KR101359045B1

KR101359045B1 - Vapor deposition mask, vapor deposition mask device, method of producing vapor deposition mask, method of producing vapor deposition mask device and method of producing sheet shape member for vapor deposition mask

Info

Publication number: KR101359045B1
Application number: KR1020080082293A
Authority: KR
Inventors: 가즈야 오가와
Original assignee: 다이니폰 인사츠 가부시키가이샤
Priority date: 2007-08-24
Filing date: 2008-08-22
Publication date: 2014-02-05
Also published as: JP4985227B2; TW200927962A; JP2009052072A; TWI433941B; KR20090021098A

Abstract

Provided is a method of making a deposition mask that produces a deposition mask that makes it possible to perform very high resolution patterning. In the manufacturing method of a vapor deposition mask, a hole is formed in a metal sheet by an etching. The metal sheet to be etched is supplied as a laminate supported on a resin sheet. After the etching, the resin sheet of the laminate is removed.

Deposition mask, sheet-shaped member, laminated body, supply core, removal apparatus

Description

A deposition mask, a deposition mask apparatus, a manufacturing method of a deposition mask, a manufacturing method of a deposition mask apparatus, and a manufacturing method of a sheet-shaped member for deposition masks DEPOSITION MASK DEVICE AND METHOD OF PRODUCING SHEET SHAPE MEMBER FOR VAPOR DEPOSITION MASK}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a deposition mask used to perform deposition in a desired pattern, and more particularly to a deposition mask capable of performing deposition in a pattern of very high resolution with high precision.

The present invention also relates to a deposition mask apparatus having a deposition mask used for depositing in a desired pattern, and in particular, a deposition mask apparatus having a deposition mask capable of precisely depositing a pattern with a very high resolution. It is about.

Furthermore, the present invention relates to a method of manufacturing a deposition mask used to perform deposition in a desired pattern, and more particularly, to a method of manufacturing a deposition mask that can accurately perform deposition in a pattern of very high resolution.

In addition, the present invention relates to a method for manufacturing a deposition mask apparatus having a deposition mask used to perform deposition in a desired pattern, in particular having a deposition mask capable of precisely depositing a pattern with a very high resolution. A method of manufacturing a deposition mask device.

Further, the present invention relates to a method for manufacturing a sheet-like member used for a deposition mask used for deposition in a desired pattern, and in particular, a deposition mask sheet capable of precisely performing deposition in a pattern having a very high resolution. The manufacturing method of a shape member is related.

Background Art Conventionally, a method of forming a thin film in a desired pattern by using a deposition mask including holes arranged in a desired pattern is known. In recent years, it is strongly desired to perform patterning with a very high resolution by vapor deposition, for example, in the case of depositing an organic material on a substrate at the time of manufacturing an organic EL display device.

In addition, such a deposition mask can generally be manufactured by forming a hole in a metal plate by etching using a photolithography technique (for example, JP 2004-39319A). Moreover, when forming a hole in a metal plate by etching, there exists a method of etching from the surface of both sides of a metal plate, and the method of only etching from the surface of one side of a metal plate.

However, in the case of using a deposition mask produced by etching, there is a problem in that deposition in a pattern of very high resolution cannot be performed with high accuracy. As a result of investigating and researching the cause of this problem, the inventors confirmed the following.

In etching using a photolithography technique, erosion is started from a region of the metal plate not covered with the resist film. Thereafter, the erosion does not proceed only in the thickness direction of the metal plate, but also in the direction along the plate surface of the metal plate. Therefore, a thin hole is formed by etching. For this reason, when etching is performed from the surface of both sides of the metal plate 2, as shown in FIG. 11, the cross-sectional area (open hole area) is smallest in the hole 2a except the edge part of the thickness direction of the metal plate 2 as shown in FIG. Losing protrusions 3 are formed. And when vapor deposition is performed using such a deposition mask 1, the film thickness of the vapor deposition film 5 deposited in the area | region corresponding to the back surface side of the protrusion part 3 of the board | substrate 4 is not stable. As a result, the edge part of a vapor deposition pattern is blurred (the outline of a vapor deposition pattern is not clear). In the first place, it is difficult to control the position and cross-sectional shape of the protrusion formed in the hole. From the above, when the metal plate is etched from the surfaces on both sides, deposition in a pattern of very high resolution cannot be performed with high accuracy.

On the other hand, in the case where the metal plate is etched only from the upper side surface, the etching liquid, which has already been used for erosion and the erosion ability is lowered, remains in the thin hole formed by erosion. Then, when the hole of a metal plate reaches the lower side surface, the etching liquid which remained in the hole up to that time flows out from the lower surface, and flows into the hole in which the fresh etching liquid with high erosion ability was formed. At this time, the liquid pressure increases in the lower region in the hole where the cross-sectional area (opening hole area) becomes small, and the lower region in the hole is violently eroded by the fresh etching liquid. As a result, protrusions are formed in the holes as in the case of etching from both sides of the metal plate.

In addition, when the metal plate 6 is etched only from the downward side surface through the resist film 7, as shown in FIG. 12, the hole 6a in which the edge formed by erosion penetrates through the metal plate 6 is shown. The etching liquid 8 may remain around the upper side hole in the lower surface. As a result, the metal plate is eroded from the upper side surface by the remaining etching solution, and protrusions are formed in the holes as in the case of etching from both sides of the metal plate.

