KR101363112B1 - 반사형 마스크의 제조 방법 및 반사형 마스크의 제조 장치 - Google Patents

반사형 마스크의 제조 방법 및 반사형 마스크의 제조 장치 Download PDF

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KR101363112B1
KR101363112B1 KR1020130030774A KR20130030774A KR101363112B1 KR 101363112 B1 KR101363112 B1 KR 101363112B1 KR 1020130030774 A KR1020130030774 A KR 1020130030774A KR 20130030774 A KR20130030774 A KR 20130030774A KR 101363112 B1 KR101363112 B1 KR 101363112B1
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South Korea
Prior art keywords
layer
gas
reflective
forming
capping layer
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Korean (ko)
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KR20130110050A (ko
Inventor
가츠히로 야마자키
겐스케 데무라
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시바우라 메카트로닉스 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • G03F1/24—Reflection masks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/80—Etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020130030774A 2012-03-28 2013-03-22 반사형 마스크의 제조 방법 및 반사형 마스크의 제조 장치 Active KR101363112B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012074905 2012-03-28
JPJP-P-2012-074905 2012-03-28
JPJP-P-2012-113788 2012-05-17
JP2012113788A JP5921953B2 (ja) 2012-03-28 2012-05-17 反射型マスクの製造方法、および反射型マスクの製造装置

Publications (2)

Publication Number Publication Date
KR20130110050A KR20130110050A (ko) 2013-10-08
KR101363112B1 true KR101363112B1 (ko) 2014-02-13

Family

ID=49235487

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KR1020130030774A Active KR101363112B1 (ko) 2012-03-28 2013-03-22 반사형 마스크의 제조 방법 및 반사형 마스크의 제조 장치

Country Status (4)

Country Link
US (2) US8999612B2 (enExample)
JP (1) JP5921953B2 (enExample)
KR (1) KR101363112B1 (enExample)
TW (1) TWI472872B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102109129B1 (ko) * 2013-07-02 2020-05-08 삼성전자주식회사 반사형 포토마스크 블랭크 및 반사형 포토마스크
US9341941B2 (en) * 2013-08-01 2016-05-17 Samsung Electronics Co., Ltd. Reflective photomask blank, reflective photomask, and integrated circuit device manufactured by using reflective photomask
CN106164771B (zh) 2014-03-11 2020-08-04 芝浦机械电子株式会社 反射型掩膜的清洗装置、及反射型掩膜的清洗方法
JP2019053229A (ja) 2017-09-15 2019-04-04 東芝メモリ株式会社 露光用マスクおよびその製造方法
US10802393B2 (en) * 2017-10-16 2020-10-13 Globalfoundries Inc. Extreme ultraviolet (EUV) lithography mask
US11086215B2 (en) * 2017-11-15 2021-08-10 Taiwan Semiconductor Manufacturing Co., Ltd. Extreme ultraviolet mask with reduced mask shadowing effect and method of manufacturing the same
US20190384156A1 (en) * 2018-06-13 2019-12-19 AGC Inc. Reflective mask blank, reflective mask, and method of manufacturing reflective mask blank
US11204545B2 (en) 2020-01-16 2021-12-21 Taiwan Semiconductor Manufacturing Co., Ltd. EUV photo masks and manufacturing method thereof
US11619875B2 (en) * 2020-06-29 2023-04-04 Taiwan Semiconductor Manufacturing Co., Ltd. EUV photo masks and manufacturing method thereof

Citations (3)

* Cited by examiner, † Cited by third party
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KR20030082819A (ko) * 2002-04-18 2003-10-23 삼성전자주식회사 반사 포토마스크, 반사 포토마스크의 제조방법 및 이를이용한 집적회로 제조방법
JP2007273668A (ja) * 2006-03-31 2007-10-18 Toppan Printing Co Ltd 反射型フォトマスクブランク及びその製造方法、反射型フォトマスク及びその製造方法、並びに、極端紫外光の露光方法
KR20100045392A (ko) * 2008-10-23 2010-05-03 호야 가부시키가이샤 마스크 블랭크용 기판의 제조 방법 및 반사형 마스크 블랭크의 제조 방법과 마스크 블랭크용 기판

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US20020121500A1 (en) * 2000-12-22 2002-09-05 Rao Annapragada Method of etching with NH3 and fluorine chemistries
JP2005191511A (ja) * 2003-12-02 2005-07-14 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
DE102004031079B4 (de) * 2004-06-22 2008-11-13 Qimonda Ag Verfahren zur Herstellung einer Reflexionsmaske
ATE482466T1 (de) * 2004-12-10 2010-10-15 Toppan Printing Co Ltd Reflektierender fotomaskenrohling, reflektierende fotomaske und verfahren zur herstellung von halbleiterbauelementen unter verwendung dieser
US7807579B2 (en) * 2007-04-19 2010-10-05 Applied Materials, Inc. Hydrogen ashing enhanced with water vapor and diluent gas
JP5269548B2 (ja) * 2008-10-31 2013-08-21 株式会社日立国際電気 基板処理装置及び基板処理装置の基板搬送方法
SG178435A1 (en) * 2009-08-25 2012-03-29 Silverbrook Res Pty Ltd Method of removing photoresist and etch-residues from vias
JP2011181657A (ja) 2010-03-01 2011-09-15 Dainippon Printing Co Ltd 反射型マスクおよびその修復方法
JP5521714B2 (ja) 2010-04-06 2014-06-18 凸版印刷株式会社 Ｅｕｖ用反射型マスク製造方法
JP5234047B2 (ja) * 2010-04-22 2013-07-10 富士通セミコンダクター株式会社 半導体装置の製造方法
US8764995B2 (en) * 2010-08-17 2014-07-01 Taiwan Semiconductor Manufacturing Company, Ltd. Extreme ultraviolet light (EUV) photomasks, and fabrication methods thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030082819A (ko) * 2002-04-18 2003-10-23 삼성전자주식회사 반사 포토마스크, 반사 포토마스크의 제조방법 및 이를이용한 집적회로 제조방법
JP2007273668A (ja) * 2006-03-31 2007-10-18 Toppan Printing Co Ltd 反射型フォトマスクブランク及びその製造方法、反射型フォトマスク及びその製造方法、並びに、極端紫外光の露光方法
KR20100045392A (ko) * 2008-10-23 2010-05-03 호야 가부시키가이샤 마스크 블랭크용 기판의 제조 방법 및 반사형 마스크 블랭크의 제조 방법과 마스크 블랭크용 기판

Also Published As

Publication number Publication date
US9513557B2 (en) 2016-12-06
JP5921953B2 (ja) 2016-05-24
US20130260292A1 (en) 2013-10-03
TWI472872B (zh) 2015-02-11
JP2013229537A (ja) 2013-11-07
KR20130110050A (ko) 2013-10-08
TW201348858A (zh) 2013-12-01
US8999612B2 (en) 2015-04-07
US20150177624A1 (en) 2015-06-25

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