JP2008538258A - 高速基板配置装置 - Google Patents
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37608—Center and diameter of hole, wafer, object
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
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Abstract
Description
駆動部と、第1基板連動部と、第2基板連動部とを含む。フレームは、基板搬送装置が基板を前記基板配置装置に対して搬送するように許容されている。駆動部は前記フレームに接続されている。第1基板連動部は、可動するように前記フレームに接続され、前記基板と直接的に連動し、前記駆動部に動作可能となるように接続され、前記駆動部によって前記フレームに対して移動することができる。第2基板連動部は、可動するように前記フレームに接続され、前記基板と直接的に連動し、前記駆動部に動作可能となるように接続され、前記駆動部によって前記フレームに対して移動することができる。前記第1基板連動部は前記基板の特徴を決定づける位置を検知するように動き、前記第2基板連動部は前記基板の再配置するように動くことができる。
102 多基板処理チャンバー
103 基板搬送装置
104 搬送チャンバー
105 基板配置装置
106 エンドエフェクター
205 フレーム
205A 最高部
205B 底面
206 逆把部
206A スパン部材
206B 下降伸張部
206C 静止パッド
207 駆動システム
208 汚染遮蔽体
209 検出装置
210 基板搬送機構
210A リフター
210B リフター
210C 上昇伸張部
211 搬送機構駆動部
212 基板
213 スロット
216 逆把部駆動部
219 静止パッド
222 駆動システム
316A 基板支持体
316B 基板支持体
317 検出装置
317A 検出装置
317B 検出装置
318 センサーヘッド
318A 基盤部材
318B 基盤拡張部材
318C スパン部材
318D 下方拡張部材
319 基板支持体
319A スパン部材
319B 上方拡張部材
320A 基板支持静止パッド
320B 基板支持静止パッド
321 駆動部
423A 基盤部
423B 腕部
423C 腕部
423D 上方拡張部材
423E カンチレバー部材
424 検出装置
425 把部
425A 基盤部材
425B 腕部
425C 腕部
425D 静止パッドシステム
425E 静止パッド拡張部材
425F 静止パッド拡張部材
425G 静止パッド
425H 静止パッド
430 回転軸
431 回転軸
440 基板緩和装置
1105 基板配置装置
1205 フレーム
1206 把部
1206C 基板静止パット
1207 駆動システム
1207T 搬送部材
1209 検出装置
1210 基板搬送システム
1210A 部材
1216 駆動部
1219 基板静止パット
1222 直線駆動部
Claims (24)
- 基板配置装置であって、
基板搬送装置が前記基板配置装置に対して基板を搬送するように許容されたフレームと、
前記基板を保持することができ、把部駆動軸によって前記フレームに可動的に接続され、前記把部駆動軸と連動して前記フレームに対して移動し且つ前記基板を配置する逆把部と、
前記逆把部と前記把部駆動軸の間に位置し、前期基板の特徴を決定づける位置を検出するための検出装置と、
前記フレームに可動的に接続され、前記逆把部の下方に位置する前記フレーム内に位置し、前記基板を前記逆把部から前記基板搬送装置に搬送する基板搬送機構と、を含むことを特徴とする基板配置装置。 - 前記逆把部は、前記基板の配置中に前記基板搬送装置が前記フレーム内に留まることができるように構成さていることを特徴とする請求項1に記載の基板配置装置。
- 前記逆把部と前記把部駆動軸の間に位置する汚染遮蔽体を更に含むことを特徴とする請求項1に記載の基板配置装置。
- 前記逆把部は、前記逆把部の中心から放射状に広がる第1及び第2端部を含み且つ前記基板の反対面をつかむ保持装置を有することを特徴とする請求項1に記載の基板配置装置。
- 前記逆把部の前記保持装置の前記第1及び第2端部の各々はつかみパッドを有し、前記つかみパッドのうち1以上が前記基板をつかみ且つ離すように可動であることを特徴とする請求項4に記載の基板配置装置。
- 前記保持装置は、前記基板の端部をつかむように許容されていることを特徴とする請求項4に記載の基板配置装置。
- 前記検出装置は前記フレームに対して固定されていること特徴とする請求項1記載の基板配置装置。
- 前記検出装置は反射光学検出器を含むことを特徴とする請求項1記載の基板配置装置。
- 前記基板搬送機構は独立して可動なリフティングパッドを含み、前記リフティングパッドの各々が独立して前記逆把部から前記基板搬送装置に前記基板を搬送することができることを特徴とする請求項1記載の基板配置装置。
- 前記リフティングパッドの各々は前記基板の端部をつかむように許容されていることを特徴とする請求項9に記載の基板配置装置。
- 前記リフティングパッドは前記フレーム内の前記基板搬送装置の位置とは独立して配置され、前記リフティングパッドの少なくとも一つ前記逆把部にアクセスし前記基板を前記逆把部から基板搬送装置に搬送することができることを特徴とする請求項9記載の基板配置装置。
- 基板配置装置であって、
端部保持基板搬送装置が前記基板配置装置に対して基板を搬送するように許容されたフレームと、
前記フレームに接続され、前記基板を保持し且つ前記基板を回転して所望の基板配置方位に位置づける端部保持装置と、を含み、
前記端部保持装置は、前記端部保持基板搬送装置とは独立して、前記基板を前記所望の基板配置方位に位置づけるように構成され、前記端部保持基板搬送装置に対する前記所望の基板配置方位の如何に関わらず、前記基板を回転して再配置せずに、前記基板を前記所望の基板配置方位に搬送することできることを特徴とする基板配置装置。 - 基板配置装置であって、
基板搬送装置が基板を前記基板配置装置に対して搬送するように許容されたフレームと、
前記基板の特徴を決定する位置を検知する少なくとも一つの検知装置を有し、駆動軸によって前記フレームと可動的に連結され、前記駆動軸と連動して前記フレームに対して可動である回転可動センサーヘッドと、
前記フレームに搭載され、前記基板の特徴を決定づける位置が前記回転可動センサーヘッドによって検知された際に前記フレームを支持する基板支持部と、を含み、
前記基板支持部は前記基板の周縁部と接触する支持パッドを有し、前記検知装置は前記支持パッドに対する前記基板の特徴を決定する前記位置とは独立して、前記基板の特徴を決定する前記位置を検知することができることを特徴とする基板配置装置。 - 前記回転可動センサーヘッドは、前記基板の配置中に、前記基板搬送装置が前記フレーム内に留まることができるように構成されていることを特徴とする請求項13に記載の基板配置装置。
- 前記回転可動センサーヘッドは基板静止パットを含むことを特徴とする請求項13に記載の基板配置装置。
- 前記基板静止パットは、基板の端部に接触するように位置されていることを特徴とする請求項15に記載の基板配置装置。
- 前記少なくとも1つの検出装置は、第1及び第2検出装置を含み、前記第1検出装置は前記第2検出装置とは離れて前記センサーヘッドの反対面に位置することを特徴とする請求項13に記載の基板配置装置。
- 前記第1及び第2の検出装置は反射光学検出器を含むことを特徴とする請求項17に記載の基板配置装置。
- 前記第1及び第2の検出装置は通しビーム検知器を有し、前記通しビーム検知器の各々は送信機と受信機を有することを特徴とする請求項17に記載の基板配置装置。
- 前記基板支持体は、可動するよう前記フレームに搭載され、前記回転可動センサーヘッドの回転軸と実質的に一致する方向に沿って前記回転可動センサーヘッドに対して可動することができることを特徴とする請求項13に記載の基板配置装置。
- 前記支持パッドは実質的に透明であることを特徴とする請求項20に記載の基板配置装置。
- 前記基板支持体は、可動するよう前記フレームに搭載されており、前記基板支持体は前記回転可動センサーヘッドの共通回転軸についての前記フレームに関して回転可動であることを特徴とする請求項13に記載の基板配置装置。
- 前記基板支持体は、前記基板配置装置の中に前記基板の衝撃を緩衝する基板緩衝部を画定している。
- 基板配置装置であって、
基板搬送装置が基板を前記基板配置装置に対して搬送するように許容されたフレームと、
前記フレームに接続された駆動部と、
可動するように前記フレームに接続され、前記基板と直接的に連動し、前記駆動部に動作可能となるように接続され、前記駆動部によって前記フレームに対して移動することができる第1基板連動部と、
可動するように前記フレームに接続され、前記基板と直接的に連動し、前記駆動部に動作可能となるように接続され、前記駆動部によって前記フレームに対して移動することができる第2基板連動部と、を含み、
前記第1基板連動部は前記基板の特徴を決定づける位置を検知するように動き、前記第2基板連動部は前記基板の再配置するように動くことを特徴とする基板配置装置。
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US11/093,479 | 2005-03-30 | ||
US11/093,479 US7891936B2 (en) | 2005-03-30 | 2005-03-30 | High speed substrate aligner apparatus |
PCT/US2006/011400 WO2006105156A2 (en) | 2005-03-30 | 2006-03-29 | High speed substrate aligner apparatus |
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KR (1) | KR101366754B1 (ja) |
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US8545165B2 (en) | 2005-03-30 | 2013-10-01 | Brooks Automation, Inc. | High speed substrate aligner apparatus |
US7891936B2 (en) | 2005-03-30 | 2011-02-22 | Brooks Automation, Inc. | High speed substrate aligner apparatus |
JP2008103544A (ja) * | 2006-10-19 | 2008-05-01 | Yaskawa Electric Corp | アライナー装置 |
CN103192463A (zh) * | 2012-01-05 | 2013-07-10 | 沈阳新松机器人自动化股份有限公司 | 透光夹持式预对准机 |
WO2014197537A1 (en) * | 2013-06-05 | 2014-12-11 | Persimmon Technologies, Corp. | Robot and adaptive placement system and method |
US9062968B2 (en) | 2013-07-23 | 2015-06-23 | Avago Technologies General Ip (Singapore) Pte. Ltd. | PCB loading apparatus for measuring thickness of printed circuit board stack |
US20150090295A1 (en) * | 2013-09-28 | 2015-04-02 | Applied Materials, Inc. | Apparatus and methods for a mask inverter |
CN107407830B (zh) * | 2015-01-28 | 2020-11-06 | 堺显示器制品株式会社 | 翻转装置和液晶显示面板的制造方法 |
WO2017011581A1 (en) * | 2015-07-13 | 2017-01-19 | Brooks Automation, Inc. | On the fly automatic wafer centering method and apparatus |
KR102501318B1 (ko) * | 2022-04-07 | 2023-02-16 | 양희찬 | 웨이퍼 이동암 |
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CN102024735A (zh) | 2011-04-20 |
CN101379604A (zh) | 2009-03-04 |
JP2014013925A (ja) | 2014-01-23 |
KR20070119058A (ko) | 2007-12-18 |
JP5820559B2 (ja) | 2015-11-24 |
KR101366754B1 (ko) | 2014-02-24 |
US7891936B2 (en) | 2011-02-22 |
CN102024735B (zh) | 2012-12-26 |
US8403619B2 (en) | 2013-03-26 |
EP1866958B1 (en) | 2014-06-25 |
CN101379604B (zh) | 2010-12-15 |
WO2006105156A2 (en) | 2006-10-05 |
US20060245846A1 (en) | 2006-11-02 |
TW200703542A (en) | 2007-01-16 |
WO2006105156A3 (en) | 2008-10-30 |
EP1866958A2 (en) | 2007-12-19 |
EP1866958A4 (en) | 2010-04-21 |
JP5976612B2 (ja) | 2016-08-23 |
WO2006105156A8 (en) | 2007-11-29 |
TWI429013B (zh) | 2014-03-01 |
US20120045300A1 (en) | 2012-02-23 |
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