From these, even when the metal plate is etched only from one side surface, the edge of the deposition pattern is blurred (the outline of the deposition pattern is not clear). In the beginning, when etching a metal plate from one surface side, the cross-sectional shape of a hole may be crushed by the pressure which arises when a hole penetrates and an etching liquid starts to flow in. In this case, it is difficult to form the hole with a desired shape with high accuracy. This phenomenon becomes more remarkable in the deposition mask for performing the high resolution patterning described above. In view of the above, even when the metal plate is etched only from one side surface, deposition in a pattern having a very high resolution cannot be performed with high accuracy.

Therefore, the present invention is based on these findings, and an object of the present invention is to provide a vapor deposition mask that enables patterning of very high resolution.

Moreover, an object of this invention is to provide the vapor deposition mask apparatus provided with the vapor deposition mask which makes it possible to perform the patterning of very high resolution.

Moreover, an object of this invention is to provide the manufacturing method of a deposition mask which manufactures a deposition mask which makes it possible to perform patterning of very high resolution.

Moreover, an object of this invention is to provide the manufacturing method of the deposition mask apparatus which manufactures the deposition mask apparatus provided with the deposition mask which makes it possible to perform patterning of very high resolution.

Moreover, an object of this invention is to provide the manufacturing method of the sheet-like member for deposition masks which manufactures the sheet-like member used for the deposition mask which makes it possible to perform patterning of very high resolution.

The manufacturing method of the vapor deposition mask which concerns on this invention forms the process of supplying the laminated body which has a resin sheet and the metal sheet laminated | stacked on the said resin sheet, and etchings the supplied laminated body, and forms many holes in a metal sheet. And a step of removing the resin sheet from the laminate after the etching step.

In the method of manufacturing a deposition mask according to the present invention, in the step of etching the laminate, a plurality of holes are arranged side by side in one direction, each of which extends in a different direction orthogonal to the one direction. May be formed. In the process of removing the said resin sheet of the manufacturing method of such a vapor deposition mask, you may make it isolate | separate the said metal sheet and the said resin sheet along the said other direction. Moreover, in the manufacturing method of such a vapor deposition mask, the said laminated body may be supplied along the said other direction.

Moreover, in the process of etching the said laminated body of the manufacturing method of the vapor deposition mask which concerns on this invention, two or more porous area | regions in which the some hole was arrange | positioned by the predetermined pattern are formed in a metal sheet, and it can be attached by multiple sides by this. The vapor deposition mask may be made.

Moreover, in the process of supplying the said laminated body of the manufacturing method of the vapor deposition mask by this invention, when the UV light is irradiated, the laminated body containing the resin sheet comprised so that the bonding force with respect to the said metal sheet may fall is supplied, and the said resin In the step of removing the first sheet, the resin sheet may be irradiated with UV light to separate the metal sheet and the resin sheet.

Moreover, in the process of supplying the said laminated body of the manufacturing method of the vapor deposition mask which concerns on this invention, you may make it supply the laminated body which unwinds the winding body which wound the said laminated body, and extends in strip shape.

The deposition mask according to the present invention is a deposition mask manufactured by any one of the above-described manufacturing methods, and gradually decreases in the cross-sectional area of the hole formed in the deposition mask from one side of the deposition mask to the other side. Features

In the deposition mask according to the present invention, in a cross section orthogonal to the sheet surface of the deposition mask, a straight line connecting an end portion on one side of the hole and an end portion on the other side of the hole and an angle formed by the other side May be 60 ° or less.

The deposition mask apparatus according to the present invention includes a deposition mask manufactured by any one of the above-described manufacturing methods, a frame fixed to the deposition mask, and the deposition mask toward the other surface from one side of the deposition mask. It is characterized by gradually decreasing the cross-sectional area of the formed hole.

In the vapor deposition mask apparatus according to the present invention, in a cross section orthogonal to the sheet surface of the vapor deposition mask, a straight line connecting an end portion on one side of the hole and an end portion on the other side of the hole and the other surface is formed. The angle may be 60 ° or less.

The manufacturing method of the vapor deposition mask apparatus which concerns on this invention is a manufacturing method of the vapor deposition mask apparatus provided with the vapor deposition mask, the vapor deposition mask, and the fixed frame, Comprising: It has a resin sheet and the metal sheet laminated | stacked on the said resin sheet. A step of supplying a laminate, a step of forming a plurality of holes in a metal sheet by etching the supplied laminate, a step of removing the resin sheet from the laminate after an etching step, and a metal sheet after an etching step It characterized in that it comprises a step of installing the frame in the.

In the manufacturing method of the vapor deposition mask apparatus by this invention, after removing the said resin sheet, you may make it perform the process of providing the said frame to the said metal sheet. Or in the manufacturing method of the vapor deposition mask apparatus by this invention, after the process of providing the said frame, the process of removing the said resin sheet may be performed.

In the step of etching the laminate in the method of manufacturing a deposition mask apparatus according to the present invention, a plurality of holes are arranged side by side in one direction, and a plurality of holes are formed, each extending in a different direction orthogonal to the one direction. It may be possible. In the process of removing the said resin sheet of the manufacturing method of such a vapor deposition mask apparatus, you may make the said metal sheet and the said resin sheet separate along the said other direction. Moreover, in the manufacturing method of such a vapor deposition mask apparatus, the said laminated body may be supplied along the said other direction.

Moreover, in the process of etching the said laminated body of the manufacturing method of the vapor deposition mask apparatus which concerns on this invention, the vapor deposition mask arrangement | positioning which a plurality of hole area | regions by which the several hole was arrange | positioned by a predetermined pattern is formed in a metal sheet, and by which it can attach to multiple surfaces May be prepared.

Furthermore, in the process of supplying the said laminated body of the manufacturing method of the vapor deposition mask apparatus by this invention, when the UV light is irradiated, the laminated body containing the resin sheet comprised so that the bonding force with respect to the said metal sheet may fall is supplied, In the step of removing the resin sheet, the adhesive layer may be irradiated with UV light to separate the metal sheet and the resin sheet.

Moreover, in the process of supplying the said laminated body of the manufacturing method of the vapor deposition mask apparatus which concerns on this invention, you may make it supply the laminated body which unwinds the winding body which wound the said laminated body, and extends in strip shape.

The manufacturing method of the sheet-shaped member for vapor deposition masks by this invention is a manufacturing method of the sheet-shaped member for vapor deposition masks which manufactures the sheet-shaped member used for the vapor deposition mask in which many holes were formed, The resin sheet and the said resin Supplying a laminate having a metal sheet laminated on the sheet, etching the supplied laminate to form a plurality of holes in the metal sheet, and removing the resin sheet from the laminate after the etching step It is characterized by having a process to.

In the process of etching the said laminated body of the manufacturing method of the sheet-like member for vapor deposition masks which concerns on this invention, it is a several hole arrange | positioned side by side along one direction, and the multiple which extends along the other direction orthogonal to the said one direction A hole may be formed. In the process of removing the said resin sheet of the manufacturing method of the sheet-like member for vapor deposition masks, you may make the said metal sheet and the said resin sheet separate along the said other direction. Moreover, in the manufacturing method of the sheet-like member for vapor deposition masks, the said laminated body may be supplied along the said other direction.

Moreover, in the process of etching the said laminated body of the manufacturing method of the sheet-like member for vapor deposition masks which concerns on this invention, a plurality of hole area | regions in which the several hole was arrange | positioned by a predetermined pattern are formed in a metal sheet, and it can be attached by multiple sides by this. The sheet-like member used for the deposition mask may be manufactured.

Moreover, in the process of supplying the said laminated body of the manufacturing method of the sheet-like member for vapor deposition masks which concerns on this invention, when a UV light is irradiated, the laminated body containing the resin sheet in which the bonding force with respect to the said metal sheet falls is supplied. In the step of removing the resin sheet, the adhesive layer may be irradiated with UV light to separate the metal sheet and the resin sheet.

Moreover, in the process of supplying the said laminated body of the manufacturing method of the sheet-like member for vapor deposition masks which concerns on this invention, you may make it supply the laminated body which unwinds the winding body which wound the said laminated body, and extends in strip shape.

According to the present invention, it is possible to obtain a vapor deposition mask in which the cross-sectional area is gradually decreased from one side to the other side and the shape on the other side is formed with high precision. Therefore, according to this vapor deposition mask, vapor deposition in a pattern of very high resolution can be performed with high accuracy.

Hereinafter, with reference to FIGS. 1-10, one Embodiment of the deposition mask, the deposition mask apparatus, the manufacturing method of a deposition mask, the manufacturing method of a deposition mask apparatus, and the manufacturing method of the sheet-shaped member for deposition masks by this invention is demonstrated. do. 1 to 10 are views for explaining an embodiment of the present invention. In addition, in the following embodiment, when manufacturing an organic electroluminescent display apparatus, the deposition mask (deposition metal mask), deposition mask apparatus, and manufacturing method of a deposition mask which are used for patterning an organic light emitting material on a glass substrate in a desired pattern. The manufacturing method of a vapor deposition mask apparatus and the sheet-like member for vapor deposition masks are demonstrated as an example. However, the present invention is not limited to such an application, and the present invention relates to a deposition mask (deposition metal mask), a deposition mask apparatus, a manufacturing method of a deposition mask, a manufacturing method of a deposition mask apparatus, and a sheet-shaped member for a deposition mask that are used for various purposes. The invention can be applied.

First, an example of a deposition mask and a deposition mask apparatus that can be manufactured by the method for manufacturing a deposition mask and the method for manufacturing a deposition mask apparatus according to the present invention will be mainly described with reference to FIGS. 1 to 5. 1 is a perspective view illustrating an example of a deposition mask and a deposition mask apparatus, and FIG. 2 is a view for explaining a method of using the deposition mask and the deposition mask apparatus.

1 to 4, the deposition mask apparatus 10 according to the present embodiment includes a deposition mask 20 made of a rectangular metal sheet and a frame 15 provided with a periphery of the deposition mask 20. ). The vapor deposition mask 20 is a metal sheet-like member in which a plurality of holes 25 (see Fig. 4) are formed. This vapor deposition mask apparatus 10 is supported in the vapor deposition apparatus 40 so that the vapor deposition mask 20 may face the glass substrate 42, as shown in FIG. In the vapor deposition apparatus 40, the crucible 44 which accommodates vapor deposition material (for example, organic light emitting material) 48 under the glass substrate 42 which sandwiched this vapor deposition mask apparatus 10, and the crucible The heater 46 which heats 44 is arrange | positioned. The deposition material 48 in the crucible 44 is vaporized or sublimed by heating from the heater 46 to adhere to the surface of the glass substrate 42. As described above, a plurality of holes 25 are formed in the deposition mask 20, and the deposition material 48 adheres to the glass substrate 42 through the holes 25. As a result, the deposition material 48 is deposited on the surface of the glass substrate 42 in a desired pattern corresponding to the position of the hole 25 of the deposition mask 20.

As shown in Fig. 1, in the present embodiment, the deposition mask 20 has an outline of a substantially rectangular shape when viewed in plan view, and an approximately rectangular shape when viewed in plan view. The deposition mask 20 includes a hole region 22 having a hole 25, and a hole-free region 23 that occupies an area surrounding the hole region 22 without the hole 25 being formed. Have As shown in Fig. 1, each of the perforation regions 22 has an outline of a substantially rectangular shape when viewed in a plane, and more precisely an approximately rectangular shape when viewed in a plane.

In the present embodiment, the plurality of hole regions 22 are disposed at predetermined intervals along one direction parallel to one side of the deposition mask 20 and at the same time along the other direction perpendicular to the one direction. It is placed. In this embodiment, one perforation region 22 corresponds to one organic EL display device. That is, according to the deposition mask apparatus 10 (deposition mask 20) shown in FIG. 1, multi-sided adhesion deposition is attained.

1 and 3, the plurality of holes 25 provided in each of the hole regions 22 are arranged side by side at equal intervals along the one direction in the hole region 22. In addition, each hole 25 extends thin and long from one end of the hole area 22 to the other end in parallel with the other direction orthogonal to the one direction. In addition, as shown in Fig. 4, each hole in the cross section along the sheet surface of the metal sheet 34 toward the other surface 20b from one surface 20a of the deposition mask 20 having a sheet shape. The cross-sectional area of 25 decreases gradually. 3 is a partial plan view showing the deposition mask 20 from one side 20a side, and FIG. 4 is a cross-sectional view taken along the line IV-IV of FIG.

However, as shown in FIG. 5, when the deposition mask apparatus 10 is accommodated in the deposition apparatus 40, the crucible 44 in which one side 20a of the deposition mask 20 holds the deposition material 48. ), And the other side 20b of the deposition mask 20 faces the glass substrate 42. That is, as shown in FIG. 5, the vapor deposition material 48 is attached to the glass substrate 42 through the hole 25 gradually decreasing in cross-sectional area. As shown in FIG. 5, the vapor deposition material 48 may not move linearly from the crucible 44 toward the glass substrate 42, but may also move obliquely with respect to the plate surface of the glass substrate 42. Under the present circumstances, if the cross-sectional shape of the hole 25 had the outline shown by the dotted line of FIG. 5, the vapor deposition material 48 which moves at an angle will adhere to the vapor deposition mask 20, and will not reach to the glass substrate 42. FIG.

That is, in order to save the expensive deposition material by increasing the utilization efficiency (deposition efficiency: the ratio of adhesion to the glass substrate 42) of the deposition material, the cross section orthogonal to the sheet surface of the deposition mask 20 (cross section in Fig. 5). WHEREIN: The straight line L which connects the edge part of the hole 25 by the side of one surface 20a, and the edge part of the hole 25 by the other surface 20b side, and the other surface 20b are formed. The smaller the angle θ, the better. However, the ratio of the vapor deposition material which moves toward the glass substrate 42 in small angle with respect to the repair line to the glass substrate 42 is small. And if the angle (theta) which the above-mentioned straight line L makes with respect to the other surface 20b is 60 degrees or less, the utilization efficiency of vapor deposition material will be sufficient value.

If the angle θ is made smaller, the wall surfaces of adjacent holes 25 are connected as shown by the dashed-dotted line in FIG. 5. However, in consideration of the strength of the deposition mask 20, it is preferable that the wall surfaces of the adjacent holes 25 are not connected to each other, and a flat surface of 5 µm or more between the adjacent holes 25 in one surface 20a. It is more preferable that this is formed.

That is, angle (theta) which the straight line L makes with respect to the other surface 20b is more than the angle by which the flat surface of 5 micrometers or more is formed between the holes 25 in one surface 20a, and it is 60 degrees C or less. desirable.

As described above, in the present embodiment, the holes 25 are arranged at equal intervals in each of the pore regions 22. As an example, when the deposition mask 20 (deposition mask device 10) is used to produce a display (about 2 to 3 inches) such as a mobile phone or a digital camera, the arrangement pitch P of the holes 25 is used. (See FIG. 4) can be about 8 micrometers (300 ppi) or more and about 254 micrometers (100 ppi) or less. In addition, when color display is to be performed, the deposition mask 20 (deposition mask apparatus 10) and the glass substrate 42 are moved relatively little along the arrangement direction (one direction described above) of the holes 25, The red organic light emitting material, the green organic light emitting material, and the blue organic light emitting material may be gradually deposited. In addition, when the vapor deposition mask 20 (deposition mask apparatus 10) is used for manufacturing the display of a mobile telephone, the width (slit width) W along the arrangement direction (one direction described above) of each hole 25 ) May be about 28 µm or more and 84 µm or less.

On the other hand, the frame 15 of the deposition mask apparatus 10 is provided at the periphery of the rectangular deposition mask 20. The frame 15 is kept attached with the deposition mask so that the deposition mask 20 does not bend. The deposition mask 20 and the frame 15 are fixed to each other by, for example, spot welding.

The vapor deposition mask apparatus 10 is maintained inside the vapor deposition apparatus 40 which becomes a high temperature atmosphere. Therefore, the deposition mask 20 and the frame 15 are preferably made of the same material having a low coefficient of thermal expansion in order to prevent warping of the deposition frame and generation of thermal stress. As such a material, 36% Ni Invar material can be used, for example.

Next, the manufacturing method of such a deposition mask 20 and the deposition mask apparatus 10 is demonstrated mainly using FIGS. 6-9. 6 is a view for explaining a method of manufacturing a deposition mask.

As shown in FIG. 6, the manufacturing method of the vapor deposition mask in this embodiment has the laminated body 30 which has the resin sheet 32 and the metal sheet 34 laminated | stacked on the resin sheet 32. As shown in FIG. A step of supplying, etching using a photolithography technique to the metal sheet 34 of the laminate 30 to form a plurality of holes 25 in the metal sheet 34, and the laminate after the etching process The process of removing the resin sheet 32 from 30 is included.

As shown in FIG. 6, in this embodiment, the winding body 29 of the laminated body which wound the laminated body 30 to the supply core 31 is prepared. Then, the supply core 31 is rotated to rewind the winding body 29, so that the laminate 30 extending in a band shape is supplied as shown in FIG. Here, the laminated body 30 is supplied so that the metal sheet 34 may be located below and the resin sheet 32 may be located above.

In addition, as described below, the metal sheet 34 of the laminate 30 forms a hole 25 to form the deposition mask 20. Therefore, as described above, the metal sheet 34 is made of, for example, 36% Ni invar. However, the present invention is not limited thereto, and a sheet made of stainless steel, copper, iron, and aluminum may be used as the metal sheet 34.

As the resin sheet 32, for example, a sheet made of polyethylene terephthalate or polypropylene having a thickness of about 50 µm to 150 µm can be used. In this embodiment, when the UV light is irradiated, the resin sheet 32 made so that the bonding force with respect to the metal sheet 34 may fall is used. Specifically, the resin sheet 32 has a base sheet 32a made of polyethylene terephthalate and a UV peeling layer 32b laminated on the base sheet 32a and facing the metal sheet 34. (See FIGS. 7 and 8).

Here, UV peeling layer 32b is a layer which has the adhesive force initially, and adhere | attaches the base material sheet 32a and the metal sheet 34, but when UV light is irradiated, the adhesive force of the irradiated part falls. For example, when UV light is irradiated, the irradiated part hardens | cures and the bonding force with respect to the metal sheet 34 falls. Such UV peeling layer 32b can be formed with an acrylic UV re-peelable adhesive, for example.

The supplied laminated body 30 is etched by the etching apparatus (etching means) 50. Specifically, first, a photosensitive resist material is applied onto the surface of the metal sheet 34 of the laminate 30 (on the lower surface of the sheet in FIG. 7), and then on the metal sheet 34. The resist film 36 is formed. Next, a glass photographic plate 37 in which light is not transmitted to a region to be removed in the resist film 36 is prepared, and the glass dry plate 37 is disposed on the resist film 36.

Thereafter, as shown in FIG. 7, the resist film 36 is exposed over the glass dry plate 37, and the resist film 36 is further developed. As described above, the resist pattern 36a is formed on the metal sheet 34 of the laminate 30.

In addition, the area | region facing the resist film 36 to be removed in the glass dry plate 37 may be made black, and visible light may be used as exposure light. In this case, since visible light is absorbed in the black portion, light does not enter the region to be removed of the resist film 36, and the resist film 36 does not fix on the metal sheet 34. On the other hand, light enters a region where the resist film 36 should not be removed, and the resist film 36 in the region is fixed on the metal sheet 34. The resist film 36 that is not fixed is removed by, for example, warm water washing.

Next, as shown in FIG. 8, the laminated body 30 is etched with the etching liquid (for example, ferric chloride solution) 38 using the resist pattern 36a formed on the metal sheet 34 as a mask. In the present embodiment, the etching liquid 38 is one surface 34a of the metal sheet 34 over the resist pattern 36a from the nozzle 51 of the etching apparatus 50 disposed below the laminated body 30 to be conveyed. Is sprayed toward). At this time, as shown by the dotted line in FIG. 8, erosion by the etching solution starts in the region of the metal sheet 34 not covered by the resist pattern 36a. Thereafter, erosion proceeds not only in the thickness direction of the metal sheet 34 but also in the direction along the sheet surface of the metal sheet 34. As described above, the erosion by the etching solution proceeds from one surface 34a to the other surface 34b of the metal sheet 34 to form a hole 25 penetrating the metal sheet 34.

Thereafter, the resist pattern 36a on the laminate 30 is removed, and the laminate 30 is washed with water. In this way, the sheet-shaped member 18 for vapor deposition masks which consists of the metal sheet 34 in which the many hole 25 was formed on the resin sheet 32 can be obtained.

By the way, if the resin sheet 32 was not provided, as described above, after the metal sheet 34 penetrated and the hole 25 was formed, the etching liquid was formed on the other surface 34b side of the metal sheet 34. This retention can cause problems such as unstable shape and size of the hole 25. However, according to this embodiment, even if the hole 25 which penetrates the metal sheet 34 is formed, the upper side of this hole 25 is covered with the resin sheet 32. As shown in FIG. Therefore, the problem which occurred in the conventional method can be reliably avoided. As a result, the metal sheet 34 erodes only from one side 34a side, and the cross-sectional area of the hole 25 formed in the metal sheet 34 is from one side 34a, 20a to the other side 34b, It gradually decreases toward 20b). Further, the hole 25 having a desired open hole area (the area of the hole 25 in plan view) can be formed with high accuracy.

Then, the laminated body 30 etched in this way is conveyed in the removal apparatus (removing means) 54 by the pair of conveying rollers 57 and 57 which rotate in the state which clamped the said laminated body 30. do. Moreover, the above-mentioned supply core 31 is rotated through the tension (tension force) which acts on the laminated body 30 by rotation of this conveyance roller 57, 57, and the laminated body 30 from the winding body 29 is carried out. Is to be supplied.

In addition, in this embodiment, the metal sheet 34 is supported and reinforced by the resin sheet 32. As shown in FIG. Therefore, between the hole 25 and the hole 25 of the metal sheet 34 is cut | disconnected by the stress which acts between the hole 25 and the hole 25 at the time of conveyance of the laminated body 30, or a hole ( The problem that the part which extends linearly between 25) and the hole 25, etc. can be suppressed especially. As a result, the problem of damaging the shape of the minute hole 25 formed in the metal sheet 34 in the etching process after that can be avoided.

In addition, when forming the hole 25 which extends thinly and elongate along the direction orthogonal to an arrangement direction as mentioned above, the direction in which the hole 25 extends (other directions mentioned above), and the laminated body 30 are supplied It is preferable that the direction (direction in which a laminated body is conveyed) to become substantially parallel. In this case, it is possible to effectively prevent the portion between the hole 25 and the hole 25 of the metal sheet 34 being cut off, or the portion that extends linearly between the hole 25 and the hole 25 be wound. .

As shown in FIG. 9, the removal apparatus 54 in this embodiment has UV light irradiation means 55 provided in the downstream of the conveyance roller 57. As shown in FIG. UV light irradiation means 55 is provided along the movement path of the laminated body 30, the shade 55a which covers the laminated body 30 from the resin sheet 32 side, and UV arrange | positioned in the shade 55a It has the light source 55b. And UV light is irradiated from the resin sheet 32 side, and the laminated body 30 conveyed is vapor-deposited with the base sheet 32a by UV light which permeates the base sheet 32a of the resin sheet 32 The adhesive force of the UV peeling layer 32b which adheres the mask 20 (metal sheet 34) is significantly weakened. As a result, the resin sheet 32 constituting the laminate 30 and the metal sheet 34 (deposition mask 20) can be separated, and as shown in FIG. 9, the resin sheet 32 is made of a metal sheet. It peels from 34 and winds around the winding core 58. As shown in FIG.

Moreover, it is preferable that the direction which peels the resin sheet 32 from the metal sheet 34 is parallel to the direction (other directions mentioned above) in which the hole 25 formed in the metal sheet 34 extends. When the resin sheet 32 is separated from the metal sheet 34 in this direction, the hole 25 and the hole 25 of the metal sheet 34 are cut off, or the hole 25 and the hole ( 25) It is possible to effectively prevent the portion extending in a linear shape between the winding.

Thus, the metal sheet 34 in which the many holes 25 were formed is obtained, and it is cut | disconnected to predetermined length by the cutting device (cutting means) 59, and the sheet-shaped vapor deposition mask 20 is carried out. ) Can be obtained. And the vapor deposition mask apparatus 10 can be obtained by providing the frame 15 with respect to each vapor deposition mask 20. The frame 15 may be provided on one surface 20a of the deposition mask 20 or may be provided on the other surface 20b of the deposition mask 20.

As described above, according to the present embodiment, the treatment is performed on the metal sheet 34 laminated on the resin sheet 32. Therefore, the metal sheet 34 can be etched only from one side 34a side, and the hole 25 which penetrates the metal sheet 34 can be formed. In this case, although the hole 25 penetrates the metal sheet 34, the edge part of the hole 25 located in the other surface 34b side of the metal sheet 34 is covered with the resin sheet 32. As shown in FIG. . That is, since the hole 25 does not penetrate the laminated body 30, the above-mentioned conventional problem can be avoided, and a cross-sectional area becomes small gradually from one side 20a to the other side 20b by this. The deposition mask 20 in which the thin hole 25 was formed can be obtained. In addition, the deposition mask 20 which is opened in a high resolution pattern can be manufactured with high precision. According to such a deposition mask 20, vapor deposition in a pattern of high resolution can be performed with high precision.

Therefore, the deposition mask 20 thus obtained is a deposition mask (deposition metal mask) used for patterning, for example, an organic light emitting material on the glass substrate 42 in a desired pattern when manufacturing an organic EL display device. Very suitable for

Moreover, according to this embodiment, the tension (tensile force) which acts on the metal sheet 34 among the laminated bodies 30 at the time of conveyance after forming the hole 25 is remarkably reduced, and the hole of the metal sheet 34 is carried out. Generation of a stress acting to cut between the 25 and the hole 25, and a stress acting to wind the portion extending linearly between the hole 25 and the hole 25 of the metal sheet 34 Can be significantly reduced. Therefore, the hole formed in the vapor deposition mask 20 with high precision can be prevented from being damaged in the subsequent process.

Moreover, according to this embodiment, in the process of supplying the laminated body 30, the winding body 29 which wound the laminated body 30 is rewound, and the laminated body 30 extended in strip shape is supplied. Such a winding body 29 can be obtained inexpensively, and the convenience of handling is very good.

In addition, with respect to the above-described embodiment, various modifications are possible within the scope of the gist of the present invention. Hereinafter, an example of a modification is demonstrated.

