B2 (ja) | 1996-09-04 | 2003-08-25 | 東京エレクトロン株式会社 | ノッチ整列装置 |
US6126381A (en) * | 1997-04-01 | 2000-10-03 | Kensington Laboratories, Inc. | Unitary specimen prealigner and continuously rotatable four link robot arm mechanism |
US6126380A (en) * | 1997-08-04 | 2000-10-03 | Creative Design Corporation | Robot having a centering and flat finding means |
US6530732B1 (en) | 1997-08-12 | 2003-03-11 | Brooks Automation, Inc. | Single substrate load lock with offset cool module and buffer chamber |
US6309163B1 (en) * | 1997-10-30 | 2001-10-30 | Applied Materials, Inc. | Wafer positioning device with storage capability |
US6439740B1 (en) | 1997-12-01 | 2002-08-27 | Technical Consumer Products, Inc. | Lighting fixture having a screw lock lamp support |
JP2000068357A (ja) * | 1998-08-25 | 2000-03-03 | Kobe Steel Ltd | ウェーハ切欠部位置検出装置及びウェーハ特性測定装置 |
US6212961B1 (en) * | 1999-02-11 | 2001-04-10 | Nova Measuring Instruments Ltd. | Buffer system for a wafer handling system |
US6275742B1 (en) | 1999-04-16 | 2001-08-14 | Berkeley Process Control, Inc. | Wafer aligner system |
US6357996B2 (en) * | 1999-05-14 | 2002-03-19 | Newport Corporation | Edge gripping specimen prealigner |
EP1139390A1 (en) * | 2000-03-28 | 2001-10-04 | Infineon Technologies AG | Semiconductor wafer pod |
US6468022B1 (en) | 2000-07-05 | 2002-10-22 | Integrated Dynamics Engineering, Inc. | Edge-gripping pre-aligner |
CN100398272C (zh) * | 2000-09-01 | 2008-07-02 | 阿赛斯特技术公司 | 具有缓冲性能的边缘夹持校准器 |
US6435807B1 (en) * | 2000-12-14 | 2002-08-20 | Genmark Automation | Integrated edge gripper |
US6494589B1 (en) | 2001-08-31 | 2002-12-17 | Shing Jy Shyu | Ceiling fan having one or more changeable lamp devices |
US20030053904A1 (en) * | 2001-09-14 | 2003-03-20 | Naofumi Kirihata | Wafer aligner |
US7119566B2 (en) | 2002-03-22 | 2006-10-10 | Electro Scientific Industries, Inc. | Test probe alignment apparatus |
US6669159B1 (en) | 2003-01-07 | 2003-12-30 | Dong Guan Bright Yin Huey Lighting Co., Ltd. | Ceiling fixture |
KR101015778B1 (ko) * | 2003-06-03 | 2011-02-22 | 도쿄엘렉트론가부시키가이샤 | 기판 처리장치 및 기판 수수 위치의 조정 방법 |
US7596425B2 (en) * | 2003-06-13 | 2009-09-29 | Dainippon Screen Mfg. Co., Ltd. | Substrate detecting apparatus and method, substrate transporting apparatus and method, and substrate processing apparatus and method |
US7019817B2 (en) * | 2003-07-14 | 2006-03-28 | Kawasaki Jukogyo Kabuishiki Kaisha | Edge-holding aligner |
KR100547936B1 (ko) | 2003-08-07 | 2006-01-31 | 삼성전자주식회사 | 불순물 용출 장치 |
US20050099817A1 (en) | 2003-11-10 | 2005-05-12 | Lin Kuo K. | Ceiling fixture |
US20060007176A1 (en) | 2004-07-06 | 2006-01-12 | Chung-Yi Shen | Input method and control module defined with an initial position and moving directions and electronic product thereof |
KR100657789B1 (ko) | 2004-07-15 | 2006-12-14 | 삼성전자주식회사 | 유전막의 누설 전류 특성을 검사하는 방법 및 이를수행하기 위한 장치 |
US7891936B2 (en) | 2005-03-30 | 2011-02-22 | Brooks Automation, Inc. | High speed substrate aligner apparatus |
US8545165B2 (en) | 2005-03-30 | 2013-10-01 | Brooks Automation, Inc. | High speed substrate aligner apparatus |
US9099506B2 (en) | 2005-03-30 | 2015-08-04 | Brooks Automation, Inc. | Transfer chamber between workstations |
-
2005
- 2005-03-30 US US11/093,479 patent/US7891936B2/en active Active
-
2006
- 2006-03-29 CN CN200680019061.6A patent/CN101379604B/zh active Active
- 2006-03-29 WO PCT/US2006/011400 patent/WO2006105156A2/en active Search and Examination
- 2006-03-29 CN CN201010516708.4A patent/CN102024735B/zh active Active
- 2006-03-29 EP EP06748850.2A patent/EP1866958B1/en active Active