In the above-mentioned embodiment, although the resin sheet 32 was irradiated with UV light and the example which removes the resin sheet 32 from the laminated body 30 was shown, the removal method of the resin sheet 32 is the same. It is not limited. For example, even if the laminated body 30 is sent to a heating furnace (removal means), the resin sheet 32 of the laminated body 30 is combusted and the resin sheet 32 is removed from the laminated body 30. good. When the resin sheet 32 is burned and removed, the metal sheet is not affected by the holes 25 formed in the metal sheet 34 (deposition mask 20) by a simple method using a simple device. The resin sheet 32 can be separated from the 34. In addition, when burning and removing the resin sheet 32, it is not necessary to use the resin sheet 32 comprised so that the bonding force to the metal sheet 34 may fall by irradiating UV light.

Moreover, in embodiment mentioned above, although the example which prepares and supplies the laminated body 30 which the resin sheet 32 and the metal sheet 34 laminated | stacked previously was shown, it is not limited to this. For example, while supplying the metal sheet 34 extending in a strip shape and supplying the resin sheet 32 extending in a strip shape, the supplied metal sheet 34 and the resin sheet 32 are bonded to each other. The laminated body 30 may be produced and the process mentioned above may be performed with respect to the laminated body 30 which is manufactured one by one. Alternatively, the sheet-like resin sheet 32 is laminated on the metal sheet 34 supplied at the same time as the metal sheet 34 extending in a band shape, and the sheet-shaped resin is formed in the metal sheet 34. You may make it perform the process mentioned above about the part (laminated body 30) which laminated | stacked the sheet | seat 32. Alternatively, the sheet-like metal sheet 34 is laminated on the resin sheet 32 supplied at the same time as the metal sheet 32 extending in a strip shape, and the sheet is laminated on the resin sheet 34. You may make it perform the process mentioned above about the part (laminated body 30) which laminated | stacked the metal sheet 34 of a shape sequentially.

Moreover, in embodiment mentioned above, after forming the hole 25 in the metal sheet 34, and isolate | separating the resin sheet 32 from the metal sheet 34, the metal sheet 34 is cut off ( Although the example which cuts to predetermined length was shown by 59, it is not limited to this. For example, the step of cutting the metal sheet 34 may be performed before the hole 25 is formed in the metal sheet 34, and the resin sheet 34 is formed after the hole 25 is formed. You may perform before the sheet | seat 32 is isolate | separated from the metal sheet | seat 34. FIG. When the metal sheet 34 is cut to a predetermined length before the resin sheet 32 is separated from the metal sheet 34, the laminate 30 is half-cut to such an extent that the resin sheet 32 is not completely cut. Only the metal sheet 34 may be cut off, or the whole laminate 30 including the metal sheet 34 may be cut to a predetermined length. In addition, you may etch so that the metal sheet 34 may be cut to predetermined length during the process of forming the hole 25 by etching. That is, when the hole 25 is formed by etching, the metal sheet 34 may be separated into a predetermined length by etching. In this case, the trouble of separately cutting the metal sheet 34 to a predetermined length can be omitted, and the deposition mask 20 can be manufactured at low cost with high production efficiency.

In addition, although the example which cut | disconnected the vapor deposition mask 20 to predetermined length was shown in embodiment mentioned above, it is not limited to this. The metal sheet 34 on which the plurality of holes 25 are formed may be treated as the sheet-shaped member 18 for a deposition mask without cutting. For example, as shown in FIG. 10, the winding-shaped core 19 is wound up without cutting the sheet-shaped member 18 for deposition masks which consists of the metal sheet 34 with many holes 25 formed, You may make it handle as a winding body 18a of the sheet-shaped member 18 for vapor deposition masks (shipment etc.). In addition, the sheet-shaped member 18 for vapor deposition masks is also a protection target of this case.

In addition, although the example which provided the frame 15 with respect to the vapor deposition mask 20 cut | disconnected to predetermined length was shown in embodiment mentioned above, it is not limited to this. For example, the frame 15 may be provided for the metal sheet 34 after the resin sheet 34 is removed and before being cut into a predetermined length. Alternatively, the frame 15 may be provided for the metal sheet 34 after the holes 25 are formed and before the resin sheet 34 is removed.

1 shows an embodiment of a deposition mask and a deposition mask apparatus according to the present invention;

FIG. 2 is a view for explaining a deposition method using the deposition mask and the deposition mask apparatus shown in FIG.

Fig. 3 is a partial plan view showing the deposition mask shown in Fig. 1;

4 is a cross-sectional view taken along a line IV-IV of FIG. 3;

5 is a view for explaining the operation of the deposition mask.

6 is a view for explaining an embodiment of a method for manufacturing a deposition mask and a method for manufacturing a deposition mask apparatus according to the present invention.

7 is a view for explaining a method of forming a resist pattern on a laminate (metal sheet).

8 is a view for explaining a method of etching a laminate (metal sheet).

9 is a view for explaining a method of removing a resin sheet from a laminate.

FIG. 10 is a view corresponding to FIG. 6, illustrating a method for manufacturing a sheet-like member for a deposition mask. FIG.

FIG. 11 is a view corresponding to FIG. 5, illustrating a deposition method using a deposition mask made of a metal plate etched from both sides. FIG.

FIG. 12 is a view corresponding to FIG. 8 for explaining a method of manufacturing a deposition mask by etching a metal plate from a lower side; FIG.

10: deposition mask apparatus

18: sheet-shaped member

20: deposition mask

30: laminate

31: supply core

32: resin sheet

34 metal sheet

38 etching solution

42: glass substrate

44: crucible

46: heater

48: deposition material

50: etching apparatus

51: nozzle

54: removal device

57: conveying roller

Claims

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Supplying a laminate having a resin sheet and a metal sheet laminated on the resin sheet;

Etching a laminated body to be supplied to form a plurality of holes in the metal sheet;

And removing the resin sheet from the laminate after the etching step,

In the step of etching the laminate, a plurality of holes are arranged side by side along one direction and a plurality of holes each extending in a different direction orthogonal to the one direction is formed,

In the step of removing the resin sheet, the metal sheet and the resin sheet are separated along the other direction.

And removing the resin sheet from the laminate after the etching step,

And the laminate is supplied along the other direction.

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And removing the resin sheet from the laminate after the etching step,

In the step of supplying the laminate, when the UV light is irradiated, a laminate comprising a resin sheet made to decrease the bonding force to the metal sheet is supplied,

In the step of removing the resin sheet, the resin sheet is irradiated with UV light to separate the metal sheet and the resin sheet.

And removing the resin sheet from the laminate after the etching step,

The manufacturing method of the vapor deposition mask characterized by the above-mentioned. The process of supplying the said laminated body WHEREIN: The laminated body which unwinds the winding body which wound the said laminated body, and extends in strip shape is supplied.

Supplying a laminate having a resin sheet and a metal sheet laminated on the resin sheet; etching the supplied laminate to form a plurality of holes in the metal sheet; and after the etching step, the laminate Deposition mask manufactured by a manufacturing method comprising a step of removing the resin sheet from

The cross-sectional area of the hole formed in the deposition mask gradually decreases from one side of the deposition mask to the other side,

In the cross section orthogonal to the sheet surface of a vapor deposition mask, the angle formed by the straight line which connects the edge part of the said one surface side of the said hole, and the edge part of the said other surface side, and the said other surface is 60 degrees or less, The vapor deposition characterized by the above-mentioned. Mask.

Supplying a laminate having a resin sheet and a metal sheet laminated on the resin sheet; etching the supplied laminate to form a plurality of holes in the metal sheet; and after the etching step, the laminate A deposition mask manufactured by a manufacturing method comprising a step of removing the resin sheet from

A frame fixed to the deposition mask,

In the cross section orthogonal to the sheet surface of a vapor deposition mask, the angle formed by the straight line which connects the edge part of the said one surface side of the said hole, and the edge part of the said other surface side, and the said other surface is 60 degrees or less, The vapor deposition characterized by the above-mentioned. Mask device.

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In the manufacturing method of the deposition mask apparatus provided with the deposition mask and the deposition mask and the fixed frame,

Removing the resin sheet from the laminate after the etching step;

And a step of providing the frame to the metal sheet after the etching step.

12. The method of manufacturing a deposition mask apparatus according to claim 11, wherein after removing the resin sheet, a step of attaching the frame to the metal sheet is performed.

The method of manufacturing a deposition mask apparatus according to claim 11, wherein after the step of installing the frame, a step of removing the resin sheet is performed.

The method of claim 11, wherein in the step of etching the laminate, a plurality of holes are arranged side by side along one direction, and a plurality of holes are formed, each extending in a different direction orthogonal to the one direction. Method of manufacturing a mask device.

The method of manufacturing a deposition mask apparatus according to claim 14, wherein in the step of removing the resin sheet, the metal sheet and the resin sheet are separated along the other direction.

15. The method of claim 14, wherein the laminate is supplied along the other direction.

12. The method of claim 11, wherein in the step of etching the laminate, a plurality of hole regions in which a plurality of holes are arranged in a predetermined pattern are formed in the metal sheet, whereby a deposition mask arrangement that can be attached to a multi-side is produced. The manufacturing method of the vapor deposition mask apparatus.

The laminate according to claim 11, wherein, in the step of supplying the laminate, a laminate including a resin sheet formed so that the bonding force to the metal sheet is lowered when UV light is irradiated,

In the step of removing the resin sheet, the adhesive layer is irradiated with UV light to separate the metal sheet and the resin sheet.

The manufacturing method of the vapor deposition mask apparatus of Claim 11 which supplies the laminated body which unwinds the winding body which wound the said laminated body, and extends in strip shape in the process of supplying the said laminated body.

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In the manufacturing method of the sheet-like member for deposition masks which manufactures the sheet-like member used for the deposition mask in which the many hole was formed,

And removing the resin sheet from the laminate after the etching step,

In the process of removing the said resin sheet, the said metal sheet and the said resin sheet isolate | separate along the said other direction, The manufacturing method of the sheet-like member for vapor deposition masks characterized by the above-mentioned.

And removing the resin sheet from the laminate after the etching step,

The laminated body is supplied along the said other direction, The manufacturing method of the sheet-like member for deposition masks characterized by the above-mentioned.

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And removing the resin sheet from the laminate after the etching step,

In the process of supplying the said laminated body, the manufacturing method of the sheet-like member for vapor deposition masks which supplies the laminated body which unwinds the winding body which wound the said laminated body, and extends in strip shape.

The process of etching the said laminated body WHEREIN: In the process of etching the said laminated body, the several hole area | region in which the several hole was arrange | positioned in a predetermined pattern is formed in the metal sheet, And thereby a multi-layer attachable deposition mask is produced.

27. A process according to any one of claims 22, 23, 25, and 26, wherein in the step of etching the laminate, a plurality of hole regions in which a plurality of holes are arranged in a predetermined pattern are formed in the metal sheet. The sheet-like member used for the multi-sided deposition mask is manufactured by this, The manufacturing method of the sheet-like member for deposition masks characterized by the above-mentioned.