- 2006-03-29 KR KR1020077025002A patent/KR101366754B1/ko active IP Right Grant
- 2006-03-29 JP JP2008504279A patent/JP5820559B2/ja active Active
- 2006-03-30 TW TW095111132A patent/TWI429013B/zh active
-
2011
- 2011-02-18 US US13/030,926 patent/US8403619B2/en active Active
-
2013
- 2013-09-02 JP JP2013181312A patent/JP5976612B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000021956A (ja) * | 1998-07-02 | 2000-01-21 | Mecs Corp | ノッチ合わせ機 |
JP2000208592A (ja) * | 1999-01-17 | 2000-07-28 | Nova Measuring Instruments Ltd | ウェハハンドリング・システム用のバッファステ―ション |
JP2003163258A (ja) * | 2001-09-14 | 2003-06-06 | Assist Japan Kk | ウェハのアライナー装置 |
JP2003282678A (ja) * | 2002-03-25 | 2003-10-03 | Tokyo Electron Ltd | 位置決め機能を有する基板処理装置及び位置決め機能を有する基板処理方法 |
JP2004259845A (ja) * | 2003-02-25 | 2004-09-16 | Nikon Corp | パラメータ調整方法、物体搬送方法、露光装置、及びプログラム |
JP2004303796A (ja) * | 2003-03-28 | 2004-10-28 | Assist Japan Kk | ウェハのアライナー装置 |
Also Published As
Publication number | Publication date |
---|---|
CN102024735A (zh) | 2011-04-20 |
JP2008538258A (ja) | 2008-10-16 |
CN101379604A (zh) | 2009-03-04 |
KR20070119058A (ko) | 2007-12-18 |
JP5820559B2 (ja) | 2015-11-24 |
KR101366754B1 (ko) | 2014-02-24 |
US7891936B2 (en) | 2011-02-22 |
CN102024735B (zh) | 2012-12-26 |
US8403619B2 (en) | 2013-03-26 |
EP1866958B1 (en) | 2014-06-25 |
CN101379604B (zh) | 2010-12-15 |
WO2006105156A2 (en) | 2006-10-05 |
US20060245846A1 (en) | 2006-11-02 |
TW200703542A (en) | 2007-01-16 |
WO2006105156A3 (en) | 2008-10-30 |
EP1866958A2 (en) | 2007-12-19 |
EP1866958A4 (en) | 2010-04-21 |
JP5976612B2 (ja) | 2016-08-23 |
WO2006105156A8 (en) | 2007-11-29 |
TWI429013B (zh) | 2014-03-01 |
US20120045300A1 (en) | 2012-02-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5976612B2 (ja) | 高速基板配置装置 | |
US11508597B2 (en) | High speed substrate aligner apparatus | |
JP2008538258A5 (ja) | ||
JP5259907B2 (ja) | 加工ツール、加工物を位置合わせする方法、及び加工物を次々に加工する方法 | |
US20030077162A1 (en) | Edge gripping prealigner | |
JP4664142B2 (ja) | ステージ装置 | |
JP2004535681A (ja) | 統合マッピングセンサを備えた中心位置決め用両側エッジグリップ・エンドエフェクタ | |
WO2004033158A2 (en) | Substrate handling system for aligning and orienting substrates during a transfer operation | |
KR20110025769A (ko) | 얼라인먼트 기능을 갖는 스테이지 및 이 얼라인먼트 기능을 갖는 스테이지를 구비한 처리 장치 및 기판 얼라인먼트 방법 | |
US20170301576A1 (en) | Substrate handling system for aligning and orienting substrates during a transfer operation | |
JP4034353B2 (ja) | 全方向に傾斜可能なz軸駆動アーム | |
KR101285988B1 (ko) | 프리얼라이너 장치 | |
WO1999052686A1 (en) | Substrate prealigner |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130902 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140701 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140930 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20141003 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20141031 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20141106 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20141128 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20141203 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150105 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150630 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20150928 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151228 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160614 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20160713 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160720 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5976612 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |